News and Events Feed by Topic

CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging

Joy Antwi — Thu, 21 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry. The expected recipients are Absolics Inc. in Georgia, Applied Materials Inc. in California, and Arizona State University in Arizona.

Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries to Strengthen Essential Chip Supply for Key U.S. Industries Including Auto and Defense

Joy Antwi — Wed, 20 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded GlobalFoundries (GF) up to $1.5 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina

Joy Antwi — Tue, 19 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.

Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology

Joy Antwi — Fri, 15 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology

Joy Antwi — Wed, 13 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act. President Biden signed the bipartisan CHIPS and Science Act to usher in a new era of semiconductor manufacturing in the United States and advance U.S. economic and national security.

Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency

Joy Antwi — Fri, 08 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide Corning up to $32 million in proposed direct funding and Powerex up to $3 million in proposed direct funding. President Biden and Vice President Harris signed the bipartisan CHIPS and Science Act to usher in a new era of semiconductor manufacturing in the United States, bringing with it a revitalized domestic supply chain, good-paying jobs, and investments in the industries of the future.

Biden-Harris Administration Announces Sunnyvale, CA as Expected Location for Second CHIPS for America R&D Flagship Facility

Joy Antwi — Fri, 01 Nov 2024 12:00:00 +0000

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the expected location for the CHIPS for America Design and Collaboration Facility (DCF), an NSTC Facility. The DCF will play an important role in advancing semiconductor design research, workforce development, investment, and collaboration across the entire semiconductor value chain.

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the first CHIPS for America R&D Flagship Facility and Planned Site for the estimated $825 Million CHIPS for America EUV Accelerator

Joy Antwi — Thu, 31 Oct 2024 12:00:00 +0000

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.

Biden-Harris Administration Opens $100 million Competition to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

Joy Antwi — Wed, 30 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI) and autonomous experimentation (AE) technologies to support the long-term viability of next-generation semiconductor manufacturing. The CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) funding opportunity will be critical in meeting the industry’s technology, economic, and sustainability goals.

CHIPS R&D CARISSMA Program Proposers' Day

Joy Antwi — Fri, 15 Nov 2024 00:00:00 -0500

Logistics When: Friday, November 15, 2024 What: Hybrid meeting for potential applicants to the CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Notice of Funding Opportunity (NOFO) Where: In-person

Biden-Harris Administration Announces Preliminary Terms with Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon

Joy Antwi — Mon, 21 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $325 million in proposed direct funding under the CHIPS and Science Act to solidify U.S. leadership in semiconductor-grade polysilicon production.

Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

Joy Antwi — Fri, 18 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies.

Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security

Joy Antwi — Thu, 17 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.

Biden-Harris Administration Announces Preliminary Terms with Wolfspeed to Solidify U.S. Technological Leadership in Silicon Carbide Manufacturing

Joy Antwi — Tue, 15 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and Science Act.

NIST Hosts Industry Meeting on Advanced Technologies and Use Cases for High-performance Industrial Wireless Systems

Rachel Kotary — Sun, 01 Sep 2024 12:00:00 +0000

The NIST Industrial Wireless Systems team held an industry meeting on September 12, 2024, to facilitate discussions on “Advanced Technologies and Use Cases for High-performance Industrial Wireless Systems.” The NIST Industrial Wireless Systems

NIST Industrial Wireless Systems Team Member Presents on Real-time and Mission-critical Wireless Systems

Rachel Kotary — Sun, 01 Sep 2024 12:00:00 +0000

NIST Industrial Wireless Systems team member Mohamed Kashef (Hany) presented on real-time and mission-critical wireless systems in an invited panel session at AraFest’24 on August 27, 2024. Dr. Hany provided opening remarks on “Industrial Wireless

NIST Industrial Wireless Team Publishes Report on OFDMA Uplink Activation

Rachel Kotary — Sun, 01 Sep 2024 12:00:00 +0000

Karl Montgomery and Rick Candell of the NIST Industrial Wireless Team have produced a report titled “A Characterization of OFDMA Uplink Activation for Industrial Applications” ( NIST IR 8506 ) which presents findings on Orthogonal Frequency-Division

NIST Releases New Version of SimPROCESD Software for Discrete-event Manufacturing Simulation

Rachel Kotary — Sun, 01 Sep 2024 12:00:00 +0000

NIST has released its latest software version of SimPROCESD v0.3.0, or Simulated-Production Resource for Operations and Conditions Evaluation to Support Decision-Making. SimPROCESD is used to model discrete manufacturing systems such as the

NIST Publishes Recommendations to Use Universally Unique Identifiers (UUIDs) in Manufacturing Life Cycle Data

Rachel Kotary — Thu, 01 Aug 2024 12:00:00 +0000

A recently released NIST Advanced Manufacturing Series publication AMS 300-12 “ Research Results and Recommendations for Universally Unique Identifiers in Product Data Standards ” proposes recommendations for employing universally unique identifiers

NIST Reports that IEEE 802.11 OFDMA Frame Triggering Could Improve Latency for Time-critical Applications Using Wireless

Rachel Kotary — Thu, 01 Aug 2024 12:00:00 +0000

Rick Candell of the NIST Communications Technology Laboratory (CTL) presented research findings at the International Conference on Advance Intelligent Mechatronics in Boston on July 17, 2024, on the current efficacy of IEEE 802.11ax Orthogonal

NIST Team Presents its 5G Industrial Wireless Testbed and Research Direction at AIM Conference

Rachel Kotary — Thu, 01 Aug 2024 12:00:00 +0000

NIST researcher Jing Geng of the Operational Technology (OT) Wireless Team, Smart Connected Systems Division, presented the paper, “An Industrial Private 5G Testbed for Networked Automation Systems” at the International Conference on Advance

Summer Students Support Smart Connected Systems Research in NIST’s SURF and SHIP Programs

Rachel Kotary — Thu, 01 Aug 2024 12:00:00 +0000

Every summer, NIST hosts summer students in its Summer Undergraduate Research Fellowships (SURF) program and Summer High School Intern Program (SHIP) to work in areas that support its mission. NIST seeks to inspire students to serve in these fields

Biden-Harris Administration Announces Preliminary Terms with Edwards Vacuum to Bring Specialized Dry Vacuum Pump Manufacturing to the U.S. for the First Time

Joy Antwi — Thu, 10 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Edwards Vacuum have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18 million in proposed direct funding under the CHIPS and Science Act.

CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Proposer’s Day

Joy Antwi — Tue, 22 Oct 2024 00:00:00 -0400

Purpose The Proposer’s Day is intended to familiarize potential applicants with the objectives and structure of the NAPMP Advanced Packaging Research and Development Notice of Funding Opportunity (NOFO) , published on October 18, 2024. It will bring

CHIPS for America Welcomes New Chair and Vice Chair to Industrial Advisory Committee (IAC)

Joy Antwi — Tue, 08 Oct 2024 12:00:00 +0000

Today, CHIPS for America announced a new Chair and Vice Chair to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on understanding the long-term research and development needs of the semiconductor industry, workforce needs across the industry, and the organizational ecosystem and how public-private partnerships can bring the most value to this ecosystem – provide guidance to the Secretary of Commerce in support of achieving CHIPS for America’s ambitious R&D goals.

NIST Awards $15 Million to ASTM International to Establish Standardization Center of Excellence

Sarah Henderson — Tue, 15 Oct 2024 12:00:00 +0000

The new center will support U.S. engagement in international standardization for critical and emerging technologies.

CHIPS for America Welcomes New and Returning Members to the Industrial Advisory Committee

Joy Antwi — Fri, 04 Oct 2024 12:00:00 +0000

Today, CHIPS for America announced five new members to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on understanding the long-term research and development needs of the semiconductor industry, workforce needs across the industry, and the organizational ecosystem and how public-private partnerships can bring the most value to this ecosystem – provide guidance to the Secretary of Commerce in support of achieving CHIPS for America’s ambitious R&D goals.

Enhanced Manufacturing.gov Website Launched on Manufacturing Day

Nicole Ausherman — Fri, 04 Oct 2024 12:00:00 +0000

In celebration of Manufacturing Day (MFG Day), the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) announced the launch of the enhanced manufacturing.gov website , a primary hub for information about federal

CHIPS for America Announces Entrepreneurial Fellowships Pilot Program

Joy Antwi — Fri, 04 Oct 2024 12:00:00 +0000

Today, CHIPS for America announced a new $5 million Entrepreneurial Fellowship Pilot Program, funded by the Biden-Harris Administration's CHIPS and Science Act, to support up to 10 early-stage companies focused on innovation in semiconductor manufacturing technologies.

NIST & ASTM International Publish Report Highlighting Standards Needs for Circular Textiles

Shelby Bowers — Fri, 08 Nov 2024 12:00:00 +0000

103.5 pounds (47 kilograms) – that’s the average amount of textile waste each American produced in 2018. Things like clothing, footwear, sheets, towels, and pillowcases, even furniture, carpets, and tires contain textiles. What becomes of these

Biden-Harris Administration to Invest up to $100 Million to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

Joy Antwi — Wed, 02 Oct 2024 12:00:00 +0000

Today, the U.S. Department of Commerce issued a Notice of Intent (NOI) to announce an open competition demonstrating how AI can assist in developing new sustainable semiconductor materials and processes that meet industry needs and can be designed

U.S. National Science Foundation and Department of Commerce Announce a New $30M Funding Opportunity, Funded by the CHIPS & Science Act, to Prepare Talent for Semiconductor Jobs Nationwide

Joy Antwi — Fri, 27 Sep 2024 12:00:00 +0000

The Network Coordination Hub for the National Network for Microelectronics Education will establish and operate regional nodes to offer consistent, rigorous, engaging curricula, instructional materials, experiential opportunities, teacher

NIST Announces Award for Manufacturing Extension Center in Florida

Nicole Ausherman — Thu, 26 Sep 2024 12:00:00 +0000

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has made a cooperative agreement award to operate a Manufacturing Extension Partnership (MEP) Center in Florida. The MEP Center will be operated by the awardee

5x5: The Public Safety Innovation Summit

Crissy Robinson — Tue, 03 Jun 2025 00:00:00 -0400

REGISTER NOW 5x5 ― the confirmation of a strong and clear signal ― and the place to make your voice heard and drive public safety communications forward. In 2025, the FirstNet Authority and the National Institute of Standards and Technology’s Public

CHIPS for America Releases METIS Data Exchange Ecosystem for Supporting Metrology Innovation

Joy Antwi — Thu, 26 Sep 2024 12:00:00 +0000

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) Today, CHIPS for America released a beta version of the Metrology Exchange to Innovate in Semiconductors (METIS) . A major milestone for the CHIPS Metrology Program, METIS will give

Biden-Harris Administration Announces First CHIPS Commercial Fabrication Facilities Award with Polar Semiconductor, Establishing Independent American Foundry

Joy Antwi — Tue, 24 Sep 2024 12:00:00 +0000

Today, as part of the Biden-Harris Administration’s Investing in America agenda, the U.S. Department of Commerce announced its first award under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities of up to $123

Biden-Harris Administration Awards nearly $5 million to Small Businesses to Bring New CHIPS Technology to the Commercial Market

Joy Antwi — Thu, 19 Sep 2024 12:00:00 +0000

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) . Today, the Biden-Harris Administration awarded nearly $5 million to 17 small businesses across nine states under the Small Business Innovation Research (SBIR) Program. The SBIR Phase I

New Polymer Technology Visualizes Shockwaves, Offering Breakthroughs in Material Science

Shelby Bowers — Mon, 07 Oct 2024 12:00:00 +0000

A team of researchers from the National Institute of Standards and Technology (NIST), University of Southern Mississippi, Arizona State University, Rensselaer Polytechnic Institute, and U.S. Army Corps of Engineers has developed an innovative polymer

CHIPS for America Announces New CHIPS Metrology Community of Practice

Joy Antwi — Wed, 28 Aug 2024 12:00:00 +0000

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) . Today, CHIPS for America announced the establishment of a new community of practice, the CHIPS Metrology Community . The Community will facilitate data and knowledge sharing across

Biden-Harris Administration Announces Preliminary Terms with HP to Support Development and Commercialization of Cutting-Edge Semiconductor Technologies

Joy Antwi — Tue, 27 Aug 2024 12:00:00 +0000

Media Contact: Madeline Broas, madeline.broas [at] chips.gov (madeline[dot]broas[at]chips[dot]gov) . Today, the Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in