{"id":"https://openalex.org/W2240806283","doi":"https://doi.org/10.1109/ieem.2015.7385822","title":"Reducing variability in micro-milling process using six sigma methodology","display_name":"Reducing variability in micro-milling process using six sigma methodology","publication_year":2015,"publication_date":"2015-12-01","ids":{"openalex":"https://openalex.org/W2240806283","doi":"https://doi.org/10.1109/ieem.2015.7385822","mag":"2240806283"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/ieem.2015.7385822","pdf_url":null,"source":{"id":"https://openalex.org/S4363607822","display_name":"2021 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089825806","display_name":"Erika Garc\u00eda\u2010L\u00f3pez","orcid":"https://orcid.org/0000-0002-3341-298X"},"institutions":[{"id":"https://openalex.org/I98461037","display_name":"Tecnol\u00f3gico de Monterrey","ror":"https://ror.org/03ayjn504","country_code":"MX","type":"funder","lineage":["https://openalex.org/I98461037"]}],"countries":["MX"],"is_corresponding":false,"raw_author_name":"E. Garcia-Lopez","raw_affiliation_strings":["Escuela de Ingenier a y Ciencias, Tecnologico de Monterrey, Monterrey, Mexico"],"affiliations":[{"raw_affiliation_string":"Escuela de Ingenier a y Ciencias, Tecnologico de Monterrey, Monterrey, Mexico","institution_ids":["https://openalex.org/I98461037"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071622807","display_name":"H\u00e9ctor R. Siller","orcid":"https://orcid.org/0000-0002-0782-1974"},"institutions":[{"id":"https://openalex.org/I98461037","display_name":"Tecnol\u00f3gico de Monterrey","ror":"https://ror.org/03ayjn504","country_code":"MX","type":"funder","lineage":["https://openalex.org/I98461037"]}],"countries":["MX"],"is_corresponding":false,"raw_author_name":"H. R. Siller","raw_affiliation_strings":["Escuela de Ingenier a y Ciencias, Tecnologico de Monterrey, Monterrey, Mexico"],"affiliations":[{"raw_affiliation_string":"Escuela de Ingenier a y Ciencias, Tecnologico de Monterrey, Monterrey, Mexico","institution_ids":["https://openalex.org/I98461037"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5057046548","display_name":"Ciro A. Rodr\u0131\u0301guez","orcid":"https://orcid.org/0000-0003-2289-4239"},"institutions":[{"id":"https://openalex.org/I98461037","display_name":"Tecnol\u00f3gico de Monterrey","ror":"https://ror.org/03ayjn504","country_code":"MX","type":"funder","lineage":["https://openalex.org/I98461037"]}],"countries":["MX"],"is_corresponding":false,"raw_author_name":"C. A. Rodriguez","raw_affiliation_strings":["Escuela de Ingenier a y Ciencias, Tecnologico de Monterrey, Monterrey, Mexico"],"affiliations":[{"raw_affiliation_string":"Escuela de Ingenier a y Ciencias, Tecnologico de Monterrey, Monterrey, Mexico","institution_ids":["https://openalex.org/I98461037"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":1,"citation_normalized_percentile":{"value":0.370042,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":66,"max":73},"biblio":{"volume":null,"issue":null,"first_page":"1117","last_page":"1122"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.9994,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.9994,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11451","display_name":"Advanced Machining and Optimization Techniques","score":0.9972,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.9859,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dmaic","display_name":"DMAIC","score":0.880646},{"id":"https://openalex.org/keywords/process-capability","display_name":"Process capability","score":0.5416726}],"concepts":[{"id":"https://openalex.org/C205400985","wikidata":"https://www.wikidata.org/wiki/Q380179","display_name":"DMAIC","level":4,"score":0.880646},{"id":"https://openalex.org/C23119410","wikidata":"https://www.wikidata.org/wiki/Q236908","display_name":"Six Sigma","level":3,"score":0.81524396},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.6274386},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5832094},{"id":"https://openalex.org/C91439571","wikidata":"https://www.wikidata.org/wiki/Q1279773","display_name":"Process capability","level":3,"score":0.5416726},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.48466805},{"id":"https://openalex.org/C155386361","wikidata":"https://www.wikidata.org/wiki/Q1649571","display_name":"Process control","level":3,"score":0.43848157},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.42800108},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4095215},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.40827584},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.3740158},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.36937284},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.365923},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33491248},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.0},{"id":"https://openalex.org/C137335462","wikidata":"https://www.wikidata.org/wiki/Q380772","display_name":"Lean manufacturing","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/ieem.2015.7385822","pdf_url":null,"source":{"id":"https://openalex.org/S4363607822","display_name":"2021 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":14,"referenced_works":["https://openalex.org/W1995079289","https://openalex.org/W2010106137","https://openalex.org/W2020572503","https://openalex.org/W2033831860","https://openalex.org/W2040716497","https://openalex.org/W2062948354","https://openalex.org/W2072176501","https://openalex.org/W2089758423","https://openalex.org/W2092340474","https://openalex.org/W2092411060","https://openalex.org/W2136945723","https://openalex.org/W2172249506","https://openalex.org/W2296748609","https://openalex.org/W2496448085"],"related_works":["https://openalex.org/W4361792236","https://openalex.org/W4243556880","https://openalex.org/W2966830423","https://openalex.org/W2757064773","https://openalex.org/W2259171508","https://openalex.org/W2079452862","https://openalex.org/W2075656146","https://openalex.org/W2046319294","https://openalex.org/W1969848021","https://openalex.org/W1584919102"],"abstract_inverted_index":{"Micro-milling":[0],"is":[1],"a":[2],"manufacturing":[3],"process":[4,33,81,100],"used":[5,29],"as":[6,45,102],"an":[7],"alternative":[8],"for":[9,30,61],"the":[10,20,24,39,68],"fabrication":[11],"of":[12,41,70],"Lab-on-a-Chip":[13],"components":[14],"among":[15],"other":[16],"medical":[17],"applications.":[18],"In":[19],"work":[21],"presented":[22],"here,":[23],"six":[25],"sigma":[26],"methodology":[27,78],"was":[28],"evaluating":[31],"micro-milling":[32,80],"parameters":[34,87],"and":[35,49,58,76,88],"their":[36,89],"impact":[37],"on":[38,91],"generation":[40],"geometrical":[42,59],"errors":[43],"such":[44],"tool":[46],"wear,":[47],"vibrations":[48],"burr":[50],"formations.":[51],"These":[52],"critical":[53],"variables":[54],"affect":[55],"surface":[56,92,105],"quality":[57],"features":[60],"Lab-On-a-Chip":[62],"microfluidic":[63],"performance.":[64],"This":[65],"paper":[66],"presents":[67],"application":[69],"DMAIC":[71],"(Define,":[72],"Measure,":[73],"Analyze,":[74],"Improve":[75],"Control)":[77],"in":[79,82],"order":[83],"to":[84,98,104],"study":[85],"cutting":[86],"influence":[90],"quality.":[93],"Finally,":[94],"improvements":[95],"are":[96],"implemented":[97],"enhance":[99],"capability":[101],"related":[103],"roughness.":[106]},"abstract_inverted_index_v3":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2240806283","counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2025-04-17T23:00:17.180828","created_date":"2016-06-24"}