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Conferences > OFC > 2014 > W3I > W3I.2

Packaging of Silicon Photonics Systems

P. De Dobbelaere, A. Ayazi, Y. Chi, A. Dahl, S. Denton, S. Gloeckner, Kam-Yan Hon, S. Hovey, Yi Liang, M. Mack, G. Masini, A. Mekis, M. Peterson, T. Pinguet, J. Schramm, M. Sharp, C. Sohn, K. Stechschulte, P. Sun, G. Vastola, L. Verslegers, and R. Zhou

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Abstract

We address the effects of packaging on performance, reliability and cost of photonic devices. For silicon photonics we address some specific packaging aspects. Finally we propose an approach for integration of photonics and ASICs.

© 2014 Optical Society of America

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