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ORCIDKi Jin Han
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2020 – today
- 2022
[j9]Sara Kaviani, Ki Jin Han
, Insoo Sohn:
Adversarial attacks and defenses on AI in medical imaging informatics: A survey. Expert Syst. Appl. 198: 116815 (2022)- [j8]Manje Yea, Jingook Kim, Ki Jin Han:
Frequency-Dependent Bearing Voltage Model for Squirrel-Cage Induction Motors. IEEE Trans. Ind. Electron. 69(5): 5071-5080 (2022) - [j7]Jeong Tak Kim, Hyoil Kim, Ki Jin Han:
Hyperloop Communications: Unveiling Electromagnetic Propagation in the Hyperloop Tube. IEEE Veh. Technol. Mag. 17(3): 65-74 (2022) - 2021
- [j6]Younggon Ryu, Manje Yea, Jingook Kim, Ki Jin Han:
Stator Impedance Modeling Platform for the Electromagnetic Compatibility Aware Design of 3.7- to 7.5-KW Squirrel-Cage Induction Motors. IEEE Trans. Ind. Electron. 68(11): 11255-11265 (2021) - 2020
- [j5]Byungjin Bae, Jingook Kim, Ki Jin Han:
Numerical Verification of Dielectric Contactor as Auxiliary Loads for Measuring the Multi-Port Network Parameter of Vertical Interconnection Array. IEEE Access 8: 117997-118004 (2020)
2010 – 2019
- 2019
- [j4]Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang:
Power Integrity Coanalysis Methodology for Multi-Domain High-Speed Memory Systems. IEEE Access 7: 95305-95313 (2019) - 2018
- [c3]Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang:
Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study. DATE 2018: 885-888 - 2017
- [j3]Han-Joon Kim, Hiroshi Hirayama, Sanghoek Kim, Ki Jin Han, Rui Zhang, Ji-Woong Choi:
Review of Near-Field Wireless Power and Communication for Biomedical Applications. IEEE Access 5: 21264-21285 (2017) - 2016
- [j2]Seungwon Kim, Seokhyeong Kang, Ki Jin Han, Youngmin Kim:
Novel Adaptive Power-Gating Strategy and Tapered TSV Structure in Multilayer 3D IC. ACM Trans. Design Autom. Electr. Syst. 21(3): 44:1-44:19 (2016) - 2015
- [c2]Seungwon Kim, Seokhyung Kang, Ki Jin Han, Youngmin Kim:
Novel adaptive power gating strategy of TSV-based multi-layer 3D IC. ISQED 2015: 537-541
2000 – 2009
- 2009
- [j1]Ki Jin Han, Madhavan Swaminathan:
Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 28(6): 846-859 (2009) - 2008
- [c1]Ki Jin Han, Madhavan Swaminathan, Ege Engin:
Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects. DAC 2008: 421-424
Coauthor Index
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