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2020 – today
- 2024
[c6]Prachi Shukla, Mohammadamin Hajikhodaverdian, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun:
Energy-Efficient Dataflow Design for Monolithic 3D Systolic Arrays with Resistive RAM. IGSC 2024: 67-73- [i2]Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun:
A New Dataflow Implementation to Improve Energy Efficiency of Monolithic 3D Systolic Arrays. CoRR abs/2401.03585 (2024) - 2023
- [b1]Prachi Shukla:
Temperature-aware 3D-integrated systolic array DNN accelerators. Boston University, USA, 2023 - [j3]Prachi Shukla
, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun:
TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3-D Mobile Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(12): 4350-4363 (2023) - [c5]Prachi Shukla, Derrick Aguren, Tom Burd, Ayse K. Coskun, John Kalamatianos:
Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads. DATE 2023: 1-6 - 2022
- [j2]Zihao Yuan, Prachi Shukla, Sofiane Chetoui, Sean S. Nemtzow, Sherief Reda, Ayse K. Coskun:
PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling Technologies. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(4): 1048-1061 (2022) - [i1]Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun:
Temperature-Aware Monolithic 3D DNN Accelerators for Biomedical Applications. CoRR abs/2203.15874 (2022) - 2021
- [j1]Krithika Dhananjay, Prachi Shukla, Vasilis F. Pavlidis, Ayse K. Coskun, Emre Salman:
Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects. IEEE Trans. Circuits Syst. II Express Briefs 68(3): 837-843 (2021) - [c4]Prachi Shukla, Sean S. Nemtzow, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun:
Temperature-Aware Optimization of Monolithic 3D Deep Neural Network Accelerators. ASP-DAC 2021: 709-714 - 2020
- [c3]Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Zhengmao Lu, Evelyn Wang, Sherief Reda, Ayse K. Coskun:
A Learning-Based Thermal Simulation Framework for Emerging Two-Phase Cooling Technologies. DATE 2020: 400-405
2010 – 2019
- 2019
- [c2]Prachi Shukla, Ayse K. Coskun, Vasilis F. Pavlidis, Emre Salman:
An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs. ACM Great Lakes Symposium on VLSI 2019: 439-444 - [c1]Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Sherief Reda, Evelyn Wang, Ayse K. Coskun:
Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers. ISLPED 2019: 1-6
Coauthor Index
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