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Computational Investigation of Heat Transfer of Nanofluids in Microchannel with Improper Insulation

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Computational Science and Its Applications – ICCSA 2016 (ICCSA 2016)

Part of the book series: Lecture Notes in Computer Science ((LNTCS,volume 9786))

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Abstract

Numerical simulation of heat transfer of nanofluids in rectangular microchannel has been performed. A micro-electro-mechanical system is built with two heating resistors embedded in a silicon substrate. Microchannel made from polydimethylsiloxane is planted in the substrate and nanofluids with different volume fractions are used as the coolant. Because of the not well-insulated micro-electro-mechanical system, heat generated by the heating resistors will be lost to the surrounding as well as carried away by the nanofluids through the microchannel. Heat transfer is analyzed at low Reynolds number for different nanofluid concentrations.

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Acknowledgments

The research is supported by the Research Committee of University of Macau under Multi-Year Research Grant MYRG2016-00074-FST. We would also like to thank Professor U. Lei from National Taiwan University for providing experimental data for comparison and giving this research so many valuable suggestions and comments.

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Authors and Affiliations

  1. Department of Electromechanical Engineering, University of Macau, Macau SAR, China

    Vai Kuong Sin, Ka Kei Teng & Wen Yue Deng

Authors
  1. Vai Kuong Sin
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  2. Ka Kei Teng
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  3. Wen Yue Deng
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Corresponding author

Correspondence to Vai Kuong Sin .

Editor information

Editors and Affiliations

  1. University of Perugia , Perugia, Italy

    Osvaldo Gervasi

  2. University of Basilicata , Potenza, Italy

    Beniamino Murgante

  3. Covenant University , Ota, Nigeria

    Sanjay Misra

  4. University of Minho , Braga, Portugal

    Ana Maria A. C. Rocha

  5. Polytechnic University , Bari, Italy

    Carmelo M. Torre

  6. Monash University , Clayton, Victoria, Australia

    David Taniar

  7. Kyushu Sangyo University , Fukuoka, Japan

    Bernady O. Apduhan

  8. Saint Petersburg State University , Saint Petersburg, Russia

    Elena Stankova

  9. Beijing University of Posts & Telecommunication , Beijing, China

    Shangguang Wang

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Sin, V.K., Teng, K.K., Deng, W.Y. (2016). Computational Investigation of Heat Transfer of Nanofluids in Microchannel with Improper Insulation. In: Gervasi, O., et al. Computational Science and Its Applications – ICCSA 2016. ICCSA 2016. Lecture Notes in Computer Science(), vol 9786. Springer, Cham. https://doi.org/10.1007/978-3-319-42085-1_39

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  • DOI: https://doi.org/10.1007/978-3-319-42085-1_39

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-42084-4

  • Online ISBN: 978-3-319-42085-1

  • eBook Packages: Computer ScienceComputer Science (R0)

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