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2020 – today
- 2021
[c8]Claire Besancon, Delphine Néel, Joan Ramirez, David Bitauld, Giancarlo Cerulo, Dalila Make, Nicolas Vaissiere, Frédéric Pommereau, Frank Fournel, Loic Sanchez, Cécilia Dupré, Viviane Muffato, Karim Hassan, Jean Decobert:
AlGaInAs MQW Laser Regrowth on Heterogenerous InP-on-SOI: Performance for Different Silicon Cavity Designs. OFC 2021: 1-3
2010 – 2019
- 2019
- [c7]Emilie Bourjot, Paul Stewart, Christophe Dubarry
, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy:
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 3DIC 2019: 1-5 - [c6]Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger:
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. 3DIC 2019: 1-7 - 2018
- [c5]Sylvie Menezo, Torrey Thiessen, Philippe Grosse, Joyce K. S. Poon, Christophe Jany, Jeremy Da Fonseca, Bertrand Szelag, Benoît Charbonnier, Georgio El-Zammar, Olivier Lemonnier, Patricia Bilondeau, Stephane Malhouitre, Brigitte Montmayeul, Loic Sanchez:
High-Speed Heterogeneous InP-on-Si Capacitive Phase Modulators. OFC 2018: 1-3 - 2015
- [c4]Helene Duprez, Antoine Descos, Thomas Ferrotti, Julie Harduin, Christophe Jany, T. Card, A. Myko, Loic Sanchez, Corrado Sciancalepore, Sylvie Menezo, Badhise Ben Bakir:
Heterogeneously integrated III-V on silicon distributed feedback lasers at 1310 nm. OFC 2015: 1-3 - 2013
- [c3]Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry:
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC 2013: 1-7 - 2011
- [c2]Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny:
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. 3DIC 2011: 1-5 - [c1]Perrine Batude, Maud Vinet, Arnaud Pouydebasque, Cyrille Le Royer, Bernard Previtali, Claude Tabone, Jean-Michel Hartmann, Loic Sanchez, Laurence Baud, Veronique Carron, Alain Toffoli, Fabienne Allain, Vincent Mazzocchi, Dominique Lafond, Simon Deleonibus, Olivier Faynot:
3D monolithic integration. ISCAS 2011: 2233-2236
Coauthor Index
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