乐胖代购免代理版

{"id":"https://openalex.org/W2884249193","doi":"https://doi.org/10.3390/s18072374","title":"Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin","display_name":"Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin","publication_year":2018,"publication_date":"2018-07-21","ids":{"openalex":"https://openalex.org/W2884249193","doi":"https://doi.org/10.3390/s18072374","mag":"2884249193","pmid":"https://pubmed.ncbi.nlm.nih.gov/30037093","pmcid":"https://www.ncbi.nlm.nih.gov/pmc/articles/6069481"},"language":"en","primary_location":{"is_oa":true,"landing_page_url":"https://doi.org/10.3390/s18072374","pdf_url":"https://www.mdpi.com/1424-8220/18/7/2374/pdf?version=1532413172","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_indexed_in_scopus":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true},"type":"article","type_crossref":"journal-article","indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.mdpi.com/1424-8220/18/7/2374/pdf?version=1532413172","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5042333206","display_name":"Mitsutoshi Makihata","orcid":"https://orcid.org/0000-0002-3503-8573"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"funder","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Mitsutoshi Makihata","raw_affiliation_strings":["Department of Robotics, Tohoku University, Miyagi 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Robotics, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037940534","display_name":"Masanori Muroyama","orcid":"https://orcid.org/0000-0002-6808-5106"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"funder","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masanori Muroyama","raw_affiliation_strings":["Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024253162","display_name":"Shuji Tanaka","orcid":"https://orcid.org/0000-0002-2663-3266"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"funder","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Shuji Tanaka","raw_affiliation_strings":["Department of Robotics, Tohoku University, Miyagi 980-8579, Japan","Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Robotics, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035083249","display_name":"Takahiro Nakayama","orcid":"https://orcid.org/0000-0001-8114-7618"},"institutions":[{"id":"https://openalex.org/I4210137853","display_name":"Toyota Motor Corporation (Japan)","ror":"https://ror.org/02zqm6r10","country_code":"JP","type":"funder","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210137853"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takahiro Nakayama","raw_affiliation_strings":["T-Frontier Div., Toyota Motor Corporation, Toyota, Aichi 470-0309, Japan"],"affiliations":[{"raw_affiliation_string":"T-Frontier Div., Toyota Motor Corporation, Toyota, Aichi 470-0309, Japan","institution_ids":["https://openalex.org/I4210137853"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008972576","display_name":"Yutaka Nonomura","orcid":"https://orcid.org/0000-0003-4281-1066"},"institutions":[{"id":"https://openalex.org/I4210165351","display_name":"Toyota Central Research and Development Laboratories (Japan)","ror":"https://ror.org/05mjgqe69","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210165351"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yutaka Nonomura","raw_affiliation_strings":["Toyota Central R&D Labs., Inc., Aichi 480-1192, Japan"],"affiliations":[{"raw_affiliation_string":"Toyota Central R&D Labs., Inc., Aichi 480-1192, Japan","institution_ids":["https://openalex.org/I4210165351"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5055348625","display_name":"Masayoshi Esashi","orcid":"https://orcid.org/0000-0001-8779-4306"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"funder","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Masayoshi Esashi","raw_affiliation_strings":["Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Microsystem Integration Center, Tohoku University, Miyagi 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5042333206","https://openalex.org/A5055348625"],"corresponding_institution_ids":["https://openalex.org/I201537933","https://openalex.org/I201537933"],"apc_list":{"value":2400,"currency":"CHF","value_usd":2598},"apc_paid":{"value":2400,"currency":"CHF","value_usd":2598},"fwci":1.424,"has_fulltext":true,"fulltext_origin":"pdf","cited_by_count":21,"citation_normalized_percentile":{"value":0.70242,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":92},"biblio":{"volume":"18","issue":"7","first_page":"2374","last_page":"2374"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9997,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9997,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9968,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tactile-sensor","display_name":"Tactile sensor","score":0.72511154},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.46601418}],"concepts":[{"id":"https://openalex.org/C46722567","wikidata":"https://www.wikidata.org/wiki/Q7674139","display_name":"Tactile sensor","level":3,"score":0.72511154},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.5592858},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.46601418},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.45443788},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42562273},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.40893793},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.395532},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.37036574},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.31535682},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.2377351},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.08689955}],"mesh":[{"descriptor_ui":"D032701","descriptor_name":"Biomimetics","qualifier_ui":"","qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":"","qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D012371","descriptor_name":"Robotics","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":true},{"descriptor_ui":"D014110","descriptor_name":"Touch","qualifier_ui":"","qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D025802","descriptor_name":"Electric Capacitance","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D006801","descriptor_name":"Humans","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D012371","descriptor_name":"Robotics","qualifier_ui":"","qualifier_name":null,"is_major_topic":false}],"locations_count":5,"locations":[{"is_oa":true,"landing_page_url":"https://doi.org/10.3390/s18072374","pdf_url":"https://www.mdpi.com/1424-8220/18/7/2374/pdf?version=1532413172","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_indexed_in_scopus":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true},{"is_oa":false,"landing_page_url":"https://doaj.org/article/e86ce0eca01547888d2cb6a020184533","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},{"is_oa":true,"landing_page_url":"https://europepmc.org/articles/pmc6069481","pdf_url":"https://europepmc.org/articles/pmc6069481?pdf=render","source":{"id":"https://openalex.org/S4306400806","display_name":"Europe PMC (PubMed Central)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":false,"host_organization":"https://openalex.org/I1303153112","host_organization_name":"European Bioinformatics Institute","host_organization_lineage":["https://openalex.org/I1303153112"],"host_organization_lineage_names":["European Bioinformatics Institute"],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true},{"is_oa":true,"landing_page_url":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6069481","pdf_url":null,"source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":["National Institutes of Health"],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true},{"is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/30037093","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":["National Institutes of Health"],"type":"repository"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":{"is_oa":true,"landing_page_url":"https://doi.org/10.3390/s18072374","pdf_url":"https://www.mdpi.com/1424-8220/18/7/2374/pdf?version=1532413172","source":{"id":"https://openalex.org/S101949793","display_name":"Sensors","issn_l":"1424-8220","issn":["1424-8220"],"is_oa":true,"is_in_doaj":true,"is_indexed_in_scopus":true,"is_core":true,"host_organization":"https://openalex.org/P4310310987","host_organization_name":"Multidisciplinary Digital Publishing Institute","host_organization_lineage":["https://openalex.org/P4310310987"],"host_organization_lineage_names":["Multidisciplinary Digital Publishing Institute"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true},"sustainable_development_goals":[{"score":0.7,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":18,"referenced_works":["https://openalex.org/W1980048359","https://openalex.org/W1980631841","https://openalex.org/W1983156320","https://openalex.org/W2002055806","https://openalex.org/W2014972957","https://openalex.org/W2023614418","https://openalex.org/W2069756028","https://openalex.org/W2073360954","https://openalex.org/W2080648734","https://openalex.org/W2083784951","https://openalex.org/W2125806176","https://openalex.org/W2151701782","https://openalex.org/W2290157520","https://openalex.org/W2330500869","https://openalex.org/W2497216985","https://openalex.org/W2594349701","https://openalex.org/W2743647503","https://openalex.org/W3103527158"],"related_works":["https://openalex.org/W4322731033","https://openalex.org/W4285102271","https://openalex.org/W4283740974","https://openalex.org/W4233135978","https://openalex.org/W3208690336","https://openalex.org/W3166001162","https://openalex.org/W3136079594","https://openalex.org/W3128324021","https://openalex.org/W2149004904","https://openalex.org/W1973262676"],"abstract_inverted_index":{"Covering":[0],"a":[1,5,20,35,54,68,99,102,114,135,140,145,149,161],"whole":[2],"surface":[3],"of":[4,37,104,148,184,190,197,204],"robot":[6],"with":[7,179],"tiny":[8],"sensors":[9],"which":[10,174],"can":[11],"measure":[12],"local":[13],"pressure":[14],"and":[15,39,50,74,82,113,139,157,169,187,211],"transmit":[16],"the":[17,62,95,105,111,154,158,180],"data":[18,178,191],"through":[19],"network":[21],"is":[22,45,200],"an":[23,28,83],"ideal":[24],"solution":[25],"to":[26,31,33,46,72,117],"give":[27],"artificial":[29],"skin":[30],"robots":[32],"improve":[34],"capability":[36],"action":[38],"safety.":[40],"The":[41,128],"crucial":[42],"technological":[43],"barrier":[44],"package":[47,75,214],"force":[48,77,155,182],"sensor":[49,78,156],"communication":[51,142],"function":[52],"in":[53,110,131],"small":[55,194],"volume.":[56],"In":[57],"this":[58,132,212],"paper,":[59],"we":[60],"propose":[61],"novel":[63],"device":[64],"structure":[65],"based":[66],"on":[67],"wafer":[69,115],"bonding":[70,116],"technology":[71],"integrate":[73],"capacitive":[76],"using":[79,98],"silicon":[80,119],"diaphragm":[81,120],"integrated":[84,125,153],"circuit":[85,138],"separately":[86],"manufactured.":[87],"Unique":[88],"fabrication":[89],"processes":[90],"are":[91],"developed,":[92],"such":[93],"as":[94],"feed-through":[96,112],"forming":[97],"dicing":[100],"process,":[101],"planarization":[103],"Benzocyclobutene":[106],"(BCB)":[107],"polymer":[108],"filled":[109],"stack":[118],"onto":[121],"ASIC":[122,129,159],"(application":[123],"specific":[124],"circuit)":[126],"wafer.":[127],"used":[130],"paper":[133],"has":[134],"capacitance":[136,196],"measurement":[137],"digital":[141,176],"interface":[143],"mimicking":[144],"tactile":[146],"receptor":[147],"human.":[150],"We":[151],"successfully":[152],"into":[160],"2.5":[162,164],"\u00d7":[163,165],"0.32.5\u00d72.5\u00d70.3":[166],"mm":[167],"die":[168],"confirmed":[170],"autonomously":[171],"transmitted":[172],"packets":[173],"contain":[175],"sensing":[177],"linear":[181],"sensitivity":[183],"57,640":[185],"Hz/N":[186],"10":[188,205],"mN":[189],"fluctuation.":[192],"A":[193],"stray":[195],"1.33":[198],"pF":[199],"achieved":[201],"by":[202],"use":[203],"\u03bcm":[206],"thick":[207],"BCB":[208],"isolation":[209],"layer":[210],"minimum":[213],"structure.":[215]},"abstract_inverted_index_v3":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2884249193","counts_by_year":[{"year":2023,"cited_by_count":6},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":7},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1}],"updated_date":"2025-03-17T04:31:50.204659","created_date":"2018-08-03"}