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K. Zoschke

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2011
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Toshiaki Itabashi, Masashi Kotani, Melvin P. Zussman, K. Zoschke, T. Fischer, M. Topper, Hiroyuki Ishida:
High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing. 3DIC 2011: 1-4

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