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2010 – 2019
- 2018
[j8]Chin-Li Kao, Tei-Chen Chen:
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes. Microelectron. Reliab. 82: 204-212 (2018)- 2016
- [j7]Yeonsung Kim
, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park:
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. Microelectron. Reliab. 65: 234-242 (2016) - 2014
- [j6]Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu:
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. Microelectron. Reliab. 54(11): 2471-2478 (2014) - 2010
- [j5]Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere:
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectron. Reliab. 50(4): 498-506 (2010)
2000 – 2009
- 2007
- [j4]Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu:
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47(8): 1273-1279 (2007) - 2006
- [j3]Yi-Shao Lai, Chin-Li Kao:
Characteristics of current crowding in flip-chip solder bumps. Microelectron. Reliab. 46(5-6): 915-922 (2006) - [j2]Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao:
Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectron. Reliab. 46(7): 1172-1182 (2006) - [j1]Yi-Shao Lai, Chin-Li Kao:
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectron. Reliab. 46(8): 1357-1368 (2006)
Coauthor Index
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