乐胖代购免代理版

{"id":"https://openalex.org/W4393141064","doi":"https://doi.org/10.1109/asp-dac58780.2024.10473921","title":"O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs","display_name":"O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs","publication_year":2024,"publication_date":"2024-01-22","ids":{"openalex":"https://openalex.org/W4393141064","doi":"https://doi.org/10.1109/asp-dac58780.2024.10473921"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/asp-dac58780.2024.10473921","pdf_url":null,"source":{"id":"https://openalex.org/S4363608500","display_name":"2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5066750673","display_name":"Xingyu Tong","orcid":"https://orcid.org/0000-0001-9057-9172"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xingyu Tong","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087812675","display_name":"Zhijie Cai","orcid":"https://orcid.org/0009-0001-9035-9599"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhijie Cai","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002478857","display_name":"Peng Zou","orcid":"https://orcid.org/0000-0002-8345-0976"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peng Zou","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101651927","display_name":"Min Wei","orcid":"https://orcid.org/0000-0002-1444-4281"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Min Wei","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100717421","display_name":"Wen Yuan","orcid":"https://orcid.org/0000-0003-0033-242X"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuan Wen","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101664594","display_name":"Zhifeng Lin","orcid":"https://orcid.org/0000-0002-4597-4322"},"institutions":[{"id":"https://openalex.org/I80947539","display_name":"Fuzhou University","ror":"https://ror.org/011xvna82","country_code":"CN","type":"education","lineage":["https://openalex.org/I80947539"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhifeng Lin","raw_affiliation_strings":["Fuzhou University,Center for Discrete Mathematics and Theoretical Computer Science,Fuzhou,China"],"affiliations":[{"raw_affiliation_string":"Fuzhou University,Center for Discrete Mathematics and Theoretical Computer Science,Fuzhou,China","institution_ids":["https://openalex.org/I80947539"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5045009372","display_name":"Jianli Chen","orcid":"https://orcid.org/0000-0001-5405-8441"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianli Chen","raw_affiliation_strings":["Fudan University,State Key Lab of ASIC & System,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Lab of ASIC & System,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":0,"max":84},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9943,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9935,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[],"concepts":[{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.7764791},{"id":"https://openalex.org/C2779304628","wikidata":"https://www.wikidata.org/wiki/Q3503480","display_name":"Face (sociological concept)","level":2,"score":0.7420953},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3926081},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.32598284},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22505465},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.07905051},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.064956486},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/asp-dac58780.2024.10473921","pdf_url":null,"source":{"id":"https://openalex.org/S4363608500","display_name":"2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[{"funder":"https://openalex.org/F4320337504","funder_display_name":"Research and Development","award_id":null}],"datasets":[],"versions":[],"referenced_works_count":16,"referenced_works":["https://openalex.org/W1967661769","https://openalex.org/W1985292881","https://openalex.org/W1994791325","https://openalex.org/W2020461489","https://openalex.org/W2063770779","https://openalex.org/W2078174680","https://openalex.org/W2134512360","https://openalex.org/W2157224208","https://openalex.org/W2167190617","https://openalex.org/W2284397099","https://openalex.org/W2792423839","https://openalex.org/W2907052475","https://openalex.org/W3111761932","https://openalex.org/W3136387861","https://openalex.org/W4205456620","https://openalex.org/W4236269389"],"related_works":["https://openalex.org/W3199170188","https://openalex.org/W2748952813","https://openalex.org/W2629813803","https://openalex.org/W2469843853","https://openalex.org/W2372289614","https://openalex.org/W2362738566","https://openalex.org/W2360137025","https://openalex.org/W2250518232","https://openalex.org/W2042913821","https://openalex.org/W2041067810"],"abstract_inverted_index":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W4393141064","counts_by_year":[],"updated_date":"2024-12-07T22:41:35.332384","created_date":"2024-03-26"}