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2020 – today
- 2023
[c8]Chew Wye Chan
, Boon Ping Gan, Wentong Cai:
Combining Time Series Data and Snapshot Data for Situation Aware Dispatching in Semiconductor Manufacturing. WSC 2023: 2310-2312- [c7]Patrick Stöckermann, Alessandro Immordino, Thomas Altenmüller, Georg Seidel, Martin Gebser, Pierre Tassel, Chew Wye Chan, Feifei Zhang:
Dispatching in Real Frontend Fabs With Industrial Grade Discrete-Event Simulations by Deep Reinforcement Learning with Evolution Strategies. WSC 2023: 3047-3058 - 2022
- [c6]Benedikt Schulz, Christoph Jacobi, Andrej Gisbrecht, Angelidis Evangelos, Chew Wye Chan, Boon Ping Gan:
Graph Representation and Embedding for Semiconductor Manufacturing Fab States. WSC 2022: 3382-3393 - 2020
- [c5]Moon Gi Seok, Chew Wye Chan, Wentong Cai, Hessam S. Sarjoughian, Daejin Park:
Runtime Abstraction-Level Conversion of Discrete-Event Wafer-fabrication Models for Simulation Acceleration. SIGSIM-PADS 2020: 83-92 - [c4]Chew Wye Chan, Boon Ping Gan, Wentong Cai:
Towards Situation Aware Dispatching in a Dynamic and Complex Manufacturing Environment. WSC 2020: 528-539
2010 – 2019
- 2019
- [c3]Georg Seidel, Patrick Preuss, Cevahir Canbolat, Soo Leen Low, Chew Wye Chan, Boon Ping Gan, Ching Foong Lee, Prakash Manogaran, Aik Ying Tang:
An Integration of Static and Dynamic Capacity Planning for a Ramping Fab. WSC 2019: 2304-2311 - 2018
- [c2]Georg Seidel, Patrick Preuss, André Naumann, Soo Leen Low, Chew Wye Chan, Boon-Ping Gan:
Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation. WSC 2018: 3651-3659 - 2017
- [c1]Georg Seidel, Ching Foong Lee, Ai Mei Kam, Boon-Ping Gan, Chew Wye Chan, André Naumann, Patrick Preuss:
Harmonizing operations management of key stakeholders in wafer fab using discrete event simulation. WSC 2017: 3670-3678
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