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TLM POWER3: Power Estimation Methodology for SystemC TLM 2.0

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Models, Methods, and Tools for Complex Chip Design

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 265))

Abstract

We report on a SystemC add-on library which extends every SystemC module with non-functional data regarding power consumption and physical layout and which accumulates and estimates dynamic energy usage. It supports both phase/mode power modelling and energy-per-transaction logging for TLM (transactional-level modelling). Wiring energy is computed by counting bit-level activity within the TLM generic payload. Each leaf component can also register its physical dimensions to facilitate a wire length estimator that traverses the SystemC model hierarchy using either full placement or Rent’s rule estimators. It also supports dynamic voltage islands and inter-chip wiring, where each transaction can consume energy according to the current supply voltage of the relevant islands and the nature of the interconnect. We report on basic performance from some SPLASH-2 benchmarks running on a modelled OpenRISC quad-core platform.

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Notes

  1. 1.

    We use the word component to denote an sc_module that is so associated.) SystemC augments every sc_module (or other entity that inherits sc_object) with a key/value space where the values are void * pointers.

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Acknowledgements

We thank Matthieu Moy for providing the TLM POWER2 base platform.

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Correspondence to David Greaves .

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Greaves, D., Yasin, M. (2014). TLM POWER3: Power Estimation Methodology for SystemC TLM 2.0. In: Haase, J. (eds) Models, Methods, and Tools for Complex Chip Design. Lecture Notes in Electrical Engineering, vol 265. Springer, Cham. https://doi.org/10.1007/978-3-319-01418-0_4

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  • DOI: https://doi.org/10.1007/978-3-319-01418-0_4

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-01417-3

  • Online ISBN: 978-3-319-01418-0

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