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2020 – today
- 2024
[c7]Ming-En Shih, Shih-Wei Hsieh, Ping-Yuan Tsai, Ming-Hung Lin, Pei-Kuei Tsung, En-Jui Chang, Jenwei Liang, Shu-Hsin Chang, Chung-Lun Huang, You-Yu Nian, Zhe Wan, Sushil Kumar, Cheng-Xin Xue, Gajanan Jedhe, Hidehiro Fujiwara, Haruki Mori, Chih-Wei Chen, Po-Hua Huang, Chih-Feng Juan, Chung-Yi Chen, Tsung-Yao Lin, Ch Wang, Chih-Cheng Chen, Kevin Jou:
20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Engine for High-Resolution Visual-Quality Enhancement on Smart Devices. ISSCC 2024: 360-362- [c6]Chien-Hung Lin, Jeng-Yun Hsu, Cheng-Ying Yu, Chia-Wei Hsu, Yi-Min Tsai, Kuo-Sheng Wu, Chung-Lun Huang, Meng-Han Hsieh, Tsung-Yao Lin:
A Quad-Core AI Processing Unit for Generative AI in 4nm 5G Smartphone SoC. VLSI Technology and Circuits 2024: 1-2 - 2023
- [c5]En-Jui Chang, Cheng-Xin Xue, Chetan Deshpande, Gajanan Jedhe, Jenwei Liang, Chih-Chung Cheng, Hung-Wei Lin, Chia-Da Lee, Sushil Kumar, Kim Soon Jway, Zijie Guo, Ritesh Garg, Allen-Cl Lu, Chien-Hung Lin, Meng-Han Hsieh, Tsung-Yao Lin, Chih-Cheng Chen:
A 12-nm 0.62-1.61 mW Ultra-Low Power Digital CIM-based Deep-Learning System for End-to-End Always-on Vision. VLSI Technology and Circuits 2023: 1-2 - 2020
- [c4]Yueh-Shiu Lee, I-Yun Chen, Tsung-Yao Lin, Yen-Chiao Chuang, Hsu-Jung Liu:
Developing a Model to Explore Consumer Buying Behaviors through Long Short-Term Memory. ICEA 2020: 11:1-11:3 - [c3]Chien-Hung Lin, Chih-Chung Cheng, Yi-Min Tsai, Sheng-Je Hung, Yu-Ting Kuo, Perry H. Wang, Pei-Kuei Tsung, Jeng-Yun Hsu, Wei-Chih Lai, Chia-Hung Liu, Shao-Yu Wang, Chin-Hua Kuo, Chih-Yu Chang, Ming-Hsien Lee, Tsung-Yao Lin, Chih-Cheng Chen:
7.1 A 3.4-to-13.3TOPS/W 3.6TOPS Dual-Core Deep-Learning Accelerator for Versatile AI Applications in 7nm 5G Smartphone SoC. ISSCC 2020: 134-136
2010 – 2019
- 2016
- [c2]Tsung-Yao Lin, Ming-Hsien Lee, Loda Chou, Clavin Peng, Jih-Ming Hsu, Jia-Ming Chen, John-CC Chen, Alex Chiou, Artis Chiu, David Lee, Carrie Huang, Kenny Lee, TzuHeng Wang, Wei-Ting Wang, Yenchi Lee, Chi-Hui Wang, Pao-Ching Tseng, Ryan Chen, Kevin Jou:
Helio X20: The first tri-gear mobile SoC with CorePilot™ 3.0 technology. Hot Chips Symposium 2016: 1-24 - 2014
- [c1]Alice Wang, Tsung-Yao Lin, Shichin Ouyang, Wei-Hung Huang, Jidong Wang, Shu-Hsin Chang, Sheng-Ping Chen, Chun-Hsiung Hu, J. C. Tai, Koan-Sin Tan, Meng-Nan Tsou, Ming-Hsien Lee, Gordon Gammie, Chi-Wei Yang, Chih-Chieh Yang, Yeh-Chi Chou, Shih-Hung Lin, Wuan Kuo, Chi-Jui Chung, Lee-Kee Yong, Chia-Wei Wang, Kin Hooi Dia, Cheng-Hsing Chien, You-Ming Tsao, N. K. Singh, Rolf Lagerquist, Chih-Cheng Chen, Uming Ko:
10.3 heterogeneous multi-processing quad-core CPU and dual-GPU design for optimal performance, power, and thermal tradeoffs in a 28nm mobile application processor. ISSCC 2014: 180-181
Coauthor Index
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