乐胖代购免代理版

{"id":"https://openalex.org/W2564440866","doi":"https://doi.org/10.1109/nems.2016.7758273","title":"Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging","display_name":"Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging","publication_year":2016,"publication_date":"2016-04-01","ids":{"openalex":"https://openalex.org/W2564440866","doi":"https://doi.org/10.1109/nems.2016.7758273","mag":"2564440866"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2016.7758273","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043749200","display_name":"Wei Meng","orcid":"https://orcid.org/0000-0002-1555-3738"},"institutions":[{"id":"https://openalex.org/I4210128628","display_name":"Peking University Shenzhen Hospital","ror":"https://ror.org/03kkjyb15","country_code":"CN","type":"healthcare","lineage":["https://openalex.org/I4210128628"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Meng","raw_affiliation_strings":["Peking University Shenzhen Graduate school, Shenzhen, P. R. China"],"affiliations":[{"raw_affiliation_string":"Peking University Shenzhen Graduate school, Shenzhen, P. R. China","institution_ids":["https://openalex.org/I4210128628"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101933054","display_name":"Qinghua Zeng","orcid":"https://orcid.org/0000-0002-5529-1031"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"funder","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qinghua Zeng","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, P.R. China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, P.R. China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100763980","display_name":"Yong Guan","orcid":"https://orcid.org/0000-0001-9651-6017"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"funder","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yong Guan","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, P.R. China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, P.R. China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100394829","display_name":"Jing Chen","orcid":"https://orcid.org/0000-0001-8305-9291"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"funder","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jing Chen","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, P.R. China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, P.R. China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5104079377","display_name":"Yufeng Jin","orcid":"https://orcid.org/0009-0006-9750-4599"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"funder","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yufeng Jin","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, P.R. China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, P.R. China","institution_ids":["https://openalex.org/I20231570"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":0,"max":66},"biblio":{"volume":null,"issue":null,"first_page":"384","last_page":"387"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9997,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9992,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-Silicon Via","score":0.6634624},{"id":"https://openalex.org/keywords/redistribution","display_name":"Redistribution","score":0.45339233}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7526672},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.68102074},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6634624},{"id":"https://openalex.org/C34800285","wikidata":"https://www.wikidata.org/wiki/Q5159395","display_name":"Conductor","level":2,"score":0.6523519},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.64316773},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.62200785},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.50584054},{"id":"https://openalex.org/C74080474","wikidata":"https://www.wikidata.org/wiki/Q7305975","display_name":"Redistribution (election)","level":3,"score":0.45339233},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.44174144},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.43959814},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.43184298},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40366602},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.39807415},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.33921856},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18191442},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.14263612},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C94625758","wikidata":"https://www.wikidata.org/wiki/Q7163","display_name":"Politics","level":2,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2016.7758273","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":13,"referenced_works":["https://openalex.org/W1873528852","https://openalex.org/W2020859763","https://openalex.org/W2021456425","https://openalex.org/W2044876757","https://openalex.org/W2046536974","https://openalex.org/W2065858503","https://openalex.org/W2070702158","https://openalex.org/W2079848044","https://openalex.org/W2084552733","https://openalex.org/W2106809680","https://openalex.org/W2147560018","https://openalex.org/W2155351061","https://openalex.org/W2318402538"],"related_works":["https://openalex.org/W4313519086","https://openalex.org/W2953236157","https://openalex.org/W2794905580","https://openalex.org/W2410954876","https://openalex.org/W2272290532","https://openalex.org/W2120483398","https://openalex.org/W2064780653","https://openalex.org/W2032230049","https://openalex.org/W1999112988","https://openalex.org/W1981429685"],"abstract_inverted_index":{"This":[0],"paper":[1],"proposes":[2],"a":[3,32],"combination":[4],"of":[5,19,65,72,78,84,93,108],"annular":[6],"copper":[7,10,23,74],"and":[8,24,39,58,75,97],"cylindrical":[9,73],"as":[11],"the":[12,17,49,54,62,70,76,82,91,94,99,106,109,114],"TSV":[13],"conductor":[14],"to":[15,89],"decrease":[16],"effect":[18,92,107],"thermal":[20],"mismatch":[21],"between":[22,35],"silicon":[25],"in":[26,31,67],"MEMS":[27],"packaging,":[28],"which":[29,46,103],"results":[30],"reliability":[33,55,116],"risk":[34],"redistribution":[36],"layer":[37,80],"(RDL)":[38],"TSV.":[40,85],"There":[41],"are":[42,61],"three":[43,95],"important":[44],"factors":[45,96],"may":[47],"have":[48],"most":[50],"serious":[51],"influence":[52],"on":[53,113],"being":[56],"simulated":[57],"analyzed.":[59],"They":[60],"opening":[63],"diameter":[64],"RDL":[66],"insulation":[68,79],"layer,":[69],"thickness":[71,77],"at":[81],"bottom":[83],"It":[86],"is":[87],"significant":[88],"understand":[90],"get":[98],"optimum":[100],"structure":[101,112],"parameters":[102],"can":[104],"reduce":[105],"risky":[110],"connection":[111],"package":[115],"obviously.":[117]},"abstract_inverted_index_v3":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2564440866","counts_by_year":[],"updated_date":"2025-01-25T19:01:21.778090","created_date":"2017-01-06"}