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2010 – 2019
- 2017
[c5]Attilio Belmonte, Ludovic Goux, Jiyong Woo, Umberto Celano
, Augusto Redolfi, Sergiu Clima, Gouri Sankar Kar:
Enhancement of CBRAM performance by controlled formation of a hourglass-shaped filament. NVMTS 2017: 1-5- 2015
- [c4]Attilio Belmonte, Andrea Fantini, Augusto Redolfi, M. Houssa, Malgorzata Jurczak, Ludovic Goux:
Optimization of the write algorithm at low-current (10μA) in Cu/Al2O3-based conductive-bridge RAM. ESSDERC 2015: 114-117 - [c3]C. Y. Chen, Ludovic Goux, Andrea Fantini, Robin Degraeve, Augusto Redolfi, Guido Groeseneken, Malgorzata Jurczak:
Engineering of a TiN\Al2O3\(Hf, Al)O2\Ta2O5\Hf RRAM cell for fast operation at low current. ESSDERC 2015: 262-265 - 2012
- [c2]Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen:
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4 - 2011
- [j1]Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne:
Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectron. Reliab. 51(9-11): 1856-1859 (2011)
2000 – 2009
- 2009
- [c1]Thomas Chiarella, Liesbeth Witters, Abdelkarim Mercha, Christoph Kerner, Rok Dittrich, Michal Rakowski, Claude Ortolland, Lars-Åke Ragnarsson, Bertrand Parvais, An De Keersgieter, Stefan Kubicek, Augusto Redolfi, R. Rooyackers, C. Vrancken, S. Brus, A. Lauwers, Philippe Absil, S. Biesemans, Thomas Y. Hoffmann:
Migrating from planar to FinFET for further CMOS scaling: SOI or bulk? ESSCIRC 2009: 84-87
1990 – 1999
- 1999
- [b1]Augusto Cesar Redolfi:
Projeto de fabricação de HBTs. University of Campinas, Brazil, 1999
Coauthor Index
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