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Clément Castan

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2010 – 2019

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2019
[c2]
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  dblp key:
  - conf/3dic/BourjotSDLRBRSB19
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  - https://dblp.org/rec/conf/3dic/BourjotSDLRBRSB19
Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy:
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 3DIC 2019: 1-5
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Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger:
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. 3DIC 2019: 1-7

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