乐胖代购免代理版

{"id":"https://openalex.org/W2625720003","doi":"https://doi.org/10.1016/j.microrel.2017.06.001","title":"Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications","display_name":"Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications","publication_year":2017,"publication_date":"2017-06-17","ids":{"openalex":"https://openalex.org/W2625720003","doi":"https://doi.org/10.1016/j.microrel.2017.06.001","mag":"2625720003"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2017.06.001","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://hal.science/hal-01541230/document","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041647830","display_name":"A. Ben Kabaar","orcid":null},"institutions":[{"id":"https://openalex.org/I4210094574","display_name":"Science et Ing\u00e9nierie des Mat\u00e9riaux et Proc\u00e9d\u00e9s","ror":"https://ror.org/00m7zca23","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210094574","https://openalex.org/I4210128300","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A. Ben Kabaar","raw_affiliation_strings":["SIMaP - Science et Ing\u00e9nierie des Mat\u00e9riaux et Proc\u00e9d\u00e9s (1130 rue de la Piscine, BP 75 38402 Saint Martin D'H\u00e8res - France)"],"affiliations":[{"raw_affiliation_string":"SIMaP - Science et Ing\u00e9nierie des Mat\u00e9riaux et Proc\u00e9d\u00e9s (1130 rue de la Piscine, BP 75 38402 Saint Martin D'H\u00e8res - France)","institution_ids":["https://openalex.org/I4210094574"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000833132","display_name":"Cyril Buttay","orcid":"https://orcid.org/0000-0001-7140-5804"},"institutions":[{"id":"https://openalex.org/I4210145913","display_name":"Laboratoire Amp\u00e8re","ror":"https://ror.org/04xbczw40","country_code":"FR","type":"facility","lineage":["https://openalex.org/I100532134","https://openalex.org/I112936343","https://openalex.org/I1294671590","https://openalex.org/I203339264","https://openalex.org/I4210095849","https://openalex.org/I4210145913","https://openalex.org/I48430043"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"C. Buttay","raw_affiliation_strings":["EE - Amp\u00e8re, D\u00e9partement Energie Electrique (France)"],"affiliations":[{"raw_affiliation_string":"EE - Amp\u00e8re, D\u00e9partement Energie Electrique (France)","institution_ids":["https://openalex.org/I4210145913"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039079552","display_name":"Olivier Dezellus","orcid":"https://orcid.org/0000-0002-1570-4591"},"institutions":[{"id":"https://openalex.org/I4210126479","display_name":"Laboratoire des Multimat\u00e9riaux et Interfaces","ror":"https://ror.org/03cfem402","country_code":"FR","type":"facility","lineage":["https://openalex.org/I100532134","https://openalex.org/I1294671590","https://openalex.org/I203339264","https://openalex.org/I4210126479","https://openalex.org/I4210128300"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"O. Dezellus","raw_affiliation_strings":["LMI - Laboratoire des Multimat\u00e9riaux et Interfaces (bat. 731 43 Bvd du 11 Novembre 1918 69622 VILLEURBANNE CEDEX, puis \r\n\u00e0 partir de juillet 2017 : B\u00e2timent Chevreul 6 rue Victor Grignard 69622 Villeurbanne CEDEX - France)"],"affiliations":[{"raw_affiliation_string":"LMI - Laboratoire des Multimat\u00e9riaux et Interfaces (bat. 731 43 Bvd du 11 Novembre 1918 69622 VILLEURBANNE CEDEX, puis \r\n\u00e0 partir de juillet 2017 : B\u00e2timent Chevreul 6 rue Victor Grignard 69622 Villeurbanne CEDEX - France)","institution_ids":["https://openalex.org/I4210126479"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109277522","display_name":"Rafa\u00ebl Estevez","orcid":"https://orcid.org/0000-0001-5036-6420"},"institutions":[{"id":"https://openalex.org/I4210094574","display_name":"Science et Ing\u00e9nierie des Mat\u00e9riaux et Proc\u00e9d\u00e9s","ror":"https://ror.org/00m7zca23","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210094574","https://openalex.org/I4210128300","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"R. Estevez","raw_affiliation_strings":["SIMaP - Science et Ing\u00e9nierie des Mat\u00e9riaux et Proc\u00e9d\u00e9s (1130 rue de la Piscine, BP 75 38402 Saint Martin D'H\u00e8res - France)"],"affiliations":[{"raw_affiliation_string":"SIMaP - Science et Ing\u00e9nierie des Mat\u00e9riaux et Proc\u00e9d\u00e9s (1130 rue de la Piscine, BP 75 38402 Saint Martin D'H\u00e8res - France)","institution_ids":["https://openalex.org/I4210094574"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076439968","display_name":"Anthony Gravouil","orcid":"https://orcid.org/0000-0002-5967-8452"},"institutions":[{"id":"https://openalex.org/I4210165513","display_name":"Laboratoire de M\u00e9canique des Contacts et des Structures","ror":"https://ror.org/05s608j53","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I203339264","https://openalex.org/I4210095849","https://openalex.org/I4210165513","https://openalex.org/I48430043"]},{"id":"https://openalex.org/I203339264","display_name":"Universit\u00e9 de Lyon","ror":"https://ror.org/01rk35k63","country_code":"FR","type":"education","lineage":["https://openalex.org/I203339264"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"A. Gravouil","raw_affiliation_strings":["LaMCoS - Laboratoire de M\u00e9canique des Contacts et des Structures [Villeurbanne] (B\u00e2timent Sophie Germain\r\n27b, avenue Jean Capelle\r\nF69621 VILLEURBANNE CEDEX - France)"],"affiliations":[{"raw_affiliation_string":"LaMCoS - Laboratoire de M\u00e9canique des Contacts et des Structures [Villeurbanne] (B\u00e2timent Sophie Germain\r\n27b, avenue Jean Capelle\r\nF69621 VILLEURBANNE CEDEX - France)","institution_ids":["https://openalex.org/I4210165513","https://openalex.org/I203339264"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037479941","display_name":"Laurent Gr\u00e9millard","orcid":"https://orcid.org/0000-0001-7258-6483"},"institutions":[{"id":"https://openalex.org/I4210111246","display_name":"Mat\u00e9riaux Ing\u00e9nierie et Science","ror":"https://ror.org/01rnfhz46","country_code":"FR","type":"facility","lineage":["https://openalex.org/I100532134","https://openalex.org/I1294671590","https://openalex.org/I203339264","https://openalex.org/I4210095849","https://openalex.org/I4210111246","https://openalex.org/I48430043"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"L. Gremillard","raw_affiliation_strings":["MATEIS - Mat\u00e9riaux, ing\u00e9nierie et science [Villeurbanne] (B\u00e2timent Blaise Pascal 7, avenue Jean Capelle 69621 VILLEURBANNE CEDEX - France)"],"affiliations":[{"raw_affiliation_string":"MATEIS - Mat\u00e9riaux, ing\u00e9nierie et science [Villeurbanne] (B\u00e2timent Blaise Pascal 7, avenue Jean Capelle 69621 VILLEURBANNE CEDEX - France)","institution_ids":["https://openalex.org/I4210111246"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2190,"currency":"USD","value_usd":2190,"provenance":"doaj"},"apc_paid":null,"fwci":1.205,"has_fulltext":true,"fulltext_origin":"pdf","cited_by_count":13,"citation_normalized_percentile":{"value":0.653783,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":88},"biblio":{"volume":"79","issue":null,"first_page":"288","last_page":"296"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9965,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9965,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9942,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9932,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dbc","display_name":"dBc","score":0.78622985},{"id":"https://openalex.org/keywords/power-electronics","display_name":"Power Electronics","score":0.5457806},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization","score":0.5192559},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.51036257},{"id":"https://openalex.org/keywords/thermal-grease","display_name":"Thermal grease","score":0.44523978}],"concepts":[{"id":"https://openalex.org/C193523891","wikidata":"https://www.wikidata.org/wiki/Q1771950","display_name":"dBc","level":3,"score":0.78622985},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.6590028},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6403271},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6402988},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6317363},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.6174277},{"id":"https://openalex.org/C178911571","wikidata":"https://www.wikidata.org/wiki/Q593143","display_name":"Power electronics","level":3,"score":0.5457806},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.5192559},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.51036257},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4650183},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4553275},{"id":"https://openalex.org/C200657195","wikidata":"https://www.wikidata.org/wiki/Q868947","display_name":"Thermal grease","level":3,"score":0.44523978},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.41476065},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.35351694},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3298406},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.31784403},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2917214},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.26898342},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25181282},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.24759638},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22729897},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.16968313},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.12848124},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0662303},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2017.06.001","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},{"is_oa":true,"landing_page_url":"https://hal.archives-ouvertes.fr/hal-01541230","pdf_url":"https://hal.science/hal-01541230/document","source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":["Centre National de la Recherche Scientifique"],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false},{"is_oa":true,"landing_page_url":"https://hal.archives-ouvertes.fr/hal-01541230/file/characterization_DBC.pdf","pdf_url":"https://hal.archives-ouvertes.fr/hal-01541230/file/characterization_DBC.pdf","source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":["Centre National de la Recherche Scientifique"],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false},{"is_oa":true,"landing_page_url":"https://hal.archives-ouvertes.fr/hal-01541230/document","pdf_url":"https://hal.archives-ouvertes.fr/hal-01541230/document","source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":["Centre National de la Recherche Scientifique"],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false}],"best_oa_location":{"is_oa":true,"landing_page_url":"https://hal.archives-ouvertes.fr/hal-01541230","pdf_url":"https://hal.science/hal-01541230/document","source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":["Centre National de la Recherche Scientifique"],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false},"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":23,"referenced_works":["https://openalex.org/W1494997083","https://openalex.org/W1570213400","https://openalex.org/W1596465161","https://openalex.org/W1932960495","https://openalex.org/W1966352650","https://openalex.org/W1975029570","https://openalex.org/W1977935079","https://openalex.org/W1981508355","https://openalex.org/W2009217288","https://openalex.org/W2040337468","https://openalex.org/W2045760679","https://openalex.org/W2054270308","https://openalex.org/W2054595416","https://openalex.org/W2066247523","https://openalex.org/W2087104684","https://openalex.org/W2089092903","https://openalex.org/W2108991092","https://openalex.org/W2150763729","https://openalex.org/W2187562967","https://openalex.org/W2726748740","https://openalex.org/W560918766","https://openalex.org/W626773769","https://openalex.org/W64102315"],"related_works":["https://openalex.org/W4384158500","https://openalex.org/W2743625874","https://openalex.org/W272184114","https://openalex.org/W2492373545","https://openalex.org/W2384590505","https://openalex.org/W2371970260","https://openalex.org/W2344811745","https://openalex.org/W2228554074","https://openalex.org/W2119646490","https://openalex.org/W1491333300"],"abstract_inverted_index":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2625720003","counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":3}],"updated_date":"2024-12-24T11:27:08.192105","created_date":"2017-06-23"}