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{"id":"https://openalex.org/W2099689109","doi":"https://doi.org/10.1109/54.706038","title":"Testing the 500-MHz IBM S/390 microprocessor","display_name":"Testing the 500-MHz IBM S/390 microprocessor","publication_year":1998,"publication_date":"1998-01-01","ids":{"openalex":"https://openalex.org/W2099689109","doi":"https://doi.org/10.1109/54.706038","mag":"2099689109"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/54.706038","pdf_url":null,"source":{"id":"https://openalex.org/S73404582","display_name":"IEEE Design & Test of Computers","issn_l":"0740-7475","issn":["0740-7475","1558-1918"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068051164","display_name":"T.G. Foote","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T.G. Foote","raw_affiliation_strings":["IBM, USA"],"affiliations":[{"raw_affiliation_string":"IBM, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077076596","display_name":"D. E. Hoffman","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D.E. Hoffman","raw_affiliation_strings":["IBM, USA"],"affiliations":[{"raw_affiliation_string":"IBM, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010780592","display_name":"W. Huott","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W.V. Huott","raw_affiliation_strings":["IBM, USA"],"affiliations":[{"raw_affiliation_string":"IBM, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057864560","display_name":"T.J. Koprowski","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T.J. Koprowski","raw_affiliation_strings":["IBM, USA"],"affiliations":[{"raw_affiliation_string":"IBM, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006912711","display_name":"M.P. Kusko","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M.P. Kusko","raw_affiliation_strings":["IBM, USA"],"affiliations":[{"raw_affiliation_string":"IBM, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5031620244","display_name":"Bryan Robbins","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B.J. Robbins","raw_affiliation_strings":["IBM, USA"],"affiliations":[{"raw_affiliation_string":"IBM, USA","institution_ids":["https://openalex.org/I1341412227"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":9,"citation_normalized_percentile":{"value":0.683573,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":77,"max":78},"biblio":{"volume":"15","issue":"3","first_page":"83","last_page":"89"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9977,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ibm","display_name":"IBM","score":0.83401215},{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.7928633},{"id":"https://openalex.org/keywords/system-testing","display_name":"System testing","score":0.5623643},{"id":"https://openalex.org/keywords/design-for-testing","display_name":"Design for testing","score":0.43163425}],"concepts":[{"id":"https://openalex.org/C70388272","wikidata":"https://www.wikidata.org/wiki/Q5968558","display_name":"IBM","level":2,"score":0.83401215},{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.7928633},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.60304296},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5765864},{"id":"https://openalex.org/C7166840","wikidata":"https://www.wikidata.org/wiki/Q1199682","display_name":"System testing","level":2,"score":0.5623643},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.55619407},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.52217937},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5140523},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.4680419},{"id":"https://openalex.org/C190874656","wikidata":"https://www.wikidata.org/wiki/Q5264347","display_name":"Design for testing","level":3,"score":0.43163425},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.36267576},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.35690382},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.19348976},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.11174032},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11120105},{"id":"https://openalex.org/C51234621","wikidata":"https://www.wikidata.org/wiki/Q2149495","display_name":"Testability","level":2,"score":0.07466933},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/54.706038","pdf_url":null,"source":{"id":"https://openalex.org/S73404582","display_name":"IEEE Design & Test of Computers","issn_l":"0740-7475","issn":["0740-7475","1558-1918"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.56,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":14,"referenced_works":["https://openalex.org/W1771482969","https://openalex.org/W1874606348","https://openalex.org/W197391467","https://openalex.org/W1991035950","https://openalex.org/W2004437077","https://openalex.org/W2008350596","https://openalex.org/W2012336463","https://openalex.org/W2053187675","https://openalex.org/W2074193689","https://openalex.org/W2101638246","https://openalex.org/W2137045371","https://openalex.org/W2145064068","https://openalex.org/W2167966952","https://openalex.org/W2247151005"],"related_works":["https://openalex.org/W2537171119","https://openalex.org/W2384601745","https://openalex.org/W2367495590","https://openalex.org/W2362119228","https://openalex.org/W2360400548","https://openalex.org/W2172250424","https://openalex.org/W2106258585","https://openalex.org/W2048370503","https://openalex.org/W2036499758","https://openalex.org/W1978339999"],"abstract_inverted_index":{"The":[0],"design-for-test":[1],"framework":[2],"of":[3,17,23],"the":[4,14,24],"500-MHz":[5],"CMOS":[6],"central":[7],"processor":[8],"uses":[9],"specific":[10],"tests":[11],"to":[12],"ensure":[13],"highest":[15],"reliability":[16],"components":[18],"within":[19],"a":[20],"system.":[21],"Some":[22],"same":[25],"test":[26],"patterns":[27],"are":[28],"applied":[29],"in":[30],"chip":[31],"manufacturing":[32],"and":[33],"system-level":[34],"tests.":[35]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2099689109","counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2025-01-04T21:06:52.502108","created_date":"2016-06-24"}