Microelectronics Reliability, Volume 87

Volume 87, August 2018

Special section on THERMINIC 2017

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  Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey:
  An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. 1-14
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  Ambika Prasad Shah, Nandakishor Yadav, Ankur Beohar, Santosh Kumar Vishvakarma:
  An efficient NBTI sensor and compensation circuit for stable and reliable SRAM cells. 15-23
• 
  Yuanqing Li, Li Chen, Issam Nofal, Mo Chen, Haibin Wang, Rui Liu, Qingyu Chen, Milos Krstic, Shuting Shi, Gang Guo, Sang H. Baeg, Shi-Jie Wen, Richard Wong:
  Modeling and analysis of single-event transient sensitivity of a 65 nm clock tree. 24-32

Special section on Prognostics and Health Management for Electronic Components and Systems

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  Wei He, Guan-Yu Hu, Zhi-Jie Zhou, Peili Qiao, Xiaoxia Han, Yuan-Yuan Qu, Hang Wei, Chun Shi:
  A new hierarchical belief-rule-based method for reliability evaluation of wireless sensor network. 33-51
• 
  D. Zhang, T. R. Li, J. W. Zhou, Y. C. Jiang, B. Ren, J. Huang, J. M. Zhang, Lin Wang, Ju Gao, L. J. Wang:
  Asymmetric resistive switching behaviour in a Au/a-C: Co/Au planar structure. 52-56
• 
  Hao Li, Mifang Cong, Ke Li, Huan Du:
  Source engineering on ruggedness and RF performance of n-channel RFLDMOS. 57-63
• 
  Qi Qin, Shuai Zhao, Shaowei Chen, Dengshan Huang, Jian Liang:
  Adaptive and robust prediction for the remaining useful life of electrolytic capacitors. 64-74
• 
  Hyunju Lee, Cheolmin Kim, Cheolho Heo, Chiho Kim, Jae-Ho Lee, Yangdo Kim:
  Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder. 75-80
• 
  Yuling Niu, Jing Wang, Shuai Shao, Huayan Wang, Hohyung Lee, Seungbae Park:
  A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. 81-88

Special section on THERMINIC 2017

• 
  Anton Alexeev, Genevieve Martin, Grigory Onushkin:
  Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs. 89-96

Special section on selection of best papers of EuroSimE 2017

• 
  Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne:
  Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. 97-105

Special section on Bias Temperature Instability (BTI) in MOS devices

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  D. Nouguier, X. Federspiel, Gérard Ghibaudo, M. Rafik, David Roy:
  New NBTI models for degradation and relaxation kinetics valid over extended temperature and stress/recovery ranges. 106-112

Special section on selection of best papers of EuroSimE 2017

• 
  Wolfgang Granig, Lisa-Marie Faller, Hubert Zangl:
  Sensor system optimization to meet reliability targets. 113-124
• 
  Karsten M. Decker, René M. Rehmann, Mike Roellig, Karlheinz Bock:
  Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. 125-132
• 
  Ahmed E. Hammad:
  Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb. 133-141

Special section on THERMINIC 2017

• 
  Adrian Bojita, Cristian Boianceanu, Marius Purcar, Ciprian Florea, Dan Simon, Cosmin-Sorin Plesa:
  A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits. 142-150
• 
  Wen Zhao, Chaohui He, Wei Chen, Rongmei Chen, Peitian Cong, Fengqi Zhang, Zujun Wang, Chen Shen, Lisang Zheng, Xiaoqiang Guo, Lili Ding:
  Single-event multiple transients in guard-ring hardened inverter chains of different layout designs. 151-157
• 
  Innocent Agbo, Mottaqiallah Taouil, Daniel Kraak, Said Hamdioui, Pieter Weckx, Stefan Cosemans, Francky Catthoor, Wim Dehaene:
  Impact and mitigation of SRAM read path aging. 158-167
• 
  Zhihong Wu, Su Xiezu, Zhu Yuan:
  IGBT junction and coolant temperature estimation by thermal model. 168-182
• 
  Weichao Liu, Xiang Fang, Qianqian Chen, Yingxin Li, Ting Li:
  Reliability analysis of an integrated device of ECG, PPG and pressure pulse wave for cardiovascular disease. 183-187
• 
  Ke Zhao, Nanxi Li, Boan Pan, Ting Li:
  Performance assessment of the NIRS-based medical system of evaluating therapeutic effect. 188-193
• 
  Lorenzo Codecasa, Robin Bornoff, James Dyson, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi:
  Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources. 194-205
• 
  Pham Luu Trung Duong, Hyunseok Park, Nagarajan Raghavan:
  Application of expectation maximization and Kalman smoothing for prognosis of lumen maintenance life for light emitting diodes. 206-212
• 
  P. Vigneshwara Raja, Neti V. L. Narasimha Murty:
  Thermal annealing studies in epitaxial 4H-SiC Schottky barrier diodes over wide temperature range. 213-221
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  Brice Rogié, Lorenzo Codecasa, Eric Monier-Vinard, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Dario D'Amore, Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi:
  Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. 222-231
• 
  Shuji Nishimoto, Seyed Ali Moeini, Toyo Ohashi, Yoshiyuki Nagatomo, F. Patrick McCluskey:
  Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications. 232-237

Special section on selection of best papers of EuroSimE 2017

• 
  Jürgen Auersperg, Ellen Auerswald, Christian Collet, Thierry Dean, Dietmar Vogel, Thomas Winkler, Sven Rzepka:
  Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor. 238-244

Special section on THERMINIC 2017

• 
  Piotr Zajac, Andrzej Napieralski:
  Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs. 245-258
• 
  Warin Sootkaneung, Suppachai Howimanporn, Sasithorn Chookaew:
  Temperature effects on BTI and soft errors in modern logic circuits. 259-270
• 
  Peng Fan, Shoudao Huang, Huai Wang, Huimin Li, Derong Luo:
  From chip to inverter: Electro-thermal modeling and design for paralleled power devices in high power application. 271-277
• 
  Asit Kumar Gain, Liangchi Zhang:
  Growth nature of in-situ Cu₆Sn₅-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity. 278-285
• 
  Wolfgang Goes, Yannick Wimmer, Al-Moatasem El-Sayed, Gerhard Rzepa, Markus Jech, Alexander L. Shluger, Tibor Grasser:
  Identification of oxide defects in semiconductor devices: A systematic approach linking DFT to rate equations and experimental evidence. 286-320