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Doo Kim

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2024
[c1]
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  dblp key:
  - conf/itc/GoelKPLNSKA24
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  persistent URL:
  - https://dblp.org/rec/conf/itc/GoelKPLNSKA24
Sandeep Kumar Goel, Moiz Khan, Ankita Patidar, Frank Lee, Vuong Nguyen, Bharath Shankaranarayanan, Doo Kim, Manish Arora:
Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests. ITC 2024: 51-55

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