厚膜混成集積回路の英語

第１の絶縁樹脂膜１４を厚く形成し、耐電圧特性の向上を改善し、且つフィラーの混入により発熱素子の熱を良好に混成集積回路基板１１に伝えられる様にした。例文帳に追加

A first insulating resin film 14 is formed thick, breakdown voltage characteristic is improved, by mixing a filler the heat of a heater element is transmitted satisfactorily to a hybrid integrated circuit board 11. - 特許庁

第１の絶縁樹脂膜１４を厚く形成し、耐電圧特性の向上を改善し、且つフィラーの混入により発熱素子の熱を良好に混成集積回路基板に伝えられる。例文帳に追加

The backside of the hybrid integrated circuit board 11 is thinned to the utmost, and fillers 18 are mixed in a second insulating resin film 6. - 特許庁

セラミック絶縁基板に対して保護ガラス−抵抗体−Ｃｕめっき層−配線導体の基板に対して強固な接合が得られ、信頼性の高い厚膜抵抗体層を具備した混成集積回路基板に適した配線基板を得る。例文帳に追加

To obtain the wiring board which can tightly be joined to a substrate of a protection glass, a resistance body, a Cu plating layer, and a wiring conductor for a ceramic insulating substrate and suitable to a hybrid integrated circuit board equipped with a reliable thick-film resistance body layer. - 特許庁

混成集積回路装置は、絶縁性の基板１０と、基板上に形成され銅粉末に有機金属を添加した銅導体ペースト２１Ａ及び２２Ａを焼成して成る銅導体膜２１及び２２とを含む厚膜回路基板２５と、銅導体膜上にはんだ３５及び３６によりはんだ付けされた電子部品３８とから成る。例文帳に追加

A hybrid integrated circuit device consists of an insulated substrate 10, a thick film circuit 25 formed on a substrate which has the copper conductive films 21 and 22 made by baking the copper conductive pastes 21A and 22A where organic metals have been added to metal powders, and electronic components 38 soldered on the copper conductive films by solders 35 and 36. - 特許庁