乐胖代购免代理版

{"id":"https://openalex.org/W2985640365","doi":"https://doi.org/10.1109/essderc.2019.8901827","title":"22FD-SOI Variability Improvement Thanks to SmartCut Thickness Control at Atomic Scale","display_name":"22FD-SOI Variability Improvement Thanks to SmartCut Thickness Control at Atomic Scale","publication_year":2019,"publication_date":"2019-09-01","ids":{"openalex":"https://openalex.org/W2985640365","doi":"https://doi.org/10.1109/essderc.2019.8901827","mag":"2985640365"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2019.8901827","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011567907","display_name":"W. Schwarzenbach","orcid":"https://orcid.org/0000-0003-2821-0854"},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"W. Schwarzenbach","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043409202","display_name":"L. Loubriat","orcid":null},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"L. Loubriat","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038428594","display_name":"V. P. Joseph","orcid":"https://orcid.org/0000-0001-5501-0220"},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"V. Joseph","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040628869","display_name":"L. Viravaux","orcid":null},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"L. Viravaux","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063683397","display_name":"O. Moreau","orcid":"https://orcid.org/0000-0001-8134-6254"},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"O. Moreau","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065510555","display_name":"S. Lasserre","orcid":null},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"S. Lasserre","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5065345119","display_name":"Bich-Yen Nguyen","orcid":"https://orcid.org/0000-0003-4347-4583"},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"B.-Y. Nguyen","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":0,"max":61},"biblio":{"volume":null,"issue":null,"first_page":"64","last_page":"65"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9988,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9988,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9971,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9963,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[],"concepts":[{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.850269},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6148489},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.4990921},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.44239137},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3766979},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37332302},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.30941075},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.2989175},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2019.8901827","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5,"id":"https://metadata.un.org/sdg/9"}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":6,"referenced_works":["https://openalex.org/W2018999463","https://openalex.org/W2070007292","https://openalex.org/W2159486840","https://openalex.org/W2168111716","https://openalex.org/W2210742194","https://openalex.org/W2792883366"],"related_works":["https://openalex.org/W4206445530","https://openalex.org/W2810180604","https://openalex.org/W2771786520","https://openalex.org/W2325281603","https://openalex.org/W2174354966","https://openalex.org/W2146341803","https://openalex.org/W2104300577","https://openalex.org/W2095990703","https://openalex.org/W2001476809","https://openalex.org/W1921407827"],"abstract_inverted_index":{"Beyond":[0],"65FD-SOI,":[1],"28FD-SOI,":[2],"22FD-SOI":[3],"production":[4],"granted":[5],"technologies,":[6],"continuous":[7],"SmartCut":[8],"TM":[11],"development":[12],"support":[13],"advanced":[14],"SOI":[15,19],"requirements.":[16],"To":[17],"improve":[18],"layer":[20],"thickness":[21],"variability,":[22],"a":[23],"2":[24],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">nd":[27],"generation":[28],"chemical":[29],"thinning":[30],"process":[31],"step":[32],"is":[33,54],"proposed.":[34],"11%":[35],"and":[36,43],"25%":[37],"improvements":[38],"are":[39],"demonstrated":[40],"on":[41,44],"100%":[42],"75%":[45],"of":[46],"the":[47],"wafer":[48],"surface,":[49],"respectively.":[50],"This":[51],"improved":[52],"product":[53],"ready":[55],"for":[56],"pre-production.":[57]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2985640365","counts_by_year":[],"updated_date":"2024-12-06T04:29:18.079095","created_date":"2019-11-22"}