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"Collective die-to-wafer bonding enabling low-loss evanescent coupling for ..."

Pengfei Xu et al. (2024)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2024-06-06

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  - conf/ofc/XuHKDPLGMBBVCVMBFC24
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  - https://dblp.org/rec/conf/ofc/XuHKDPLGMBBVCVMBFC24
Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout:
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. OFC 2024: 1-3

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