News and Events Feed by Topic

CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging

Joy Antwi — Thu, 21 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry. The expected recipients are Absolics Inc. in Georgia, Applied Materials Inc. in California, and Arizona State University in Arizona.

Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries to Strengthen Essential Chip Supply for Key U.S. Industries Including Auto and Defense

Joy Antwi — Wed, 20 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded GlobalFoundries (GF) up to $1.5 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina

Joy Antwi — Tue, 19 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.

Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology

Joy Antwi — Fri, 15 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

NIST Study Probes the Damaging Effects of Radiation on Qubits

Pamela L Corey — Tue, 19 Nov 2024 12:00:00 +0000

Qubits, the fundamental unit of quantum information, form the building blocks of quantum computers. Because qubits are not limited to the two states, “0” and “1,” of an ordinary logic bit, but can simultaneously represent combinations of these states

Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology

Joy Antwi — Wed, 13 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act. President Biden signed the bipartisan CHIPS and Science Act to usher in a new era of semiconductor manufacturing in the United States and advance U.S. economic and national security.

Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency

Joy Antwi — Fri, 08 Nov 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide Corning up to $32 million in proposed direct funding and Powerex up to $3 million in proposed direct funding. President Biden and Vice President Harris signed the bipartisan CHIPS and Science Act to usher in a new era of semiconductor manufacturing in the United States, bringing with it a revitalized domestic supply chain, good-paying jobs, and investments in the industries of the future.

Biden-Harris Administration Announces Sunnyvale, CA as Expected Location for Second CHIPS for America R&D Flagship Facility

Joy Antwi — Fri, 01 Nov 2024 12:00:00 +0000

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the expected location for the CHIPS for America Design and Collaboration Facility (DCF), an NSTC Facility. The DCF will play an important role in advancing semiconductor design research, workforce development, investment, and collaboration across the entire semiconductor value chain.

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the first CHIPS for America R&D Flagship Facility and Planned Site for the estimated $825 Million CHIPS for America EUV Accelerator

Joy Antwi — Thu, 31 Oct 2024 12:00:00 +0000

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.

Biden-Harris Administration Opens $100 million Competition to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

Joy Antwi — Wed, 30 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI) and autonomous experimentation (AE) technologies to support the long-term viability of next-generation semiconductor manufacturing. The CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) funding opportunity will be critical in meeting the industry’s technology, economic, and sustainability goals.

CHIPS R&D CARISSMA Program Proposers' Day

Joy Antwi — Fri, 15 Nov 2024 00:00:00 -0500

Logistics When: Friday, November 15, 2024 What: Hybrid meeting for potential applicants to the CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Notice of Funding Opportunity (NOFO) Where: In-person

CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Notice of Funding Opportunity

Joy Antwi — Fri, 08 Nov 2024 15:00:00 -0500

CHIPS for America recently released a notice of funding opportunity (NOFO) for industry-informed, university-based artificial intelligence-powered autonomous experimentation (AI/AE) collaborations, including research and development, education and

NIST Broadens Collaboration with BIPM to Enhance Voltage Standards

Anne Lane — Thu, 24 Oct 2024 12:00:00 +0000

The National Institute of Standards and Technology (NIST) has expanded its comparison program with the Bureau International des Poids et Mesures (BIPM) and the South Korea Metrology Institute (KRISS) to enhance the precision and reliability of

Biden-Harris Administration Announces Preliminary Terms with Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon

Joy Antwi — Mon, 21 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $325 million in proposed direct funding under the CHIPS and Science Act to solidify U.S. leadership in semiconductor-grade polysilicon production.

Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

Joy Antwi — Fri, 18 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies.

NIST Scientists Use DNA Origami on a Chip to Detect Biomolecules

Pamela L Corey — Thu, 17 Oct 2024 12:00:00 +0000

Using strands of DNA to create miniature hinges that pop open or shut when binding to specific molecules, researchers at the National Institute of Standards and Technology (NIST) have developed a chip-scale device that has the potential to measure

Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security

Joy Antwi — Thu, 17 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.

Biden-Harris Administration Announces Preliminary Terms with Wolfspeed to Solidify U.S. Technological Leadership in Silicon Carbide Manufacturing

Joy Antwi — Tue, 15 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and Science Act.

Biden-Harris Administration Announces Preliminary Terms with Edwards Vacuum to Bring Specialized Dry Vacuum Pump Manufacturing to the U.S. for the First Time

Joy Antwi — Thu, 10 Oct 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Edwards Vacuum have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18 million in proposed direct funding under the CHIPS and Science Act.

CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Proposer’s Day

Joy Antwi — Tue, 22 Oct 2024 00:00:00 -0400

Purpose The Proposer’s Day is intended to familiarize potential applicants with the objectives and structure of the NAPMP Advanced Packaging Research and Development Notice of Funding Opportunity (NOFO) , published on October 18, 2024. It will bring

CHIPS for America Welcomes New Chair and Vice Chair to Industrial Advisory Committee (IAC)

Joy Antwi — Tue, 08 Oct 2024 12:00:00 +0000

Today, CHIPS for America announced a new Chair and Vice Chair to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on understanding the long-term research and development needs of the semiconductor industry, workforce needs across the industry, and the organizational ecosystem and how public-private partnerships can bring the most value to this ecosystem – provide guidance to the Secretary of Commerce in support of achieving CHIPS for America’s ambitious R&D goals.

NIST Awards $15 Million to ASTM International to Establish Standardization Center of Excellence

Sarah Henderson — Tue, 15 Oct 2024 12:00:00 +0000

The new center will support U.S. engagement in international standardization for critical and emerging technologies.

CHIPS for America Welcomes New and Returning Members to the Industrial Advisory Committee

Joy Antwi — Fri, 04 Oct 2024 12:00:00 +0000

Today, CHIPS for America announced five new members to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on understanding the long-term research and development needs of the semiconductor industry, workforce needs across the industry, and the organizational ecosystem and how public-private partnerships can bring the most value to this ecosystem – provide guidance to the Secretary of Commerce in support of achieving CHIPS for America’s ambitious R&D goals.

CHIPS for America Announces Entrepreneurial Fellowships Pilot Program

Joy Antwi — Fri, 04 Oct 2024 12:00:00 +0000

Today, CHIPS for America announced a new $5 million Entrepreneurial Fellowship Pilot Program, funded by the Biden-Harris Administration's CHIPS and Science Act, to support up to 10 early-stage companies focused on innovation in semiconductor manufacturing technologies.

Biden-Harris Administration to Invest up to $100 Million to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

Joy Antwi — Wed, 02 Oct 2024 12:00:00 +0000

Today, the U.S. Department of Commerce issued a Notice of Intent (NOI) to announce an open competition demonstrating how AI can assist in developing new sustainable semiconductor materials and processes that meet industry needs and can be designed

U.S. National Science Foundation and Department of Commerce Announce a New $30M Funding Opportunity, Funded by the CHIPS & Science Act, to Prepare Talent for Semiconductor Jobs Nationwide

Joy Antwi — Fri, 27 Sep 2024 12:00:00 +0000

The Network Coordination Hub for the National Network for Microelectronics Education will establish and operate regional nodes to offer consistent, rigorous, engaging curricula, instructional materials, experiential opportunities, teacher

5x5: The Public Safety Innovation Summit

Crissy Robinson — Tue, 03 Jun 2025 00:00:00 -0400

REGISTER NOW 5x5 ― the confirmation of a strong and clear signal ― and the place to make your voice heard and drive public safety communications forward. In 2025, the FirstNet Authority and the National Institute of Standards and Technology’s Public

CHIPS for America Releases METIS Data Exchange Ecosystem for Supporting Metrology Innovation

Joy Antwi — Thu, 26 Sep 2024 12:00:00 +0000

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) Today, CHIPS for America released a beta version of the Metrology Exchange to Innovate in Semiconductors (METIS) . A major milestone for the CHIPS Metrology Program, METIS will give

Biden-Harris Administration Launches NSTC Workforce Center of Excellence with Expected $250 Million Investment

Joy Antwi — Wed, 25 Sep 2024 12:00:00 +0000

Today, the Biden-Harris Administration announced the launch of the National Semiconductor Technology Center’s (NSTC) Workforce Center of Excellence (WCoE), making a decisive step toward solving one of the most pressing challenges facing the U.S

Biden-Harris Administration Announces First CHIPS Commercial Fabrication Facilities Award with Polar Semiconductor, Establishing Independent American Foundry

Joy Antwi — Tue, 24 Sep 2024 12:00:00 +0000

Today, as part of the Biden-Harris Administration’s Investing in America agenda, the U.S. Department of Commerce announced its first award under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities of up to $123

Quantum Matters in Material Sciences (QMMS)

Jennifer Gerlock — Wed, 19 Feb 2025 00:00:00 -0500

As part of the JARVIS workshop series, the National Institute of Standards and Technology (NIST) is organizing the 4 th Quantum Matters in Materials Science (QMMS) workshop in-person on Feb 19-20, 2025. The workshop will be focused on quantum

Biden-Harris Administration Awards nearly $5 million to Small Businesses to Bring New CHIPS Technology to the Commercial Market

Joy Antwi — Thu, 19 Sep 2024 12:00:00 +0000

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) . Today, the Biden-Harris Administration awarded nearly $5 million to 17 small businesses across nine states under the Small Business Innovation Research (SBIR) Program. The SBIR Phase I

Tiny New Lasers Fill a Long-Standing Gap in the Rainbow of Visible-Light Colors, Opening New Applications

Pamela L Corey — Wed, 28 Aug 2024 12:00:00 +0000

Researchers have created orange, yellow and green lasers tiny enough to fit on a chip.

CHIPS for America Announces New CHIPS Metrology Community of Practice

Joy Antwi — Wed, 28 Aug 2024 12:00:00 +0000

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) . Today, CHIPS for America announced the establishment of a new community of practice, the CHIPS Metrology Community . The Community will facilitate data and knowledge sharing across

Biden-Harris Administration Announces Preliminary Terms with HP to Support Development and Commercialization of Cutting-Edge Semiconductor Technologies

Joy Antwi — Tue, 27 Aug 2024 12:00:00 +0000

Media Contact: Madeline Broas, madeline.broas [at] chips.gov (madeline[dot]broas[at]chips[dot]gov) . Today, the Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in

CHIPS for America Workshop on Accelerating R&D for Sustainable Semiconductor Materials

Joy Antwi — Wed, 18 Sep 2024 00:00:00 -0400

For the U.S. semiconductor industry to flourish in the long-term, its materials and manufacturing practices must be sustainable in both protecting the environment and communities and in producing innovative new technologies.

Biden-Harris Administration Announces Preliminary Terms with Texas Instruments to Expand U.S. Current-Generation and Mature-Node Chip Capacity

Joy Antwi — Fri, 16 Aug 2024 12:00:00 +0000

Media Contact: Madeline Broas, madeline.broas [at] chips.gov (madeline[dot]broas[at]chips[dot]gov) . Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Texas Instruments (TI) have signed a non-binding preliminary memorandum of terms (PMT) to provide up

MMSD Staff Release Version 5.2 of SRD31, Phase Equilibria Diagrams (PED)

William J Laws — Wed, 25 Sep 2024 12:00:00 +0000

The third Series-5 release of SRD31 is now commercially available and provides users with processing information for more than 200 material systems not previously covered by the database. Series 5 of the PED standard reference database introduced a

U.S. Department of Commerce Announces Preliminary Terms with SK hynix to Advance U.S. AI Supply Chain Security

Joy Antwi — Tue, 06 Aug 2024 12:00:00 +0000

Media Contact: Madeline Broas, madeline.broas [at] chips.gov (madeline[dot]broas[at]chips[dot]gov) . Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and SK hynix have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $450 million

IEEE 1451.0 - 2024 Standard Published Under Leadership of NIST Researchers

Rachel Kotary — Mon, 01 Jul 2024 12:00:00 +0000

NIST researchers Eugene Song and Kang Lee chaired and led the development of the IEEE 1451.0 TM-2024 Standard for a Smart Transducer Interface for Sensors and Actuators - Common Functions, Communication Protocols, and Transducer Electronic Data Sheet