乐胖代购免代理版

{"id":"https://openalex.org/W4386952622","doi":"https://doi.org/10.1109/socc58585.2023.10256973","title":"Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution","display_name":"Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution","publication_year":2023,"publication_date":"2023-09-05","ids":{"openalex":"https://openalex.org/W4386952622","doi":"https://doi.org/10.1109/socc58585.2023.10256973"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc58585.2023.10256973","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://arxiv.org/pdf/2309.10141","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101411765","display_name":"S. Krishnakumar","orcid":"https://orcid.org/0009-0009-6339-8718"},"institutions":[{"id":"https://openalex.org/I39422238","display_name":"University of Illinois Chicago","ror":"https://ror.org/02mpq6x41","country_code":"US","type":"education","lineage":["https://openalex.org/I39422238"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sriharini Krishnakumar","raw_affiliation_strings":["Electrical and Computer Engineering, University of Illinois Chicago, Chicago, IL, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, University of Illinois Chicago, Chicago, IL, USA","institution_ids":["https://openalex.org/I39422238"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027004922","display_name":"Inna P.-Vaisband","orcid":"https://orcid.org/0000-0002-6399-6672"},"institutions":[{"id":"https://openalex.org/I39422238","display_name":"University of Illinois Chicago","ror":"https://ror.org/02mpq6x41","country_code":"US","type":"education","lineage":["https://openalex.org/I39422238"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Inna Partin-Vaisband","raw_affiliation_strings":["Electrical and Computer Engineering, University of Illinois Chicago, Chicago, IL, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, University of Illinois Chicago, Chicago, IL, USA","institution_ids":["https://openalex.org/I39422238"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.557,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.547354,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10175","display_name":"Advanced DC-DC Converters","score":0.9986,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9979,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/power-module","display_name":"Power module","score":0.63573647},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.49007165},{"id":"https://openalex.org/keywords/power-density","display_name":"Power density","score":0.4443976}],"concepts":[{"id":"https://openalex.org/C141812795","wikidata":"https://www.wikidata.org/wiki/Q7236534","display_name":"Power module","level":3,"score":0.63573647},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.60801756},{"id":"https://openalex.org/C129014197","wikidata":"https://www.wikidata.org/wiki/Q906544","display_name":"Power semiconductor device","level":3,"score":0.5360973},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4991753},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.49007165},{"id":"https://openalex.org/C151799858","wikidata":"https://www.wikidata.org/wiki/Q587008","display_name":"Switched-mode power supply","level":3,"score":0.48906502},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.47070906},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.47048524},{"id":"https://openalex.org/C2778871202","wikidata":"https://www.wikidata.org/wiki/Q411713","display_name":"Gallium nitride","level":3,"score":0.44441006},{"id":"https://openalex.org/C21881925","wikidata":"https://www.wikidata.org/wiki/Q3503313","display_name":"Power density","level":3,"score":0.4443976},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.44036773},{"id":"https://openalex.org/C64424096","wikidata":"https://www.wikidata.org/wiki/Q750454","display_name":"Power factor","level":3,"score":0.43956763},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39072758},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3833597},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33268887},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.32049662},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.20999333},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12712625},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc58585.2023.10256973","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},{"is_oa":true,"landing_page_url":"https://arxiv.org/abs/2309.10141","pdf_url":"https://arxiv.org/pdf/2309.10141","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":["Cornell University"],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false}],"best_oa_location":{"is_oa":true,"landing_page_url":"https://arxiv.org/abs/2309.10141","pdf_url":"https://arxiv.org/pdf/2309.10141","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":["Cornell University"],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.84}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":14,"referenced_works":["https://openalex.org/W2021764121","https://openalex.org/W2053920414","https://openalex.org/W2062346707","https://openalex.org/W2155135469","https://openalex.org/W2345293957","https://openalex.org/W2470210059","https://openalex.org/W2615393645","https://openalex.org/W2947003543","https://openalex.org/W3036878841","https://openalex.org/W3048109806","https://openalex.org/W3135920459","https://openalex.org/W4285103234","https://openalex.org/W4286571617","https://openalex.org/W4312576493"],"related_works":["https://openalex.org/W4377000134","https://openalex.org/W4317382130","https://openalex.org/W2784118911","https://openalex.org/W2384599920","https://openalex.org/W2207954180","https://openalex.org/W2182475138","https://openalex.org/W2094776484","https://openalex.org/W2082071357","https://openalex.org/W2077026322","https://openalex.org/W2012298973"],"abstract_inverted_index":{"Efficient":[0],"delivery":[1,75,114,180],"of":[2,55,72,145],"current":[3,79],"from":[4],"PCB":[5],"to":[6,27,60,68],"point-of-load":[7],"(POL)":[8],"is":[9,25,64,150,161],"a":[10,20,65,82,157,188],"primary":[11],"concern":[12],"in":[13,95,118],"modern":[14],"high-power":[15],"high-density":[16],"integrated":[17],"systems.":[18],"Traditionally,":[19],"48":[21],"V":[22],"power":[23,44,74,104,113,123,139,154,159,167,174,190],"signal":[24],"converted":[26],"the":[28,33,42,51,56,70,73,148],"low,":[29],"POL":[30],"voltage":[31,48,84,129],"at":[32,81],"board":[34],"and/or":[35,146],"package":[36],"level.":[37],"As":[38],"interconnect":[39,58],"has":[40],"become":[41],"dominant":[43],"loss":[45],"component,":[46],"minimizing":[47],"drop":[49],"across":[50],"laterally":[52],"routed":[53],"portions":[54],"board-to-die":[57],"(referred":[59],"as":[61],"horizontal":[62],"interconnect)":[63],"promising":[66],"approach":[67],"enhance":[69],"efficiency":[71,105],"system.":[76,201],"Delivering":[77],"lower":[78],"vertically,":[80],"higher":[83,96],"should":[85],"therefore":[86],"be":[87],"considered.":[88],"High-power":[89],"conversion":[90,130,168,175],"near":[91],"POL,":[92],"however,":[93],"results":[94],"switching":[97],"and":[98,128,135,141,172],"inductor":[99],"losses,":[100],"exhibiting":[101],"an":[102],"undesired":[103],"tradeoff.":[106],"To":[107],"address":[108],"this":[109,119],"problem,":[110],"four":[111],"vertical":[112],"architectures":[115,184],"are":[116,170,177,185],"proposed":[117],"paper,":[120],"considering":[121],"state-of-the-art":[122,173],"converter":[124],"topologies,":[125],"integration":[126],"levels,":[127],"schemes.":[131],"Embedding":[132],"Silicon":[133],"(Si)":[134],"Gallium":[136],"Nitride":[137],"(GaN)":[138],"devices":[140,155],"inductors":[142],"on":[143,156],"top":[144],"within":[147],"interposer":[149],"investigated.":[151],"Integrating":[152],"GaN":[153],"dedicated":[158],"die":[160],"also":[162],"discussed.":[163],"Various":[164],"multistage":[165],"48V-to-1V":[166],"schemes":[169],"examined":[171],"circuits":[176],"reviewed.":[178],"Power":[179],"characteristics":[181],"with":[182],"these":[183],"determined":[186],"for":[187],"high":[189],"(1":[191],"kW)":[192],"high-current":[193],"density":[194],"(2":[195],"A/mm":[196],"2":[199],")":[200]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W4386952622","counts_by_year":[{"year":2024,"cited_by_count":4}],"updated_date":"2024-12-09T05:31:16.196476","created_date":"2023-09-23"}