乐胖代购免代理版

{"id":"https://openalex.org/W2148707222","doi":"https://doi.org/10.1109/jssc.2007.916621","title":"Measurement and Analysis of Inductive Coupling Noise in 90 nm Global Interconnects","display_name":"Measurement and Analysis of Inductive Coupling Noise in 90 nm Global Interconnects","publication_year":2008,"publication_date":"2008-02-29","ids":{"openalex":"https://openalex.org/W2148707222","doi":"https://doi.org/10.1109/jssc.2007.916621","mag":"2148707222"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2007.916621","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072741891","display_name":"Yasuhiro Ogasahara","orcid":"https://orcid.org/0000-0003-2718-1756"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yasuhiro Ogasahara","raw_affiliation_strings":["Department of Information Systems Engineering, Osaka University, Osaka, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Information Systems Engineering, Osaka University, Osaka, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002405139","display_name":"Masanori Hashimoto","orcid":"https://orcid.org/0000-0002-0377-2108"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masanori Hashimoto","raw_affiliation_strings":["Department of Information Systems Engineering, Osaka University, Osaka, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Information Systems Engineering, Osaka University, Osaka, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061693379","display_name":"Takao Onoye","orcid":"https://orcid.org/0000-0002-1894-2448"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takao Onoye","raw_affiliation_strings":["Department of Information Systems Engineering, Osaka University, Osaka, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Information Systems Engineering, Osaka University, Osaka, Japan","institution_ids":["https://openalex.org/I98285908"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.036,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":7,"citation_normalized_percentile":{"value":0.653517,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":81,"max":82},"biblio":{"volume":"43","issue":"3","first_page":"718","last_page":"728"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9997,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/rlc-circuit","display_name":"RLC circuit","score":0.6059177},{"id":"https://openalex.org/keywords/inductive-coupling","display_name":"Inductive coupling","score":0.522551},{"id":"https://openalex.org/keywords/substrate-coupling","display_name":"Substrate coupling","score":0.4757169}],"concepts":[{"id":"https://openalex.org/C27753989","wikidata":"https://www.wikidata.org/wiki/Q284885","display_name":"Superposition principle","level":2,"score":0.7296786},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.66757154},{"id":"https://openalex.org/C89880566","wikidata":"https://www.wikidata.org/wiki/Q323477","display_name":"RLC circuit","level":4,"score":0.6059177},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.57159704},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.55406004},{"id":"https://openalex.org/C177872590","wikidata":"https://www.wikidata.org/wiki/Q1498289","display_name":"Inductive coupling","level":2,"score":0.522551},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.48929903},{"id":"https://openalex.org/C51674796","wikidata":"https://www.wikidata.org/wiki/Q7632167","display_name":"Substrate coupling","level":4,"score":0.4757169},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.41291964},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.38509575},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.35516727},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2713143},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26399225},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.26174352},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.24661255},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.17823803},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10970333},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2007.916621","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":true,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":26,"referenced_works":["https://openalex.org/W1554048335","https://openalex.org/W1558462509","https://openalex.org/W1974583787","https://openalex.org/W2010991573","https://openalex.org/W2076088700","https://openalex.org/W2083597891","https://openalex.org/W2089414099","https://openalex.org/W2101597431","https://openalex.org/W2106071059","https://openalex.org/W2111944961","https://openalex.org/W2112632837","https://openalex.org/W2118567051","https://openalex.org/W2121029664","https://openalex.org/W2121759447","https://openalex.org/W2131131039","https://openalex.org/W2136756462","https://openalex.org/W2137055620","https://openalex.org/W2144493049","https://openalex.org/W2152134010","https://openalex.org/W2152296685","https://openalex.org/W3127394485","https://openalex.org/W3147005706","https://openalex.org/W4242823428","https://openalex.org/W4247998816","https://openalex.org/W4249746713","https://openalex.org/W4252202715"],"related_works":["https://openalex.org/W3009380350","https://openalex.org/W2599967595","https://openalex.org/W2548209321","https://openalex.org/W2357426242","https://openalex.org/W2144460576","https://openalex.org/W2101451133","https://openalex.org/W2089474734","https://openalex.org/W2065444755","https://openalex.org/W2059153991","https://openalex.org/W1969614972"],"abstract_inverted_index":{"Inductive":[0],"coupling":[1,22,29,68],"is":[2,31,45,112],"becoming":[3],"a":[4,32,62,113],"design":[5,34],"concern":[6],"for":[7,51,61],"global":[8],"interconnects":[9],"in":[10,36,97],"nanometer":[11],"technologies.":[12],"We":[13],"present":[14],"measurement":[15,98],"results":[16,50,99],"of":[17,20,70,90,104,116],"the":[18,102,117],"effect":[19,69],"inductive":[21,28,71],"on":[23,87],"timing,":[24],"and":[25,56,73,93],"demonstrate":[26],"that":[27,101],"noise":[30,74,91],"practical":[33],"issue":[35],"90":[37],"nm":[38],"technology.":[39],"The":[40,66],"measured":[41],"delay":[42,105,119],"change":[43],"curve":[44],"consistent":[46],"with":[47],"circuit":[48],"simulation":[49],"an":[52],"RLC":[53],"interconnect":[54],"model,":[55],"clearly":[57,85],"different":[58],"from":[59],"those":[60],"conventional":[63],"RC":[64],"model.":[65],"long-range":[67],"coupling,":[72],"reduction":[75],"caused":[76],"by":[77],"ground":[78],"insertion":[79],"or":[80],"decreased":[81],"driver":[82],"size":[83],"were":[84],"observed":[86],"silicon.":[88],"Examination":[89],"cancellation":[92],"superposition":[94],"effects":[95],"shown":[96],"confirm":[100],"summation":[103],"variations":[106],"due":[107],"to":[108],"each":[109],"individual":[110],"aggressor":[111],"reasonable":[114],"approximation":[115],"total":[118],"variation.":[120]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2148707222","counts_by_year":[{"year":2015,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2025-01-17T21:26:36.740935","created_date":"2016-06-24"}