Abstract
The rise in complexity and number of processing cores in SoC has paved way to the development of efficient and structured on-chip communication framework known as Network on Chip (NoC). NoC is embraced as an interconnect solution for the design of large tiled chip multiprocessors (TCMP). It is characterized by performance metrics such as average latency, throughput and power dissipation which depend on underlying network architecture. In this paper, we propose 2L-2D (Two Layer Two dimensional) architecture to enhance performance of conventional buffered 2D mesh NoC where two identical layers of 8 \(\times \) 8 meshes are stacked one on top of the other. 2L-2D uses conventional 5-port virtual channel router (VCR) architecture and vertical interconnections are made by utilizing unused ports at edge routers only. Experimental results indicate that our proposed approach improves throughput and network saturation point whereas average flit latency and power dissipation is considerably reduced when compared with standard 5-port 2D mesh and torus designs.
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References
Dally, W., et al.: Principles and Practices of Interconnection Networks. Morgan Kaufmann, Burlington (2004)
Dally, W.: Route packets, not wires: on-Chip interconnection networks. In: Design Automation Conference (DAC-2001), pp. 684–689. ACM Press, New York, June 2001. https://doi.org/10.1109/DAC.2001.156225
Dally, W.: Virtual-channel flow control. IEEE Trans. Parallel Distrib. Syst. 3(2), 194–205 (1992). https://doi.org/10.1109/71.127260
Topol, A.W., et al.: Three-dimensional integrated circuits. IBM J. Res. Dev. 50(4/5) (2006). https://doi.org/10.1147/rd.504.0491
Davis, W.R., et al.: Demystifying 3D ICS: the pros and cons of going vertical. IEEE Des. Test Comput. 22(6), 498–510 (2005). https://doi.org/10.1109/MDT.2005.136
Li, F., et al.: Design and management of 3D chip multiprocessors using network-in-memory. In: Proceedings of International Symposium Computer Architecture, pp. 130–141 (2006). https://doi.org/10.1109/ISCA.2006.18
Pavlidis, V.F., et al.: 3-D topologies for networks-on-chip. IEEE Trans. Very Large Scale Integr. (VLSI 2007), 1081–1090 (2007). https://doi.org/10.1109/TVLSI.2007.893649
Kim, J., et al.: A novel dimensionally-decomposed router for on-chip communication in 3D architectures. In: Proceedings of International Symposium on Computer Architecture, pp. 138–149 (2007). https://doi.org/10.1145/1273440.1250680
Park, D., et al.: MIRA: a multi-layered on-chip interconnect router architecture. In: Proceedings of International Symposium on Computer Architecture, pp. 251–261 (2008). https://doi.org/10.1109/ISCA.2008.13
Feero, B.S., et al.: Networks-on-chip in a three-dimensional environment: a performance evaluation. IEEE Trans. Comput. 32–45 (2009). https://doi.org/10.1109/TC.2008.142
Manna, K., et al.: Thermal-aware design and test techniques for two- and three-dimensional networks-on-chip. In: 2016 ISVLSI, pp. 583–586 (2016). https://doi.org/10.1109/ISVLSI.2016.76
Xu, T., et al.: A study of through silicon via impact to 3D network-on-chip design. In: Proceedings of Conference on Electronics Information Engineering, pp. 333–337 (2010). https://doi.org/10.1109/ICEIE.2010.5559865
Wang, Y., et al.: Economizing TSV resources in 3D network-on-chip design. IEEE Trans. Very Large Scale Integr. Syst. 23(3), 493–506 (2015). https://doi.org/10.1109/TVLSI.2014.2311835
More, A., et al.: Vertical arbitration-free 3-D NoCs. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 37(9), 1853–1866 (2018). https://doi.org/10.1109/TCAD.2017.2768415
Agyeman, M.O., et al.: Performance and energy aware inhomogeneous 3D networks-on-chip architecture generation. IEEE Trans. Parallel Distrib. Syst. 27(6), 1756–1769 (2016). https://doi.org/10.1109/TPDS.2015.2457444
Hoskote, Y., et al.: A 5-GHz mesh interconnect for a teraflops processor. IEEE Micro 27(5), 51–61 (2007). https://doi.org/10.1109/MM.2007.4378783
Taylor, M.B., et al.: Evaluation of the raw microprocessor: an exposed wire-delay architecture for ILP and streams. In: ISCA 2004. https://doi.org/10.1109/ISCA.2004.1310759
Jiang, N., et al.: A detailed and flexible cycle-accurate network-on-chip simulator. In: IEEE International Symposium on Performance Analysis of Systems and Software (2013). https://doi.org/10.1109/ISPASS.2013.6557149
SPEC2006 CPU benchmark suite. http://www.spec.org
Bienia, C., et al.: The PARSEC benchmark suite: characterization and architectural implications. In: PACT, pp. 72–81 (2008)
Ubal, R., et al.: Multi2sim: a simulation framework to evaluate multicore-multithreaded processors. In: SBAC-PAD, pp. 62–68 (2007). https://doi.org/10.1109/SBAC-PAD.2007.17
Kahng, A.B., et al.: ORION 2.0: a fast and accurate NoC power and area model for early-stage design space exploration. In: Design, Automation Test in Europe (DATE), pp. 423–428 (2009). https://doi.org/10.1109/DATE.2009.5090700
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Kunthara, R.G., Neethu, K., James, R.K., Sleeba, S.Z., Warrier, T.S., Jose, J. (2019). 2L-2D Routing for Buffered Mesh Network-on-Chip. In: Sengupta, A., Dasgupta, S., Singh, V., Sharma, R., Kumar Vishvakarma, S. (eds) VLSI Design and Test. VDAT 2019. Communications in Computer and Information Science, vol 1066. Springer, Singapore. https://doi.org/10.1007/978-981-32-9767-8_27
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