Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA
IEICE Transactions on Electronics
Online ISSN : 1745-1353
Print ISSN : 0916-8524
Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity
Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA
Takahiro NAKAMURA, Kenichiro YASHIKI, Kenji MIZUTANI, Takaaki NEDACHI, Junichi FUJIKATA, Masatoshi TOKUSHIMA, Jun USHIDA, Masataka NOGUCHI, Daisuke OKAMOTO, Yasuyuki SUZUKI, Takanori SHIMIZU, Koichi TAKEMURA, Akio UKITA, Yasuhiro IBUSUKI, Mitsuru KURIHARA, Keizo KINOSHITA, Tsuyoshi HORIKAWA, Hiroshi YAMAGUCHI, Junichi TSUCHIDA, Yasuhiko HAGIHARA, Kazuhiko KURATA
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Keywords: silicon photonics, bandwidth density, optical/electrical assembly, FPGA
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2019 Volume E102.C Issue 4 Pages 333-339

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Abstract

Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.

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© 2019 The Institute of Electronics, Information and Communication Engineers
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