乐胖代购免代理版

{"id":"https://openalex.org/W2554363318","doi":"https://doi.org/10.1109/tvlsi.2016.2623810","title":"Chain-Based Approach for Fast Through-Silicon-Via Coupling Delay Estimation","display_name":"Chain-Based Approach for Fast Through-Silicon-Via Coupling Delay Estimation","publication_year":2016,"publication_date":"2016-11-17","ids":{"openalex":"https://openalex.org/W2554363318","doi":"https://doi.org/10.1109/tvlsi.2016.2623810","mag":"2554363318"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2016.2623810","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080721285","display_name":"Jaewon Jang","orcid":"https://orcid.org/0000-0003-1908-0015"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaewon Jang","raw_affiliation_strings":["Yonsei University, Seoul, South Korea"],"affiliations":[{"raw_affiliation_string":"Yonsei University, Seoul, South Korea","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069055460","display_name":"Minho Cheong","orcid":"https://orcid.org/0000-0003-3319-6647"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Minho Cheong","raw_affiliation_strings":["Yonsei University, Seoul, South Korea"],"affiliations":[{"raw_affiliation_string":"Yonsei University, Seoul, South Korea","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108568760","display_name":"Jin-Ho Ahn","orcid":null},"institutions":[{"id":"https://openalex.org/I162706563","display_name":"Hoseo University","ror":"https://ror.org/01qyd4k24","country_code":"KR","type":"education","lineage":["https://openalex.org/I162706563"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jin-Ho Ahn","raw_affiliation_strings":["Department of Electronic Engineering, Hoseo University, Chungnam, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Electronic Engineering, Hoseo University, Chungnam, South Korea","institution_ids":["https://openalex.org/I162706563"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung Kyu Lim","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068528309","display_name":"Sungho Kang","orcid":"https://orcid.org/0000-0002-7093-2095"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sungho Kang","raw_affiliation_strings":["Yonsei University, Seoul, South Korea"],"affiliations":[{"raw_affiliation_string":"Yonsei University, Seoul, South Korea","institution_ids":["https://openalex.org/I193775966"]}]}],"institution_assertions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.121,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":1,"citation_normalized_percentile":{"value":0.353581,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":66,"max":73},"biblio":{"volume":"25","issue":"3","first_page":"1178","last_page":"1182"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9928,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9928,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-Silicon Via","score":0.5543209},{"id":"https://openalex.org/keywords/chain","display_name":"Chain (unit)","score":0.52701414},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.45329422}],"concepts":[{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.74687874},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.591749},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5543209},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5414223},{"id":"https://openalex.org/C199185054","wikidata":"https://www.wikidata.org/wiki/Q552299","display_name":"Chain (unit)","level":2,"score":0.52701414},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.45329422},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4458886},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.40660012},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2158181},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16977376},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.09357482},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07145867},{"id":"https://openalex.org/C1276947","wikidata":"https://www.wikidata.org/wiki/Q333","display_name":"Astronomy","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2016.2623810","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.44,"id":"https://metadata.un.org/sdg/9"}],"grants":[{"funder":"https://openalex.org/F4320320671","funder_display_name":"National Research Foundation","award_id":"2015R1A2A1A13001751"},{"funder":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea","award_id":null}],"datasets":[],"versions":[],"referenced_works_count":9,"referenced_works":["https://openalex.org/W1964410717","https://openalex.org/W1978639190","https://openalex.org/W2003631910","https://openalex.org/W2059612698","https://openalex.org/W2155707315","https://openalex.org/W2160837841","https://openalex.org/W2161129061","https://openalex.org/W2162454039","https://openalex.org/W3140078554"],"related_works":["https://openalex.org/W4385062230","https://openalex.org/W3093450488","https://openalex.org/W2534942874","https://openalex.org/W2376702355","https://openalex.org/W2333804548","https://openalex.org/W2084347051","https://openalex.org/W2027159884","https://openalex.org/W2016970881","https://openalex.org/W2016589506","https://openalex.org/W1990828594"],"abstract_inverted_index":{"A":[0],"chain-based":[1],"coupling":[2,28,47],"delay":[3,29,48],"estimation":[4],"method":[5,43,58,78],"for":[6],"through-silicon-vias":[7],"(TSVs)":[8],"in":[9,88],"3-D":[10],"integrated":[11],"circuits":[12],"is":[13,82],"proposed.":[14],"Existing":[15],"works":[16],"target":[17],"the":[18,32,45,63,73],"worst":[19,33],"case":[20,34],"scenarios":[21],"and":[22],"this":[23],"leads":[24],"to":[25,61],"inaccurate":[26],"TSV":[27,46,56],"estimations,":[30],"as":[31],"may":[35],"not":[36],"occur":[37],"during":[38],"normal":[39],"operation.":[40],"The":[41],"proposed":[42],"calculates":[44],"using":[49,80],"simulation-based":[50],"switching":[51],"data.":[52],"In":[53],"addition,":[54],"our":[55,77],"chain":[57],"allows":[59],"us":[60],"capture":[62],"effects":[64],"of":[65],"nonneighboring":[66],"TSVs":[67],"accurately.":[68],"Our":[69],"simulations":[70],"show":[71],"that":[72],"error":[74],"introduced":[75],"by":[76],"without":[79],"HSPICE":[81],"less":[83],"than":[84],"10":[85],"ps":[86],"even":[87],"TSV-crowded":[89],"regions.":[90]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2554363318","counts_by_year":[{"year":2019,"cited_by_count":1}],"updated_date":"2025-01-17T21:48:42.781985","created_date":"2016-11-30"}