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OMAP3530ECUSA

Texas Instruments Embedded Controllers & Processors
  • 参考价格：￥357.56-￥378.53

更新日期：2024-04-01

OMAP3530ECUSA

Texas Instruments Embedded Controllers & Processors

产品简介：应用处理器

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  • 参考价格：￥357.56-￥378.53

OMAP3530ECUSA 供应商

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OMAP3530ECUSA 中文资料属性参数

  • 制造商：Texas Instruments
  • 产品种类：处理器 - 专门应用
  • 类型：Applications Processor
  • 工作电源电压：- 0.5 V to + 1.6 V
  • 最大工作温度：+ 70 C
  • 安装风格：SMD/SMT
  • 封装 / 箱体：FCBGA-423
  • 核心：ARM Cortex A8
  • 数据总线宽度：32 bit
  • 接口类型：I2C, SPI, UART, USB
  • 最大时钟频率：720 MHz
  • 工作温度范围：0 C to + 70 C
  • 处理器系列：OMAP3530
  • 程序存储器大小：64 KB
  • 程序存储器类型：112 KB
  • 工厂包装数量：90

产品特性

  • OMAP3530 and OMAP3525 Devices: OMAP™ 3 Architecture MPU Subsystem Up to 720-MHz ARM® Cortex™-A8 Core NEON™ SIMD Coprocessor High-Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem Up to 520-MHz TMS320C64x+™ DSP Core Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels) Video Hardware Accelerators PowerVR® SGX™ Graphics Accelerator (OMAP3530 Device Only) Tile-Based Architecture Delivering up to 10 MPoly/sec Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0 Fine-Grained Task Switching, Load Balancing, and Power Management Programmable High-Quality Image Anti-Aliasing Fully Software-Compatible with C64x and ARM9™ Commercial and Extended Temperature Grades
  • OMAP™ 3 Architecture
  • MPU Subsystem Up to 720-MHz ARM® Cortex™-A8 Core NEON™ SIMD Coprocessor
  • Up to 720-MHz ARM® Cortex™-A8 Core
  • NEON™ SIMD Coprocessor
  • High-Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem Up to 520-MHz TMS320C64x+™ DSP Core Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels) Video Hardware Accelerators
  • Up to 520-MHz TMS320C64x+™ DSP Core
  • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
  • Video Hardware Accelerators
  • PowerVR® SGX™ Graphics Accelerator (OMAP3530 Device Only) Tile-Based Architecture Delivering up to 10 MPoly/sec Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0 Fine-Grained Task Switching, Load Balancing, and Power Management Programmable High-Quality Image Anti-Aliasing
  • Tile-Based Architecture Delivering up to 10 MPoly/sec
  • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  • Fine-Grained Task Switching, Load Balancing, and Power Management
  • Programmable High-Quality Image Anti-Aliasing
  • Fully Software-Compatible with C64x and ARM9™
  • Commercial and Extended Temperature Grades
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+ DSP Core Eight Highly Independent Functional Units Six ALUs (32- and 40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle Load-Store Architecture with Nonaligned Support 64 32-Bit General-Purpose Registers Instruction Packing Reduces Code Size All Instructions Conditional Additional C64x+ Enhancements Protected Mode Operation Exceptions Support for Error Detection and Program Redirection Hardware Support for Modulo Loop Operation
  • Eight Highly Independent Functional Units Six ALUs (32- and 40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
  • Six ALUs (32- and 40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
  • Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
  • Load-Store Architecture with Nonaligned Support
  • 64 32-Bit General-Purpose Registers
  • Instruction Packing Reduces Code Size
  • All Instructions Conditional
  • Additional C64x+ Enhancements Protected Mode Operation Exceptions Support for Error Detection and Program Redirection Hardware Support for Modulo Loop Operation
  • Protected Mode Operation
  • Exceptions Support for Error Detection and Program Redirection
  • Hardware Support for Modulo Loop Operation
  • C64x+ L1 and L2 Memory Architecture 32KB of L1P Program RAM and Cache (Direct Mapped) 80KB of L1D Data RAM and Cache (2-Way Set-Associative) 64KB of L2 Unified Mapped RAM and Cache (4-Way Set-Associative) 32KB of L2 Shared SRAM and 16KB of L2 ROM
  • 32KB of L1P Program RAM and Cache (Direct Mapped)
  • 80KB of L1D Data RAM and Cache (2-Way Set-Associative)
  • 64KB of L2 Unified Mapped RAM and Cache (4-Way Set-Associative)
  • 32KB of L2 Shared SRAM and 16KB of L2 ROM
  • C64x+ Instruction Set Features Byte-Addressable (8-, 16-, 32-, and 64-Bit Data) 8-Bit Overflow Protection Bit Field Extract, Set, Clear Normalization, Saturation, Bit-Counting Compact 16-Bit Instructions Additional Instructions to Support Complex Multiplies
  • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
  • 8-Bit Overflow Protection
  • Bit Field Extract, Set, Clear
  • Normalization, Saturation, Bit-Counting
  • Compact 16-Bit Instructions
  • Additional Instructions to Support Complex Multiplies
  • ARM Cortex-A8 Core ARMv7 Architecture TrustZone® Thumb®-2 MMU Enhancements In-Order, Dual-Issue, Superscalar Microprocessor Core NEON Multimedia Architecture Over 2x Performance of ARMv6 SIMD Supports Both Integer and Floating-Point SIMD Jazelle® RCT Execution Environment Architecture Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
  • ARMv7 Architecture TrustZone® Thumb®-2 MMU Enhancements
  • TrustZone®
  • Thumb®-2
  • MMU Enhancements
  • In-Order, Dual-Issue, Superscalar Microprocessor Core
  • NEON Multimedia Architecture
  • Over 2x Performance of ARMv6 SIMD
  • Supports Both Integer and Floating-Point SIMD
  • Jazelle® RCT Execution Environment Architecture
  • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
  • Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
  • ARM Cortex-A8 Memory Architecture: 16-KB Instruction Cache (4-Way Set-Associative) 16-KB Data Cache (4-Way Set-Associative) 256-KB L2 Cache
  • 16-KB Instruction Cache (4-Way Set-Associative)
  • 16-KB Data Cache (4-Way Set-Associative)
  • 256-KB L2 Cache
  • 112KB of ROM
  • 64KB of Shared SRAM
  • Endianess: ARM Instructions – Little Endian ARM Data – Configurable DSP Instruction and Data - Little Endian
  • ARM Instructions – Little Endian
  • ARM Data – Configurable
  • DSP Instruction and Data - Little Endian
  • External Memory Interfaces: SDRAM Controller (SDRC) 16- and 32-Bit Memory Controller with 1GB of Total Address Space Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM SDRAM Memory Scheduler (SMS) and Rotation Engine General Purpose Memory Controller (GPMC) 16-Bit-Wide Multiplexed Address and Data Bus Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth) Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
  • SDRAM Controller (SDRC) 16- and 32-Bit Memory Controller with 1GB of Total Address Space Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM SDRAM Memory Scheduler (SMS) and Rotation Engine
  • 16- and 32-Bit Memory Controller with 1GB of Total Address Space
  • Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM
  • SDRAM Memory Scheduler (SMS) and Rotation Engine
  • General Purpose Memory Controller (GPMC) 16-Bit-Wide Multiplexed Address and Data Bus Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth) Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
  • 16-Bit-Wide Multiplexed Address and Data Bus
  • Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
  • Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
  • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
  • Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
  • System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
  • Camera Image Signal Processor (ISP) CCD and CMOS Imager Interface Memory Data Input BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface Glueless Interface to Common Video Decoders Resize Engine Resize Images From 1/4x to 4x Separate Horizontal and Vertical Control
  • CCD and CMOS Imager Interface
  • Memory Data Input
  • BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
  • Glueless Interface to Common Video Decoders
  • Resize Engine Resize Images From 1/4x to 4x Separate Horizontal and Vertical Control
  • Resize Images From 1/4x to 4x
  • Separate Horizontal and Vertical Control
  • Display Subsystem Parallel Digital Output Up to 24-Bit RGB HD Maximum Resolution Supports Up to 2 LCD Panels Support for Remote Frame Buffer Interface (RFBI) LCD Panels 2 10-Bit Digital-to-Analog Converters (DACs) Supporting: Composite NTSC and PAL Video Luma and Chroma Separate Video (S-Video) Rotation 90-, 180-, and 270-Degrees Resize Images From 1/4x to 8x Color Space Converter 8-Bit Alpha Blending
  • Parallel Digital Output Up to 24-Bit RGB HD Maximum Resolution Supports Up to 2 LCD Panels Support for Remote Frame Buffer Interface (RFBI) LCD Panels
  • Up to 24-Bit RGB
  • HD Maximum Resolution
  • Supports Up to 2 LCD Panels
  • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
  • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting: Composite NTSC and PAL Video Luma and Chroma Separate Video (S-Video)
  • Composite NTSC and PAL Video
  • Luma and Chroma Separate Video (S-Video)
  • Rotation 90-, 180-, and 270-Degrees
  • Resize Images From 1/4x to 8x
  • Color Space Converter
  • 8-Bit Alpha Blending
  • Serial Communication 5 Multichannel Buffered Serial Ports (McBSPs) 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5) 5-KB Transmit and Receive Buffer (McBSP2) SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations Direct Interface to I2S and PCM Device and TDM Buses 128-Channel Transmit and Receive Mode Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface) High-, Full-, and Low-Speed Multiport USB Host Subsystem 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface Supports Transceiverless Link Logic (TLL) One HDQ™/1-Wire® Interface Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes) Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
  • 5 Multichannel Buffered Serial Ports (McBSPs) 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5) 5-KB Transmit and Receive Buffer (McBSP2) SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations Direct Interface to I2S and PCM Device and TDM Buses 128-Channel Transmit and Receive Mode
  • 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
  • 5-KB Transmit and Receive Buffer (McBSP2)
  • SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
  • Direct Interface to I2S and PCM Device and TDM Buses
  • 128-Channel Transmit and Receive Mode
  • Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
  • High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
  • High-, Full-, and Low-Speed Multiport USB Host Subsystem 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface Supports Transceiverless Link Logic (TLL)
  • 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
  • Supports Transceiverless Link Logic (TLL)
  • One HDQ™/1-Wire® Interface
  • Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
  • Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
  • Removable Media Interfaces: Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
  • Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
  • Comprehensive Power, Reset, and Clock Management SmartReflex™ Technology Dynamic Voltage and Frequency Scaling (DVFS)
  • SmartReflex™ Technology
  • Dynamic Voltage and Frequency Scaling (DVFS)
  • Test Interfaces IEEE 1149.1 (JTAG) Boundary-Scan Compatible ETM Interface Serial Data Transport Interface (SDTI)
  • IEEE 1149.1 (JTAG) Boundary-Scan Compatible
  • ETM Interface
  • Serial Data Transport Interface (SDTI)
  • 12 32-Bit General-Purpose Timers
  • 2 32-Bit Watchdog Timers
  • 1 32-Bit 32-kHz Sync Timer
  • Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • 65-nm CMOS Technologies
  • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
  • Discrete Memory Interface (Not Available in CBC Package)
  • Packages: 515-pin s-PBGA Package (CBB Suffix), .5-mm Ball Pitch (Top), .4-mm Ball Pitch (Bottom) 515-pin s-PBGA Package (CBC Suffix), .65-mm Ball Pitch (Top), .5-mm Ball Pitch (Bottom) 423-pin s-PBGA Package (CUS Suffix), .65-mm Ball Pitch
  • 515-pin s-PBGA Package (CBB Suffix), .5-mm Ball Pitch (Top), .4-mm Ball Pitch (Bottom)
  • 515-pin s-PBGA Package (CBC Suffix), .65-mm Ball Pitch (Top), .5-mm Ball Pitch (Bottom)
  • 423-pin s-PBGA Package (CUS Suffix), .65-mm Ball Pitch
  • 1.8-V I/O and 3.0-V (MMC1 Only), 0.985-V to 1.35-V Adaptive Processor Core Voltage 0.985-V to 1.35-V Adaptive Core Logic Voltage Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.

产品概述

OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture.The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:The device supports high-level operating systems (HLOSs), such as:This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.The following subsystems are part of the device:The device also offers:OMAP3530 and OMAP3525 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).This data manual presents the electrical and mechanical specifications for the OMAP3530 and OMAP3525 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP3530 and OMAP3525 applications processors unless otherwise indicated. This data manual consists of the following sections:
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