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2020 – today
- 2024
[j22]Yimeng Yan
, Jiaxi Cao, Yufan Gu, Xuening Huang, Xiaoxian Liu, Yue Hu, Shuhong Wu:
An Evaluation of Ecosystem Quality and Its Response to Aridity on the Qinghai-Tibet Plateau. Remote. Sens. 16(18): 3461 (2024)- 2023
- [j21]Chenhui Fan, Xiaoxian Liu, Nuo Liu, Yintang Yang:
A Ka-band fourth-order SIW filter power divider with wide out-of-band suppression. Microelectron. J. 133: 105700 (2023) - [j20]Nuo Liu, Xiaoxian Liu, Chenhui Fan:
Filtering SIW phase shifter based on through quartz vias technology. Microelectron. J. 136: 105793 (2023) - [j19]Lei Wang, Xiaoxian Liu, Yunfei En, Zhangming Zhu:
A Composite Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Fields. IEEE Trans. Circuits Syst. II Express Briefs 70(2): 521-525 (2023) - [j18]Xiaoxian Liu, Yang Liu, Tao Zhang, Qijun Lu, Zhangming Zhu:
Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband. IEEE Trans. Circuits Syst. II Express Briefs 70(2): 526-530 (2023) - [j17]Lei Wang, Xiaoxian Liu, Chengyang Luo, Zhangming Zhu:
A Resonant Magnetic Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Field Components. IEEE Trans. Circuits Syst. II Express Briefs 70(12): 4354-4358 (2023) - 2022
- [j16]Chenhui Fan, Xiaoxian Liu, Nuo Liu, Yintang Yang, Zhangming Zhu:
An effective method to suppress high-order modes of SIW filters with compact size. Microelectron. J. 127: 105519 (2022) - 2021
- [j15]Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu:
Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. 116: 105217 (2021) - [j14]Chenbing Qu, Zhangming Zhu, Yunfei En, Liwei Wang, Xiaoxian Liu:
Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications. IEEE Trans. Very Large Scale Integr. Syst. 29(2): 287-296 (2021) - 2020
- [j13]Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang:
Physics based scalable inductance model for three-dimensional solenoid inductors. Microelectron. J. 103: 104867 (2020) - [j12]Haoyu Zhuang, He Tang, Xiaoxian Liu:
Voltage Comparator With 60% Faster Speed by Using Charge Pump. IEEE Trans. Circuits Syst. 67-II(12): 2923-2927 (2020) - [j11]Haoyu Zhuang, Xiaoxian Liu, Hao Wang:
Voltage Reference With Linear-Temperature-Dependent Power Consumption. IEEE Trans. Very Large Scale Integr. Syst. 28(4): 1043-1049 (2020)
2010 – 2019
- 2019
- [j10]Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang:
Electromagnetic modeling and analysis of the tapered differential through glass vias. Microelectron. J. 83: 27-31 (2019) - [j9]Yang Liu, Zhangming Zhu, Xiaoxian Liu, Lixin Guo, Yintang Yang:
Broadband inductance modeling of TXVs for 3D interconnection. Microelectron. J. 88: 56-60 (2019) - 2018
- [j8]Yang Liu, Zhangming Zhu, Xiaoxian Liu, Huaxi Gu, Lixin Guo:
Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV). IEICE Electron. Express 15(24): 20180878 (2018) - [c4]Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang:
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density. APCCAS 2018: 439-442 - 2014
- [j7]Yintang Yang, Xiaoxian Liu, Zhangming Zhu, Ruixue Ding:
Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs. IEICE Electron. Express 11(14): 20140504 (2014) - [j6]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Capacitance characterization of tapered through-silicon-via considering MOS effect. Microelectron. J. 45(2): 205-210 (2014) - [c3]Guiting Wang, Xiaoxian Liu, Licheng Jiao, Shuang Wang:
A multiscale region-based approach to automatic SAR image registration using CLPSO. IGARSS 2014: 5226-5229 - 2013
- [j5]Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding:
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. IEICE Electron. Express 10(14): 20130449 (2013) - [j4]Haoran Chen, Lin-An Yang, Xiaoxian Liu, Zhangming Zhu, Jun Luo, Yue Hao:
The impact of trapping centers on AlGaN/GaN resonant tunneling diode. IEICE Electron. Express 10(19): 20130588 (2013) - [j3]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 10(20): 20130666 (2013) - [j2]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV). IEICE Electron. Express 10(24): 20130894 (2013) - [j1]Haoran Chen, Lin-An Yang, Xiaoxian Liu, Zhangming Zhu, Jun Luo, Yue Hao:
Erratum: The impact of trapping centers on AlGaN/GaN resonant tunneling diode [IEICE Electronics Express Vol 10 (2013) No 19 pp 20130588]. IEICE Electron. Express 10(24): 20138002 (2013) - [c2]Xiaoxian Liu, Rongcai Zhao, Lin Han:
A Compile-Time Cost Model for Automatic OpenMP Decoupled Software Pipelining Parallelization. SNPD 2013: 253-260 - [c1]Xiaoxian Liu, Rongcai Zhao, Lin Han, Peng Liu:
An Automatic Parallel-Stage Decoupled Software Pipelining Parallelization Algorithm Based on OpenMP. TrustCom/ISPA/IUCC 2013: 1825-1831
Coauthor Index
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