{"id":"https://openalex.org/W2946744628","doi":"https://doi.org/10.1145/3316781.3323486","title":"RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs","display_name":"RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs","publication_year":2019,"publication_date":"2019-05-23","ids":{"openalex":"https://openalex.org/W2946744628","doi":"https://doi.org/10.1145/3316781.3323486","mag":"2946744628"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1145/3316781.3323486","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022173483","display_name":"Heechun Park","orcid":"https://orcid.org/0000-0003-2796-518X"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Heechun Park","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088565714","display_name":"Kyungwook Chang","orcid":"https://orcid.org/0000-0002-8513-9890"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kyungwook Chang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041659450","display_name":"Bon Woong Ku","orcid":"https://orcid.org/0000-0001-9770-0297"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bon Woong Ku","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100434618","display_name":"Jinwoo Kim","orcid":"https://orcid.org/0000-0003-4380-6656"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jinwoo Kim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100670402","display_name":"Edward Lee","orcid":"https://orcid.org/0000-0002-5708-2866"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Edward Lee","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100374575","display_name":"Daehyun Kim","orcid":"https://orcid.org/0000-0002-5582-3579"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Daehyun Kim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090354528","display_name":"Arjun Chaudhuri","orcid":"https://orcid.org/0000-0001-9353-6397"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Arjun Chaudhuri","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Duke University"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Duke University","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052051759","display_name":"Sanmitra Banerjee","orcid":"https://orcid.org/0000-0002-1136-9220"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sanmitra Banerjee","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Duke University"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Duke University","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009591041","display_name":"Saibal Mukhopadhyay","orcid":"https://orcid.org/0000-0002-8894-3390"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Saibal Mukhopadhyay","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033880864","display_name":"Krishnendu Chakrabarty","orcid":"https://orcid.org/0000-0003-4475-6435"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krishnendu Chakrabarty","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Duke University"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Duke University","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung Kyu Lim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.323,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":8,"citation_normalized_percentile":{"value":0.928925,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":84,"max":85},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"Three-Dimensional Integrated Circuits","score":0.9998,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"Three-Dimensional Integrated Circuits","score":0.9998,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Memristive Devices for Neuromorphic Computing","score":0.9982,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Atomic Layer Deposition Technology","score":0.998,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.78136253},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.5954126},{"id":"https://openalex.org/keywords/resistive-switching","display_name":"Resistive Switching","score":0.528432},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-Silicon Via","score":0.515688},{"id":"https://openalex.org/keywords/resistive-touchscreen","display_name":"Resistive touchscreen","score":0.502146},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.4659162}],"concepts":[{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.78136253},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.5954126},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5407216},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.51012045},{"id":"https://openalex.org/C6899612","wikidata":"https://www.wikidata.org/wiki/Q852911","display_name":"Resistive touchscreen","level":2,"score":0.502146},{"id":"https://openalex.org/C182019814","wikidata":"https://www.wikidata.org/wiki/Q1143830","display_name":"Resistive random-access memory","level":3,"score":0.47748896},{"id":"https://openalex.org/C169590947","wikidata":"https://www.wikidata.org/wiki/Q47506","display_name":"Compiler","level":2,"score":0.47497648},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4659162},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4605339},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4263895},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4199497},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3376325},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25644994},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.22634867},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.21371049},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.15045264},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.09752908},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08796942}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1145/3316781.3323486","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.57,"display_name":"Industry, innovation and infrastructure"}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":14,"referenced_works":["https://openalex.org/W1559886496","https://openalex.org/W1966939297","https://openalex.org/W1972477204","https://openalex.org/W2002806561","https://openalex.org/W2010202670","https://openalex.org/W2095117703","https://openalex.org/W2106433082","https://openalex.org/W2127622278","https://openalex.org/W2160007566","https://openalex.org/W2168972302","https://openalex.org/W2538167498","https://openalex.org/W2791191785","https://openalex.org/W2794194363","https://openalex.org/W2885203734"],"related_works":["https://openalex.org/W4230980794","https://openalex.org/W3172718840","https://openalex.org/W3148440458","https://openalex.org/W2534143559","https://openalex.org/W2184778749","https://openalex.org/W2129188682","https://openalex.org/W2119428232","https://openalex.org/W2075511834","https://openalex.org/W2053991919","https://openalex.org/W2025009942"],"abstract_inverted_index":{"Monolithic":[0],"3D":[1,12,36,55,98],"IC":[2,13,56],"overcomes":[3],"the":[4,7],"limitation":[5],"of":[6],"existing":[8],"through-silicon-via":[9],"(TSV)":[10],"based":[11,40],"by":[14],"providing":[15],"denser":[16],"vertical":[17],"connections":[18],"with":[19],"nano-scale":[20],"inter-layer":[21],"vias":[22],"(ILVs).":[23],"In":[24],"this":[25],"paper,":[26],"we":[27,78],"demonstrate":[28],"a":[29,63,80],"thorough":[30],"RTL-to-GDS":[31],"design":[32],"flow":[33],"for":[34],"monolithic":[35,97],"IC,":[37],"which":[38],"is":[39],"on":[41,75],"commercial":[42],"2D":[43],"place-and-route":[44],"(P&R)":[45],"tools":[46],"and":[47,58],"clever":[48],"ways":[49],"to":[50,53,68,93],"extend":[51],"them":[52],"handle":[54],"designs":[57],"simulations.":[59],"We":[60],"also":[61],"provide":[62],"low-cost":[64],"built-in-self-test":[65],"(BIST)":[66],"method":[67],"detect":[69],"various":[70],"faults":[71],"that":[72,87,91],"can":[73],"occur":[74],"ILVs.":[76],"Lastly,":[77],"present":[79],"resistive":[81],"random":[82],"access":[83],"memory":[84,89],"(ReRAM)":[85],"compiler":[86],"generates":[88],"modules":[90],"are":[92],"be":[94],"integrated":[95],"in":[96],"ICs.":[99]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2946744628","counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":1}],"updated_date":"2024-11-18T06:46:07.483642","created_date":"2019-05-29"}