{"id":"https://openalex.org/W1966818311","doi":"https://doi.org/10.1142/s1465876303001253","title":"INFLUENCE OF APPLIED LOAD ON WAFER BONDING IN VACUUM","display_name":"INFLUENCE OF APPLIED LOAD ON WAFER BONDING IN VACUUM","publication_year":2003,"publication_date":"2003-06-01","ids":{"openalex":"https://openalex.org/W1966818311","doi":"https://doi.org/10.1142/s1465876303001253","mag":"1966818311"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1142/s1465876303001253","pdf_url":null,"source":{"id":"https://openalex.org/S107240834","display_name":"International Journal of Computational Engineering Science","issn_l":"1465-8763","issn":["1465-8763","2047-6086"],"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":true,"host_organization":"https://openalex.org/P4310311754","host_organization_name":"Imperial College Press","host_organization_lineage":["https://openalex.org/P4310311754"],"host_organization_lineage_names":["Imperial College Press"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5057748525","display_name":"Weibo Yu","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"W. B. YU","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027428789","display_name":"Jianguo Wei","orcid":"https://orcid.org/0000-0002-8964-9759"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"J. WEI","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045004316","display_name":"Cher Ming Tan","orcid":"https://orcid.org/0000-0002-6330-3899"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"C. M. TAN","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111072717","display_name":"S. S. Deng","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S. S. DENG","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5009611141","display_name":"Mui Ling Sharon Nai","orcid":"https://orcid.org/0000-0001-8340-952X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"M. L. NAI","raw_affiliation_strings":[],"affiliations":[]}],"institution_assertions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":1,"citation_normalized_percentile":{"value":0.432073,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":59,"max":66},"biblio":{"volume":"04","issue":"02","first_page":"351","last_page":"354"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9984,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer Bonding","score":0.66179156}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.79095924},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.66179156},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.47007328},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4238383},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3659613},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34027666},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3065617}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1142/s1465876303001253","pdf_url":null,"source":{"id":"https://openalex.org/S107240834","display_name":"International Journal of Computational Engineering Science","issn_l":"1465-8763","issn":["1465-8763","2047-6086"],"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":true,"host_organization":"https://openalex.org/P4310311754","host_organization_name":"Imperial College Press","host_organization_lineage":["https://openalex.org/P4310311754"],"host_organization_lineage_names":["Imperial College Press"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Clean water and sanitation","id":"https://metadata.un.org/sdg/6","score":0.44}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":11,"referenced_works":["https://openalex.org/W1560224562","https://openalex.org/W1977747200","https://openalex.org/W1978002271","https://openalex.org/W1986456852","https://openalex.org/W1992329450","https://openalex.org/W1994196515","https://openalex.org/W2001399601","https://openalex.org/W2023833901","https://openalex.org/W2027516477","https://openalex.org/W2057976060","https://openalex.org/W2081539999"],"related_works":["https://openalex.org/W790172873","https://openalex.org/W3043339446","https://openalex.org/W2540312267","https://openalex.org/W2488020685","https://openalex.org/W2228105431","https://openalex.org/W2082419378","https://openalex.org/W2073096817","https://openalex.org/W2068447932","https://openalex.org/W2053597733","https://openalex.org/W2001320522"],"abstract_inverted_index":null,"abstract_inverted_index_v3":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W1966818311","counts_by_year":[],"updated_date":"2025-04-16T21:46:41.869296","created_date":"2016-06-24"}