Abstract
Curve-shaped electronics have been on the rise in recent years. One crucial challenge in this area is reproducibility, which means in the different fabricated samples, the position of the electronic components should be the same. This paper aims to present a reliable approach for accurate component positioning in thermoformed electronics. We have proposed a non-stretchable conductive structure for accurate positioning of the electronic components, which can assure the conductive routes’ mechanical stability during lamination and thermoforming of the substrate. We have verified our approach’s accuracy by applying our method on a real industrial luminaire mold for positioning six LEDs in the center of the luminaire parts. We have measured the LEDs’ position after thermoforming to prove the design’s repeatability. The experiment results state that the proposed method is capable of positioning electronic components in thermoformed 3D electronics and 400% improvement is reported in comparison with the previous fabrication approaches.
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References
Merilampi, S., Björninen, T., Haukka, V., Ruuskanen, P., Ukkonen, L., Sydanheimo, L.: ̈ Microelectron. Reliab. 2010, 50 (2001)
DuraTech. In-Mold Electronics (IME) (2019). https://www.duratech.com/capabilities/ime-in-mold-electronics. Accessed 30 Nov 2019
Chtioui, I.: Arbitrarily shaped rigid and smart objects using stretchable interconnections. IEEE Trans. Compon. Packag. Manuf. Technol. 6(4), 533-544 (2016)
Plovie, B.: Arbitrarily Shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers. Adv. Eng. Mater. 19(8), 1700032 (2017)
Vanfleteren, J., et al.: Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections. Mater. Res. Soc. Symp. Proc. 1798 © 2015 Materials Research Society (2015)
Plovie, B., Vanfleteren, J., Vervust, T., Quintero, A.V., Bossuyt, F.: Design automation of meandered interconnects for stretchable circuits. IEEE Trans. Comput.-Aid. Des. Integr. Circ. Syst. 38(9), 1648-1660 (2018)
Plovie, B.: Thermoplastic Electronic Circuits: Design, Technology and Characterization, Bart Plovie, Ghent University (2019)
Franke, J.: Three-Dimensional Molded Interconnected Devices (3DMID), 335 pages. Carls Hanser Verlag, Muenchen (2014)
Vanfleteren, J., Bossu yt, F., Plovie, B.: Flex PCB based technology for randomly shaped circuits. In: 2017 EIPC conference Proceedings (2017)
https://patentscope.wipo.int/search/en/detail.jsf?docId=WO2018054623
Ting, J., Zhang, Y., Yoon, S.H., Holbery, J.D., Ma, S.: iMold: enabling interactive design optimization for in-mold electronics. In: CHI 2020, pp. 25–30, Honolulu, HI, USA (2020)
Choi, J., et al.: Customizable, conformal, and stretchable 3D electronics via predistorted pattern generation and thermoforming. Sci. Adv. 7(42), eabj0694 (2021)
Vanfleteren, J., Bossuyt, F., Plovie, B.: A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits. In: 12th International Congress Molded Interconnect Devices (MID), pp. 1–4 (2016)
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Madadnia, B., Bossuyt, F., Vanfleteren, J. (2023). A Novel Method for Component Positioning in Thermoformed Electronics. In: Valle, M., et al. Advances in System-Integrated Intelligence. SYSINT 2022. Lecture Notes in Networks and Systems, vol 546. Springer, Cham. https://doi.org/10.1007/978-3-031-16281-7_57
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DOI: https://doi.org/10.1007/978-3-031-16281-7_57
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