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2020 – today
- 2023
[j2]Dongsuk Yoo
, Youngtae Jang, Youngchan Kim, Jihun Shin, Kangsun Lee, Seok-Yong Park, Seungho Shin, Hongsuk Lee, Seojoo Kim, Joongseok Park, Cheonho Park, Moosup Lim, Hyungjin Bae, Soeun Park, Minwook Jung, Sungkwan Kim, Shinyeol Choi, Sejun Kim, Jin-kyeong Heo, Hojoon Lee, KyungChoon Lee, Youngkyun Jeong, Youngsun Oh, Min-Sun Keel, Bumsuk Kim, Haechang Lee, JungChak Ahn:
Automotive 2.1 μm Full-Depth Deep Trench Isolation CMOS Image Sensor with a 120 dB Single-Exposure Dynamic Range. Sensors 23(22): 9150 (2023)- [c7]Jiheon Park, Daeyun Kim, Hoyong Lee, Seung-Chul Shin, Myoungoh Ki, Bumsik Chung, Myunghan Bae, Myeonggyun Kye, Jonghan Ahn, Inho Song, Sunhwa Lee, Jaeil An, Il-Pyeong Hwang, Taemin An, Young-Gu Jin, Youngchan Kim, Youngsun Oh, Juhyun Ko, Haechang Lee, Joonseo Yim:
An Indirect Time-of-Flight CMOS Image Sensor Achieving Sub-ms Motion Lagging and 60fps Depth Image from On-chip ISP. VLSI Technology and Circuits 2023: 1-2 - 2022
- [c6]Jaejin Jung, Sin-Hwan Lim, Jiyong Kim, Kwisung Yoo, Wontak Choi, Youngsun Oh, Juhyun Ko, Kyoungmin Koh:
A 1/1.33-inch 108Mpixel CMOS Image Sensor with 0.8um unit NONACELL pixels. ISCAS 2022: 288-291 - 2021
- [j1]Min-Sun Keel, Daeyun Kim, Yeomyung Kim, Myunghan Bae, Myoungoh Ki, Bumsik Chung, Sooho Son, Hoyong Lee, Seung-Chul Shin, Myeonggyun Kye, Jaeil An, Yonghun Kwon, Sungyoung Seo, Sunghyuck Cho, Youngchan Kim, Young-Gu Jin, Youngsun Oh, Yitae Kim, JungChak Ahn, Jesuk Lee:
A 1.2-Mpixel Indirect Time-of-Flight Image Sensor With 4-Tap 3.5-μm Pixels for Peak Current Mitigation and Multi-User Interference Cancellation. IEEE J. Solid State Circuits 56(11): 3209-3219 (2021) - [c5]Min-Sun Keel, Daeyun Kim, Yeomyung Kim, Myunghan Bae, Myoungoh Ki, Bumsik Chung, Sooho Son, Hoyong Lee, Heeyoung Jo, Seung-Chul Shin, Sunjoo Hong, Jaeil An, Yonghun Kwon, Sungyoung Seo, Sunghyuck Cho, Youngchan Kim, Young-Gu Jin, Youngsun Oh, Yitae Kim, JungChak Ahn, Kyoungmin Koh, Yongin Park:
A 4-tap 3.5 μm 1.2 Mpixel Indirect Time-of-Flight CMOS Image Sensor with Peak Current Mitigation and Multi-User Interference Cancellation. ISSCC 2021: 106-108 - 2020
- [c4]Hyunchul Kim, Jongeun Park, Insung Joe, Doowon Kwon, Joo Hyoung Kim, Dongsuk Cho, Taehun Lee, Changkyu Lee, Haeyong Park, Soojin Hong, Chongkwang Chang, Jingyun Kim, Hanjin Lim, Youngsun Oh, Yitae Kim, Seungjoo Nah, Sangil Jung, Jaekyu Lee, JungChak Ahn, Hyeongsun Hong, Kyupil Lee, Ho-Kyu Kang:
5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7µm Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology. ISSCC 2020: 104-106
2010 – 2019
- 2018
- [c3]Yitae Kim, Wonchul Choi, Donghyuk Park, Heegeun Jeoung, Bumsuk Kim, Youngsun Oh, Sunghoon Oh, Byungjun Park, Euiyeol Kim, Yunki Lee, Taesub Jung, Yongwoon Kim, Sukki Yoon, Seokyong Hong, Jesuk Lee, Sangil Jung, Changrok Moon, Yongin Park, Duckhyung Lee, Duckhyun Chang:
A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9μm unit pixels separated by full-depth deep-trench isolation. ISSCC 2018: 84-86 - 2014
- [c2]JungChak Ahn, Kyungho Lee, Yitae Kim, Heegeun Jeong, Bumsuk Kim, Hongki Kim, Jongeun Park, Taesub Jung, Wonje Park, Taeheon Lee, Eunkyung Park, Sangjun Choi, Gyehun Choi, Haeyong Park, Yujung Choi, Seungwook Lee, Yunkyung Kim, Y. J. Jung, Donghyuk Park, Seungjoo Nah, Youngsun Oh, Mihye Kim, Yooseung Lee, Youngwoo Chung, Ihara Hisanori, Joon-Hyuk Im, Daniel-K J Lee, Byunghyun Yim, GiDoo Lee, Heesang Kown, Sungho Choi, Jeonsook Lee, Dongyoung Jang, Youngchan Kim, Tae Chan Kim, Hiroshige Goto, Chi-Young Choi, Duckhyung Lee, Gab-soo Han:
7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate. ISSCC 2014: 124-125 - 2012
- [c1]Manlyun Ha, Sun Choi, DongHun Cho, Hosoo Kim, Jungyeon Cho, Youngsun Oh, Jongman Kim, Sangwon Yoon, Changhoon Choi, Juneseok Lee, Juil Lee, Joon Hwang:
Sensitivity improvement in FSI CIS using the M1ToP™ smart process technique. ISOCC 2012: 317-319
Coauthor Index
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