{"id":"https://openalex.org/W3000031249","doi":"https://doi.org/10.1109/sensors43011.2019.8956701","title":"Extensive Sensitivity Enhancement in Stacked Capacitive Tactile Sensors","display_name":"Extensive Sensitivity Enhancement in Stacked Capacitive Tactile Sensors","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3000031249","doi":"https://doi.org/10.1109/sensors43011.2019.8956701","mag":"3000031249"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors43011.2019.8956701","pdf_url":null,"source":{"id":"https://openalex.org/S4306418818","display_name":"IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007383953","display_name":"Yu-Hao Jen","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Hao Jen","raw_affiliation_strings":["Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027569262","display_name":"Chia-Tso Mo","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Tso Mo","raw_affiliation_strings":["Institute of NanoEngineering and MicroSystems, National Tsing Hua University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Institute of NanoEngineering and MicroSystems, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081816543","display_name":"Kean C. Aw","orcid":"https://orcid.org/0000-0001-9308-508X"},"institutions":[{"id":"https://openalex.org/I154130895","display_name":"University of Auckland","ror":"https://ror.org/03b94tp07","country_code":"NZ","type":"education","lineage":["https://openalex.org/I154130895"]}],"countries":["NZ"],"is_corresponding":false,"raw_author_name":"Kean Aw","raw_affiliation_strings":["Department of Mechanical Engineering, University of Auckland, Auckland, New Zealand"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Auckland, Auckland, New Zealand","institution_ids":["https://openalex.org/I154130895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075309178","display_name":"Daisuke Yamane","orcid":"https://orcid.org/0000-0002-9262-4704"},"institutions":[{"id":"https://openalex.org/I114531698","display_name":"Tokyo Institute of Technology","ror":"https://ror.org/0112mx960","country_code":"JP","type":"education","lineage":["https://openalex.org/I114531698"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Daisuke Yamane","raw_affiliation_strings":["Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology, Tokyo, Japan"],"affiliations":[{"raw_affiliation_string":"Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology, Tokyo, Japan","institution_ids":["https://openalex.org/I114531698"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061546647","display_name":"Cheng\u2010Yao Lo","orcid":"https://orcid.org/0000-0002-0360-2862"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Yao Lo","raw_affiliation_strings":["Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]}],"institution_assertions":[],"countries_distinct_count":3,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":0,"max":61},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.999,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11472","display_name":"Analytical Chemistry and Sensors","score":0.9913,"subfield":{"id":"https://openalex.org/subfields/1502","display_name":"Bioengineering"},"field":{"id":"https://openalex.org/fields/15","display_name":"Chemical Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/polydimethylsiloxane","display_name":"Polydimethylsiloxane","score":0.82110155},{"id":"https://openalex.org/keywords/tactile-sensor","display_name":"Tactile sensor","score":0.80760217},{"id":"https://openalex.org/keywords/rigidity","display_name":"Rigidity (electromagnetism)","score":0.55128545}],"concepts":[{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.83903235},{"id":"https://openalex.org/C2779849746","wikidata":"https://www.wikidata.org/wiki/Q411955","display_name":"Polydimethylsiloxane","level":2,"score":0.82110155},{"id":"https://openalex.org/C46722567","wikidata":"https://www.wikidata.org/wiki/Q7674139","display_name":"Tactile sensor","level":3,"score":0.80760217},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7605734},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.7213544},{"id":"https://openalex.org/C21200559","wikidata":"https://www.wikidata.org/wiki/Q7451068","display_name":"Sensitivity (control systems)","level":2,"score":0.66916513},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.57261264},{"id":"https://openalex.org/C160343418","wikidata":"https://www.wikidata.org/wiki/Q185256","display_name":"Rigidity (electromagnetism)","level":2,"score":0.55128545},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.47853455},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.45728016},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.40817863},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.35381514},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.29246742},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24358901},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.20458826},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.15994427},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.13121235},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12351018},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.09556833},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors43011.2019.8956701","pdf_url":null,"source":{"id":"https://openalex.org/S4306418818","display_name":"IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.41}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":7,"referenced_works":["https://openalex.org/W2066301147","https://openalex.org/W2135317193","https://openalex.org/W2463885248","https://openalex.org/W2520501242","https://openalex.org/W2728472832","https://openalex.org/W2738013832","https://openalex.org/W2942665452"],"related_works":["https://openalex.org/W4386858602","https://openalex.org/W4285102271","https://openalex.org/W4283740974","https://openalex.org/W3136079594","https://openalex.org/W2348740411","https://openalex.org/W2337947459","https://openalex.org/W2126912594","https://openalex.org/W2118205267","https://openalex.org/W2051563071","https://openalex.org/W1966596465"],"abstract_inverted_index":{"The":[0],"deformable":[1],"layer":[2,29,34],"of":[3,35,84],"a":[4,41,47,66],"stacked":[5,56],"capacitive":[6],"tactile":[7],"sensor":[8],"(CTS)":[9],"was":[10],"modified":[11],"from":[12],"polydimethylsiloxane":[13],"(PDMS)":[14],"to":[15,17],"air":[16],"enhance":[18],"its":[19,74],"detection":[20,49],"sensitivity.":[21],"With":[22],"the":[23,27,32,36,55,70,85],"reduced":[24],"structural":[25],"rigidity,":[26],"upper":[28],"deformed":[30],"towards":[31],"middle":[33],"sandwich":[37],"structure":[38],"easily,":[39],"enabling":[40],"large":[42],"capacitance":[43],"change,":[44],"which":[45],"represented":[46],"high":[48],"sensitivity":[50],"with":[51,65],"extensive":[52],"enhancement.":[53],"Because":[54],"CTS":[57,72,86],"exhibited":[58],"at":[59],"least":[60],"quadrupled":[61],"spatial":[62],"resolution":[63],"compared":[64],"conventional":[67],"non-stacked":[68],"one,":[69],"proposed":[71],"made":[73],"application":[75],"practical.":[76],"Comprehensive":[77],"design,":[78],"simulation,":[79],"fabrication,":[80],"detection,":[81],"and":[82],"analysis":[83],"were":[87],"performed":[88],"in":[89],"this":[90],"work.":[91]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W3000031249","counts_by_year":[],"updated_date":"2024-12-12T08:53:46.404618","created_date":"2020-01-23"}