乐胖代购免代理版

{"id":"https://openalex.org/W1967323073","doi":"https://doi.org/10.1109/92.555984","title":"Yield improvement of a large area magnetic field sensor array using redundancy schemes","display_name":"Yield improvement of a large area magnetic field sensor array using redundancy schemes","publication_year":1997,"publication_date":"1997-03-01","ids":{"openalex":"https://openalex.org/W1967323073","doi":"https://doi.org/10.1109/92.555984","mag":"1967323073"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/92.555984","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037207511","display_name":"Yves Audet","orcid":"https://orcid.org/0000-0002-2581-4479"},"institutions":[{"id":"https://openalex.org/I18014758","display_name":"Simon Fraser University","ror":"https://ror.org/0213rcc28","country_code":"CA","type":"education","lineage":["https://openalex.org/I18014758"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Y. Audet","raw_affiliation_strings":["Sch. of Eng. Sci., Simon Fraser Univ. Burnaby, BC, Canada"],"affiliations":[{"raw_affiliation_string":"Sch. of Eng. Sci., Simon Fraser Univ. Burnaby, BC, Canada","institution_ids":["https://openalex.org/I18014758"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061097022","display_name":"Glenn H. Chapman","orcid":"https://orcid.org/0000-0002-2486-2954"},"institutions":[{"id":"https://openalex.org/I18014758","display_name":"Simon Fraser University","ror":"https://ror.org/0213rcc28","country_code":"CA","type":"education","lineage":["https://openalex.org/I18014758"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"G.H. Chapman","raw_affiliation_strings":["Simon Fraser University, Burnaby, B.C., CANADA#TAB#"],"affiliations":[{"raw_affiliation_string":"Simon Fraser University, Burnaby, B.C., CANADA#TAB#","institution_ids":["https://openalex.org/I18014758"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.984,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":4,"citation_normalized_percentile":{"value":0.658723,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":69,"max":71},"biblio":{"volume":"5","issue":"1","first_page":"28","last_page":"33"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.991,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.991,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9539,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12692","display_name":"Magnetic Field Sensors Techniques","score":0.952,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness","score":0.61883104},{"id":"https://openalex.org/keywords/triple-modular-redundancy","display_name":"Triple modular redundancy","score":0.42105937}],"concepts":[{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.8364115},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.61883104},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5518023},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.54762757},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5286848},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5139455},{"id":"https://openalex.org/C187691185","wikidata":"https://www.wikidata.org/wiki/Q2020720","display_name":"Grid","level":2,"score":0.47709566},{"id":"https://openalex.org/C24590314","wikidata":"https://www.wikidata.org/wiki/Q336038","display_name":"Wireless sensor network","level":2,"score":0.44605875},{"id":"https://openalex.org/C196371267","wikidata":"https://www.wikidata.org/wiki/Q3998979","display_name":"Triple modular redundancy","level":3,"score":0.42105937},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.39665917},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3135265},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09386575},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/92.555984","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.4,"id":"https://metadata.un.org/sdg/9"}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":10,"referenced_works":["https://openalex.org/W1973034367","https://openalex.org/W2027095728","https://openalex.org/W2097743133","https://openalex.org/W2100777869","https://openalex.org/W2125622533","https://openalex.org/W2153835435","https://openalex.org/W2231973936","https://openalex.org/W2464719301","https://openalex.org/W4285719527","https://openalex.org/W8270539"],"related_works":["https://openalex.org/W58658798","https://openalex.org/W4210531477","https://openalex.org/W3206195470","https://openalex.org/W3114375939","https://openalex.org/W3008821054","https://openalex.org/W2759696718","https://openalex.org/W2603119174","https://openalex.org/W2491217195","https://openalex.org/W2359816675","https://openalex.org/W2057601146"],"abstract_inverted_index":{"The":[0,54],"circuit":[1],"design":[2,55],"of":[3,32,84,93,96],"a":[4,34,43,80],"large":[5,35],"area":[6],"magnetic":[7,21,85],"field":[8,22,86],"sensor":[9,26,36,65,87,99],"array":[10],"(LAMSA)":[11],"is":[12,16,49,103],"described.":[13],"This":[14],"prototype":[15],"developed":[17],"for":[18,51,63,71],"applications":[19],"in":[20],"mapping":[23],"and":[24,42,67],"tactile":[25],"arrays.":[27],"To":[28],"enable":[29],"the":[30,64,72,94,97],"production":[31],"such":[33],"system,":[37],"redundancy":[38,61,69,101],"schemes":[39,62,70,102],"are":[40,89],"implemented":[41],"laser":[44,81],"interconnection":[45],"post":[46],"fabrication":[47],"technique":[48],"used":[50],"fault":[52],"repairs.":[53],"restructurable":[56,82],"capabilities":[57],"rely":[58],"on":[59,79],"local":[60,98],"grid":[66,100],"global":[68],"surrounding":[73],"control":[74],"circuits.":[75],"Experimental":[76],"results":[77],"obtained":[78],"subarray":[83],"cells":[88],"shown.":[90],"A":[91],"study":[92],"robustness":[95],"presented.":[104]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W1967323073","counts_by_year":[],"updated_date":"2025-01-17T20:31:24.183029","created_date":"2016-06-24"}