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2010 – 2019
- 2015
[j6]C. H. Yu, D. Wang, Zhiguo He
, Thomas Pähtz:
An optimized dispersion-relation-preserving combined compact difference scheme to solve advection equations. J. Comput. Phys. 300: 92-115 (2015)- 2011
- [c1]Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu:
3D stacking using Cu-Cu direct bonding. 3DIC 2011: 1-4
2000 – 2009
- 2008
- [j5]Kyung-Seob Kim, C. H. Yu, S. W. Han, K. C. Yang, J. H. Kim:
Investigation of relation between intermetallic and tin whisker growths under ambient condition. Microelectron. Reliab. 48(1): 111-118 (2008) - 2006
- [j4]Kyung-Seob Kim, C. H. Yu, J. M. Yang:
Tin whisker formation of lead-free plated leadframes. Microelectron. Reliab. 46(7): 1080-1086 (2006) - 2005
- [j3]Kyung-Seob Kim, K. W. Ryu, C. H. Yu, J. M. Kim:
The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. Microelectron. Reliab. 45(3-4): 647-655 (2005) - 2004
- [j2]Kyung-Seob Kim, H. I. Kim, C. H. Yu, E. G. Chang:
Fatigue analysis of high-speed photodiode submodule by using FEM. Microelectron. Reliab. 44(1): 167-171 (2004) - 2003
- [j1]Kyung-Seob Kim, C. H. Yu, Nam-Hoon Kim, N. K. Kim, H. J. Chang, E. G. Chang:
Isothermal aging characteristics of Sn-Pb micro solder bumps. Microelectron. Reliab. 43(5): 757-763 (2003)
Coauthor Index
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