乐胖代购免代理版

{"id":"https://openalex.org/W4285377714","doi":"https://doi.org/10.1109/itc-asia53059.2021.9808837","title":"Testing and Fault-Localization Solutions for Monolithic 3D ICs","display_name":"Testing and Fault-Localization Solutions for Monolithic 3D ICs","publication_year":2021,"publication_date":"2021-08-18","ids":{"openalex":"https://openalex.org/W4285377714","doi":"https://doi.org/10.1109/itc-asia53059.2021.9808837"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc-asia53059.2021.9808837","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5090354528","display_name":"Arjun Chaudhuri","orcid":"https://orcid.org/0000-0001-9353-6397"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Arjun Chaudhuri","raw_affiliation_strings":["Duke University,Department of Electrical and Computer Engineering,Durham,NC"],"affiliations":[{"raw_affiliation_string":"Duke University,Department of Electrical and Computer Engineering,Durham,NC","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5033880864","display_name":"Krishnendu Chakrabarty","orcid":"https://orcid.org/0000-0003-4475-6435"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krishnendu Chakrabarty","raw_affiliation_strings":["Duke University,Department of Electrical and Computer Engineering,Durham,NC"],"affiliations":[{"raw_affiliation_string":"Duke University,Department of Electrical and Computer Engineering,Durham,NC","institution_ids":["https://openalex.org/I170897317"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":0,"max":57},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5073001},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.5010922},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.38853216},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.34823185},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23997515},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.13302076},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc-asia53059.2021.9808837","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.43}],"grants":[{"funder":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation","award_id":null}],"datasets":[],"versions":[],"referenced_works_count":33,"referenced_works":["https://openalex.org/W1543143225","https://openalex.org/W1559886496","https://openalex.org/W1560950418","https://openalex.org/W1668395569","https://openalex.org/W1953724919","https://openalex.org/W1965451131","https://openalex.org/W1972367194","https://openalex.org/W1981823766","https://openalex.org/W1989826997","https://openalex.org/W1990828594","https://openalex.org/W1994791325","https://openalex.org/W2029376899","https://openalex.org/W2030641935","https://openalex.org/W2031887472","https://openalex.org/W2083758827","https://openalex.org/W2102304175","https://openalex.org/W2106433082","https://openalex.org/W2110019537","https://openalex.org/W2118133071","https://openalex.org/W2127622278","https://openalex.org/W2134103801","https://openalex.org/W2137906067","https://openalex.org/W2150555472","https://openalex.org/W2162544780","https://openalex.org/W2186922790","https://openalex.org/W2505380261","https://openalex.org/W2735555835","https://openalex.org/W2775005974","https://openalex.org/W2885203734","https://openalex.org/W2911741832","https://openalex.org/W3115397547","https://openalex.org/W3184611608","https://openalex.org/W4231816245"],"related_works":["https://openalex.org/W4402327032","https://openalex.org/W4396701345","https://openalex.org/W4396696052","https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2382290278","https://openalex.org/W2376932109","https://openalex.org/W2358668433","https://openalex.org/W2001405890"],"abstract_inverted_index":{"Monolithic":[0],"3D(M3D)":[1],"integration":[2,18,33],"has":[3],"the":[4,39,55,76,86,103],"potential":[5],"to":[6,13,48,67],"achieve":[7],"significantly":[8],"higher":[9],"device":[10],"density":[11,34],"compared":[12],"TSV-based":[14],"3D":[15],"stacking.":[16],"Sequential":[17],"of":[19,38,58,75,78],"transistor":[20],"layers":[21],"enables":[22],"high-density":[23],"vertical":[24],"interconnects,":[25],"known":[26],"as":[27],"inter-layer":[28,40],"vias":[29],"(ILVs).":[30],"However,":[31],"high":[32],"and":[35,51,61,70,85,106],"aggressive":[36],"scaling":[37],"dielectric":[41],"make":[42],"M3D":[43,59],"integrated":[44],"circuits":[45],"especially":[46],"prone":[47,66],"process":[49,64],"variations":[50],"manufacturing":[52],"defects.":[53],"Furthermore,":[54],"sequential":[56],"assembly":[57],"tiers":[60],"immature":[62],"fabrication":[63,80],"are":[65],"inter-tier":[68],"coupling":[69],"performance":[71,84],"variations.":[72],"In":[73],"view":[74],"impact":[77],"these":[79],"imperfections":[81],"on":[82],"chip":[83],"associated":[87],"test":[88],"challenges,":[89],"we":[90],"describe":[91],"two":[92],"M3D-specific":[93],"design-for-test":[94],"solutions":[95],"\u2013":[96],"a":[97,107],"low-cost":[98],"built-in":[99],"self-test":[100],"architecture":[101],"for":[102,112],"defect-prone":[104],"ILVs":[105],"tier-level":[108],"fault":[109],"localization":[110],"method":[111],"yield":[113],"learning.":[114]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W4285377714","counts_by_year":[],"updated_date":"2024-12-15T23:33:51.625730","created_date":"2022-07-14"}