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2025 IEEE International Workshop on Integrated Power Packaging (IWIPP) Tuscaloosa, Alabama USA Apr 8, 2025 - Apr 10, 2025
2025 Smart Systems Integration Conference and Exhibition (SSI) Prague, Czech Republic Apr 8, 2025 - Apr 10, 2025
2025 IEEE Build-Up Substrate Symposium (BUSS) Milpitas, California USA May 8, 2025 - May 9, 2025
2025 IEEE 29th Workshop on Signal and Power Integrity (SPI) Gaeta, Italy May 11, 2025 - May 14, 2025
2025 International Spring Seminar on Electronics Technology (ISSE) Budapest, Hungary May 14, 2025 - May 18, 2025
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) Dallas, Texas USA May 27, 2025 - May 30, 2025
2025 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Copenhagen, Denmark Jun 10, 2025 - Jun 12, 2025
2025 IEEE 70th Holm Conference on Electrical Contacts (HLM) San Antonio, Texas USA Oct 15, 2025 - Oct 22, 2025
2025 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 12, 2025 - Nov 14, 2025
2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Hokkaido, Japan Dec 15, 2025 - Dec 17, 2025
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2025 16th International Conference on Computing Communication and Networking Technologies (ICCCNT) Indore, India Jul 6, 2025 - Jul 11, 2025 Abstract Submission Date: Apr 15, 2025
2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Naples, Italy Sep 24, 2025 - Sep 26, 2025 Abstract Submission Date: Apr 4, 2025
2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Milpitas, California USA Oct 19, 2025 - Oct 22, 2025 Abstract Submission Date: May 16, 2025
2025 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 12, 2025 - Nov 14, 2025 Abstract Submission Date: May 30, 2025
2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Hokkaido, Japan Dec 15, 2025 - Dec 17, 2025 Abstract Submission Date: Jul 18, 2025

IEEE Electronics Packaging Award


Jie Xue 

Recipient of the 2025

IEEE Rao R. Tummala Electronics Packaging Award

Jie Xue

For contributions to industry-leading high-bandwidth networking systems, including advanced IC and Si-Photonic packaging”

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