乐胖代购免代理版

{"id":"https://openalex.org/W4244222459","doi":"https://doi.org/10.1109/iccad.2010.5654244","title":"Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs","display_name":"Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs","publication_year":2010,"publication_date":"2010-11-01","ids":{"openalex":"https://openalex.org/W4244222459","doi":"https://doi.org/10.1109/iccad.2010.5654244"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2010.5654244","pdf_url":null,"source":{"id":"https://openalex.org/S4363608324","display_name":"2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100342650","display_name":"Le Yu","orcid":"https://orcid.org/0000-0002-9545-7091"},"institutions":[{"id":"https://openalex.org/I4210110458","display_name":"Institute of Electronics","ror":"https://ror.org/01z143507","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210110458"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Le Yu","raw_affiliation_strings":["Institute of Electronics, Chinese Academy of Sciences, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Electronics, Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210110458","https://openalex.org/I19820366"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087392088","display_name":"Haigang Yang","orcid":"https://orcid.org/0000-0002-6471-9730"},"institutions":[{"id":"https://openalex.org/I4210110458","display_name":"Institute of Electronics","ror":"https://ror.org/01z143507","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210110458"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haigang Yang","raw_affiliation_strings":["Institute of Electronics, Chinese Academy of Sciences, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Electronics, Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210110458","https://openalex.org/I19820366"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000933551","display_name":"Tom Tong Jing","orcid":null},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tom T. Jing","raw_affiliation_strings":["College of Nanoscale Science and Engineering, University at Albany, SUNY, Albany, NY, USA"],"affiliations":[{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, SUNY, Albany, NY, USA","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101642423","display_name":"Min Xu","orcid":"https://orcid.org/0000-0003-3877-9585"},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Min Xu","raw_affiliation_strings":["College of Nanoscale Science and Engineering, University at Albany, SUNY, Albany, NY, USA"],"affiliations":[{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, SUNY, Albany, NY, USA","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079497121","display_name":"Robert Geer","orcid":null},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robert Geer","raw_affiliation_strings":["College of Nanoscale Science and Engineering, University at Albany, SUNY, Albany, NY, USA"],"affiliations":[{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, SUNY, Albany, NY, USA","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100391999","display_name":"Wei Wang","orcid":"https://orcid.org/0000-0002-5257-7675"},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei Wang","raw_affiliation_strings":["College of Nanoscale Science and Engineering, University at Albany, SUNY, Albany, NY, USA"],"affiliations":[{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, SUNY, Albany, NY, USA","institution_ids":["https://openalex.org/I392282"]}]}],"institution_assertions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":4.044,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":24,"citation_normalized_percentile":{"value":0.960804,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":91},"biblio":{"volume":null,"issue":null,"first_page":"686","last_page":"693"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9992,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9984,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization","score":0.6398444}],"concepts":[{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.6398444},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.56554383},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5297963},{"id":"https://openalex.org/C2164484","wikidata":"https://www.wikidata.org/wiki/Q5170150","display_name":"Core (optical fiber)","level":2,"score":0.4906677},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.36950237},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.36171082},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2568431},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1563012},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.13469571}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2010.5654244","pdf_url":null,"source":{"id":"https://openalex.org/S4363608324","display_name":"2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":16,"referenced_works":["https://openalex.org/W1942908838","https://openalex.org/W1978300964","https://openalex.org/W1990933340","https://openalex.org/W2011993785","https://openalex.org/W206348236","https://openalex.org/W2105931511","https://openalex.org/W2109314689","https://openalex.org/W2113854552","https://openalex.org/W2114603286","https://openalex.org/W2126475076","https://openalex.org/W2144797778","https://openalex.org/W2146274038","https://openalex.org/W2153443121","https://openalex.org/W2155707315","https://openalex.org/W2161743155","https://openalex.org/W2214547131"],"related_works":["https://openalex.org/W4247143848","https://openalex.org/W4206825956","https://openalex.org/W330727063","https://openalex.org/W3107994849","https://openalex.org/W29442446","https://openalex.org/W2896904446","https://openalex.org/W2748952813","https://openalex.org/W2735573198","https://openalex.org/W2009883749","https://openalex.org/W1483407203"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"radio":[3],"frequency":[4],"(RF)":[5],"through-silicon":[6],"via":[7],"(TSV)":[8],"designs":[9],"and":[10,24,30,36,69],"models":[11],"are":[12,34,77],"proposed":[13],"to":[14,38],"achieve":[15],"high-frequency":[16,86],"vertical":[17],"connectivity":[18],"for":[19,83],"three":[20],"dimensional":[21],"(3D)":[22],"multi-core":[23],"heterogeneous":[25],"ICs.":[26],"Specifically,":[27],"coaxial":[28],"dielectric":[29],"novel":[31],"air-gap-based":[32],"TSVs":[33,52,76],"designed":[35],"simulated":[37],"reduce":[39],"signal":[40],"degradation":[41],"during":[42],"RF":[43,51,75],"operations.":[44],"The":[45,66],"simulation":[46],"results":[47],"demonstrate":[48],"that":[49],"these":[50],"can":[53],"provide":[54],"decay-tolerance":[55],"frequencies":[56],"two":[57],"orders":[58],"of":[59,73],"magnitude":[60],"higher":[61],"than":[62],"simple":[63],"Cu-plug":[64],"TSVs.":[65],"data":[67],"rate":[68],"energy":[70],"per":[71],"bit":[72],"the":[74],"summarized,":[78],"providing":[79],"an":[80],"important":[81],"guideline":[82],"future":[84],"3D":[85],"TSV":[87],"designs.":[88]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W4244222459","counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":3}],"updated_date":"2024-12-11T03:24:55.278018","created_date":"2022-05-12"}