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M. J. Yim

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2000 – 2009

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2008
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J. S. Hwang, M. J. Yim, K. W. Paik:
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application. Microelectron. Reliab. 48(2): 293-299 (2008)

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