{"id":"https://openalex.org/W2035258971","doi":"https://doi.org/10.1109/embc.2012.6346962","title":"A method for stable electrical connection of a multi-channeled polyimide electrode with PCB","display_name":"A method for stable electrical connection of a multi-channeled polyimide electrode with PCB","publication_year":2012,"publication_date":"2012-08-01","ids":{"openalex":"https://openalex.org/W2035258971","doi":"https://doi.org/10.1109/embc.2012.6346962","mag":"2035258971","pmid":"https://pubmed.ncbi.nlm.nih.gov/23366923"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/embc.2012.6346962","pdf_url":null,"source":{"id":"https://openalex.org/S4393918560","display_name":"Annual International Conference of the IEEE Engineering in Medicine and Biology Society","issn_l":"2375-7477","issn":["2375-7477"],"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref","pubmed"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5082116439","display_name":"Donghyun Baek","orcid":"https://orcid.org/0000-0003-0675-1115"},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"None Dong-Hyun Baek","raw_affiliation_strings":["School of Electrical Engineering and Department of Biomedical Engineering, College of Health Science, Korea University, Seoul, Republic of Korea."],"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering and Department of Biomedical Engineering, College of Health Science, Korea University, Seoul, Republic of Korea.","institution_ids":["https://openalex.org/I197347611"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002777938","display_name":"Hachul Jung","orcid":"https://orcid.org/0000-0001-9437-8618"},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"None Ha-Chul Jung","raw_affiliation_strings":["Department of Biomedical Engineering, College of Health Science, Korea University,Seoul,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, College of Health Science, Korea University,Seoul,Republic of Korea","institution_ids":["https://openalex.org/I197347611"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101648591","display_name":"Seon Min Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"None Seon Min Kim","raw_affiliation_strings":["Department of Biomedical Engineering, College of Health Science, Korea University,Seoul,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, College of Health Science, Korea University,Seoul,Republic of Korea","institution_ids":["https://openalex.org/I197347611"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018807391","display_name":"Chang\u2010Hwan Im","orcid":"https://orcid.org/0000-0003-3795-3318"},"institutions":[{"id":"https://openalex.org/I4575257","display_name":"Hanyang University","ror":"https://ror.org/046865y68","country_code":"KR","type":"education","lineage":["https://openalex.org/I4575257"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"None Chang-Hwan Im","raw_affiliation_strings":["Department of Biomedical Engineering, Hanyang University, Seoul, Republic of Korea#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, Hanyang University, Seoul, Republic of Korea#TAB#","institution_ids":["https://openalex.org/I4575257"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021004968","display_name":"James Jungho Pak","orcid":"https://orcid.org/0000-0003-2141-9452"},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"James Jungho Pak","raw_affiliation_strings":["School of Electrical Engineering Korea University Seoul Republic of Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering Korea University Seoul Republic of Korea","institution_ids":["https://openalex.org/I197347611"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100320214","display_name":"Sang\u2010Hoon Lee","orcid":"https://orcid.org/0000-0003-1710-460X"},"institutions":[{"id":"https://openalex.org/I197347611","display_name":"Korea University","ror":"https://ror.org/047dqcg40","country_code":"KR","type":"education","lineage":["https://openalex.org/I197347611"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"None Sang-Hoon Lee","raw_affiliation_strings":["Department of Biomedical Engineering, College of Health Science, Korea University,Seoul,Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, College of Health Science, Korea University,Seoul,Republic of Korea","institution_ids":["https://openalex.org/I197347611"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":0,"max":64},"biblio":{"volume":null,"issue":null,"first_page":"4482","last_page":"4484"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10581","display_name":"Neural dynamics and brain function","score":0.991,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10660","display_name":"Conducting polymers and applications","score":0.9892,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[],"concepts":[{"id":"https://openalex.org/C2780965675","wikidata":"https://www.wikidata.org/wiki/Q145958","display_name":"Polyimide","level":3,"score":0.9093194},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.8492056},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.81687135},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.80980694},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5899651},{"id":"https://openalex.org/C111670793","wikidata":"https://www.wikidata.org/wiki/Q16979465","display_name":"Microelectrode","level":3,"score":0.51690793},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.51083845},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.50135875},{"id":"https://openalex.org/C13355873","wikidata":"https://www.wikidata.org/wiki/Q2920850","display_name":"Connection (principal bundle)","level":2,"score":0.5011928},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.45310116},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.43721306},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.32055312},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.15318471},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.12432665},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08729261},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.06470999},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0}],"mesh":[{"descriptor_ui":"D001921","descriptor_name":"Brain","qualifier_ui":"Q000502","qualifier_name":"physiology","is_major_topic":true},{"descriptor_ui":"D004567","descriptor_name":"Electrodes, Implanted","qualifier_ui":"","qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D004569","descriptor_name":"Electroencephalography","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":true},{"descriptor_ui":"D004581","descriptor_name":"Electronics","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":true},{"descriptor_ui":"D012117","descriptor_name":"Resins, Synthetic","qualifier_ui":"Q000737","qualifier_name":"chemistry","is_major_topic":true},{"descriptor_ui":"D000818","descriptor_name":"Animals","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D001921","descriptor_name":"Brain","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004553","descriptor_name":"Electric Conductivity","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004569","descriptor_name":"Electroencephalography","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004581","descriptor_name":"Electronics","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D019544","descriptor_name":"Equipment Failure Analysis","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D051381","descriptor_name":"Rats","qualifier_ui":"","qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D012117","descriptor_name":"Resins, Synthetic","qualifier_ui":"","qualifier_name":null,"is_major_topic":false}],"locations_count":2,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/embc.2012.6346962","pdf_url":null,"source":{"id":"https://openalex.org/S4393918560","display_name":"Annual International Conference of the IEEE Engineering in Medicine and Biology Society","issn_l":"2375-7477","issn":["2375-7477"],"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},{"is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/23366923","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":["National Institutes of Health"],"type":"repository"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":8,"referenced_works":["https://openalex.org/W1990283232","https://openalex.org/W2001840503","https://openalex.org/W2007495909","https://openalex.org/W2090257483","https://openalex.org/W2144030012","https://openalex.org/W2154488179","https://openalex.org/W2161828159","https://openalex.org/W2204802825"],"related_works":["https://openalex.org/W4214695150","https://openalex.org/W2916874140","https://openalex.org/W2162543021","https://openalex.org/W2071100647","https://openalex.org/W2061896995","https://openalex.org/W2017123568","https://openalex.org/W2016920325","https://openalex.org/W1970751963","https://openalex.org/W1970327753","https://openalex.org/W1969782859"],"abstract_inverted_index":{"We":[0],"propose":[1],"a":[2,7,23,35,59,113],"novel":[3],"packaging":[4],"method":[5],"of":[6,17,29,50,58,72,106,112],"thin":[8,30,81],"polyimide":[9,18],"multichannel":[10],"microelectrode.":[11],"For":[12,55],"the":[13,26,41,44,51,56,63,69,73,89,95,103,110],"simple":[14],"electrical":[15,70],"connection":[16],"(PI)":[19],"electrodes,":[20,32],"we":[21,93],"made":[22],"via-hole":[24,42],"at":[25],"interconnection":[27],"pads":[28],"PI":[31,82],"and":[33,47,68,86,92],"constructed":[34],"Ni":[36,61],"ring":[37],"by":[38,88],"electroplating":[39,64],"through":[40],"for":[43,102],"stable":[45],"soldering":[46],"strong":[48],"adhesion":[49],"electrode":[52,75,83,101],"to":[53],"PCB.":[54],"construction":[57],"well-organized":[60],"ring,":[62],"condition":[65],"was":[66,76,84],"optimized,":[67],"property":[71],"packaged":[74,87,100],"evaluated.":[77],"A":[78],"40":[79],"channel":[80],"fabricated":[85],"proposed":[90],"method,":[91],"performed":[94],"animal":[96],"experiment":[97],"with":[98],"this":[99],"high-resolution":[104],"recording":[105],"neural":[107],"signals":[108],"from":[109],"skull":[111],"rat.":[114]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2035258971","counts_by_year":[],"updated_date":"2024-12-07T07:21:52.012522","created_date":"2016-06-24"}