乐胖代购免代理版

{"id":"https://openalex.org/W2764076851","doi":"https://doi.org/10.1109/essderc.2017.8066630","title":"200 mm Wafer level graphene transfer by wafer bonding technique","display_name":"200 mm Wafer level graphene transfer by wafer bonding technique","publication_year":2017,"publication_date":"2017-09-01","ids":{"openalex":"https://openalex.org/W2764076851","doi":"https://doi.org/10.1109/essderc.2017.8066630","mag":"2764076851"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2017.8066630","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006858893","display_name":"Mesut \u0130na\u00e7","orcid":"https://orcid.org/0000-0002-1323-9331"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Mesut Inac","raw_affiliation_strings":["Berlin Technical University, HFT4, Berlin, Germany","IHP, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"Berlin Technical University, HFT4, Berlin, Germany","institution_ids":[]},{"raw_affiliation_string":"IHP, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085655176","display_name":"Grzegorz \u0141upina","orcid":"https://orcid.org/0000-0002-2197-2488"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Grzegorz Lupina","raw_affiliation_strings":["IHP, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"IHP, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011390917","display_name":"Matthias Wietstruck","orcid":"https://orcid.org/0000-0002-7876-4129"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Matthias Wietstruck","raw_affiliation_strings":["IHP, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"IHP, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079837810","display_name":"Marco Lisker","orcid":null},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Marco Lisker","raw_affiliation_strings":["IHP, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"IHP, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027544713","display_name":"Mirko Fraschke","orcid":null},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Mirko Fraschke","raw_affiliation_strings":["IHP, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"IHP, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085960767","display_name":"Andreas Mai","orcid":"https://orcid.org/0000-0002-3861-0512"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Innovations for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andreas Mai","raw_affiliation_strings":["IHP, Frankfurt (Oder), Germany"],"affiliations":[{"raw_affiliation_string":"IHP, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110179060","display_name":"Fabio Coccetti","orcid":null},"institutions":[],"countries":["DE","IT"],"is_corresponding":false,"raw_author_name":"Fabio Coccetti","raw_affiliation_strings":["Berlin Technical University, HFT4, Berlin, Germany","RF Microtech, Perugia, Italy"],"affiliations":[{"raw_affiliation_string":"Berlin Technical University, HFT4, Berlin, Germany","institution_ids":[]},{"raw_affiliation_string":"RF Microtech, Perugia, Italy","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091889377","display_name":"Mehmet Kaynakt","orcid":null},"institutions":[{"id":"https://openalex.org/I134235054","display_name":"Sabanc\u0131 \u00dcniversitesi","ror":"https://ror.org/049asqa32","country_code":"TR","type":"funder","lineage":["https://openalex.org/I134235054"]}],"countries":["TR"],"is_corresponding":false,"raw_author_name":"Mehmet Kaynakt","raw_affiliation_strings":["Sabanci Universitesi, Istanbul, TR"],"affiliations":[{"raw_affiliation_string":"Sabanci Universitesi, Istanbul, TR","institution_ids":["https://openalex.org/I134235054"]}]}],"institution_assertions":[],"countries_distinct_count":3,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.298,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":2,"citation_normalized_percentile":{"value":0.610806,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":71,"max":75},"biblio":{"volume":null,"issue":null,"first_page":"216","last_page":"219"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9982,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9963,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer Bonding","score":0.5440009}],"concepts":[{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.8536438},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7434717},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5854896},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5448359},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.5440009},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.36805296},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2017.8066630","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":13,"referenced_works":["https://openalex.org/W1978720965","https://openalex.org/W1999664997","https://openalex.org/W2014694192","https://openalex.org/W2039962212","https://openalex.org/W2054172982","https://openalex.org/W2106466443","https://openalex.org/W2149032140","https://openalex.org/W2151863751","https://openalex.org/W2187211525","https://openalex.org/W2188182475","https://openalex.org/W2414738271","https://openalex.org/W2550301254","https://openalex.org/W3105554119"],"related_works":["https://openalex.org/W3043339446","https://openalex.org/W2936104641","https://openalex.org/W2540312267","https://openalex.org/W2488020685","https://openalex.org/W2228105431","https://openalex.org/W2082419378","https://openalex.org/W2073096817","https://openalex.org/W2068447932","https://openalex.org/W2053597733","https://openalex.org/W2025337696"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"wafer":[3,40,110],"level":[4,111],"transfer":[5,35,53,91],"of":[6,54,68,79,88,118],"graphene":[7,36,56,90,119,134],"on":[8,16,37,57,93,107,133],"to":[9,34,58],"a":[10,65,115,122],"dielectric":[11],"substrate":[12,60],"is":[13,83],"demonstrated":[14],"based":[15,92,132],"SiO":[17,94],"2":[20,24,97,101],"-SiO":[21,98],"fusion":[25,102],"bonding":[26,103],"and":[27,64,104,125],"de-bonding":[28,105],"processes.":[29],"The":[30,47],"developed":[31],"technique":[32],"allows":[33],"200":[38,108],"mm":[39,109],"without":[41],"any":[42],"contamination;":[43],"thus":[44],"CMOS":[45,123],"compatible.":[46],"experimental":[48],"data":[49],"verifies":[50],"the":[51,55,77,84,89,127],"successful":[52],"another":[59],"with":[61,70],"high":[62],"quality":[63],"yield":[66],"value":[67],"98%":[69],"average":[71],"3.5":[72],"k\u03a9/\u25a1":[73],"sheet":[74],"resistance.":[75],"To":[76],"best":[78],"authors":[80],"knowledge,":[81],"it":[82],"first":[85],"time":[86],"demonstration":[87],"process":[106],"which":[112],"would":[113],"allow":[114],"complete":[116],"integration":[117],"material":[120],"into":[121],"line":[124],"opens":[126],"way":[128],"for":[129],"new":[130],"devices":[131],"material.":[135]},"abstract_inverted_index_v3":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2764076851","counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-02-22T19:13:31.494499","created_date":"2017-10-20"}