Research Bits: Feb. 25
Recording synaptic connections; crystal stores terabytes of data; determining plasma equipment lifetime.
Chip Industry Technical Paper Roundup: Feb. 25
NVM-CIM accelerators; AI HW energy; TSV faults; Si/SiGe multi-layer stacks; BPR to suppress substrate leakage in CFETs; small-pitch interconnects; ...
Published on February 25th, 2025 by
Liz Allan
Research Bits: Feb. 18
Predicting band gap; plasma-resistant ceramics; mixing 2D and silicon materials.
Chip Industry Technical Paper Roundup: Feb. 18
Warpage in wafer-level packaging; NVM tutorial; GAAFETs; uncore frequency scaling for heterogeneous systems; simulation of vertically stacked 2D Na...
Chip Industry Technical Paper Roundup: Feb. 10
PDN for CIM; accelerating OTA circuit design; inter-chiplet interconnects; wireless multi-chip AI accelerators; oxygen plasma treatment to enhance ...
Research Bits: Feb. 10
Memory: Speeding up 3D NAND etch; xenon in CVD; cache management.
Research Bits: Feb. 4
Diamond: High-power transistors; direct bonding; speedy wafer fabrication.
Chip Industry Technical Paper Roundup: Feb. 4
Mixed-precision DL inference; CXL memory pooling; processing-using-DRAM; Apple CPU vulnerabilities; pager and walkie-talkie attacks; ultranarrow se...
Research Bits: Jan. 28
Memory: Programmable photonic latch; gradient computing with memristors; writing MRAM.
Chip Industry Technical Paper Roundup: Jan. 28
SRAM at low temps; DeepSeek RL; TSVs; new memory class; 3nm SRAM; quantum chiplet architectures; integrated photonics; 2D TMDs; HW IP protection; a...
