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2020 – today
- 2022
[c3]Kangqiang Pan, Amr M. S. Tosson, Ningxuan Wang, Norman Y. Zhou
, Lan Wei:
A Novel 2T2R CR-based TCAM Design for High-speed and Energy-efficient Applications. ACM Great Lakes Symposium on VLSI 2022: 33-38- 2021
- [c2]Kangqiang Pan, Amr M. S. Tosson, Norman Y. Zhou, Lan Wei:
A Novel Programmable Variation-Tolerant RRAM-based Delay Element Circuit. NANOARCH 2021: 1-2
2010 – 2019
- 2019
- [c1]Oliver Witham, Levi Nathan Johnston, Ming Xiao, Jiayun Feng, Norman Y. Zhou, George Shaker:
Batteryless Wireless Water Leak Detection System. SmartNets 2019: 1-4 - 2013
- [j11]Alireza Rezvani, Aashish Shah, M. Mayer, Norman Y. Zhou, J. T. Moon:
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. Microelectron. Reliab. 53(7): 1002-1008 (2013) - 2012
- [j10]Wan Ho Song, Michael Mayer, Norman Y. Zhou, S. H. Kim, J. S. Hwang, J. T. Moon:
Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding. Microelectron. Reliab. 52(11): 2744-2748 (2012) - 2011
- [j9]Jae-sik Lee, Michael Mayer, Norman Y. Zhou, J. T. Moon, John Persic:
Influence of gold pick up on the hardness of copper free air ball. Microelectron. Reliab. 51(1): 30-37 (2011) - [j8]Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong, J. T. Moon:
Silver pick up during tail formation in thermosonic wire bonding process. Microelectron. Reliab. 51(1): 38-42 (2011) - [j7]A. Pequegnat, H. J. Kim, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon:
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. Microelectron. Reliab. 51(1): 43-52 (2011) - [j6]I. Qin, Aashish Shah, C. Huynh, M. Meyer, M. Mayer, Norman Y. Zhou:
Role of process parameters on bondability and pad damage indicators in copper ball bonding. Microelectron. Reliab. 51(1): 60-66 (2011) - [j5]Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon:
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectron. Reliab. 51(1): 67-74 (2011)
2000 – 2009
- 2008
- [j4]Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong:
Erratum to "Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning": [Microelectronics Journal 38 (2007) 842-847]. Microelectron. J. 39(2): 299 (2008) - [j3]Chunjing Hang, Chunqing Wang, M. Mayer, Yanhong Tian, Norman Y. Zhou, Honghui Wang:
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectron. Reliab. 48(3): 416-424 (2008) - [j2]Young Woo Lee, Ki Ju Lee, Norman Y. Zhou, Jae Pil Jung:
Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings. Microelectron. Reliab. 48(4): 631-637 (2008) - 2007
- [j1]Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong:
Iterative optimization of tail breaking force of 1mil wire thermosonic ball bonding processes and the influence of plasma cleaning. Microelectron. J. 38(8-9): 842-847 (2007)
Coauthor Index
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