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{"id":"https://openalex.org/W2073642904","doi":"https://doi.org/10.1016/j.microrel.2007.10.005","title":"Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings","display_name":"Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings","publication_year":2007,"publication_date":"2007-12-13","ids":{"openalex":"https://openalex.org/W2073642904","doi":"https://doi.org/10.1016/j.microrel.2007.10.005","mag":"2073642904"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2007.10.005","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072682902","display_name":"Young Woo Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I124633538","display_name":"University of Seoul","ror":"https://ror.org/05en5nh73","country_code":"KR","type":"education","lineage":["https://openalex.org/I124633538"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Young Woo Lee","raw_affiliation_strings":["Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Republic of Korea","institution_ids":["https://openalex.org/I124633538"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068681043","display_name":"Ki Ju Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I124633538","display_name":"University of Seoul","ror":"https://ror.org/05en5nh73","country_code":"KR","type":"education","lineage":["https://openalex.org/I124633538"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ki Ju Lee","raw_affiliation_strings":["Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Republic of Korea","institution_ids":["https://openalex.org/I124633538"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012041302","display_name":"Y. Zhou","orcid":"https://orcid.org/0000-0003-2886-0259"},"institutions":[{"id":"https://openalex.org/I151746483","display_name":"University of Waterloo","ror":"https://ror.org/01aff2v68","country_code":"CA","type":"education","lineage":["https://openalex.org/I151746483"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Y. Norman Zhou","raw_affiliation_strings":["Department of Mechanical Engineering, University of Waterloo, Waterloo, Canada N2L 3G1"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Waterloo, Waterloo, Canada N2L 3G1","institution_ids":["https://openalex.org/I151746483"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5007458581","display_name":"Jae Pil Jung","orcid":"https://orcid.org/0000-0002-4526-0442"},"institutions":[{"id":"https://openalex.org/I124633538","display_name":"University of Seoul","ror":"https://ror.org/05en5nh73","country_code":"KR","type":"education","lineage":["https://openalex.org/I124633538"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jae Pil Jung","raw_affiliation_strings":["Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Republic of Korea","institution_ids":["https://openalex.org/I124633538"]}]}],"institution_assertions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2190,"currency":"USD","value_usd":2190,"provenance":"doaj"},"apc_paid":null,"fwci":0.866,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":8,"citation_normalized_percentile":{"value":0.739644,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":81,"max":82},"biblio":{"volume":"48","issue":"4","first_page":"631","last_page":"637"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11100","display_name":"Intermetallics and Advanced Alloy Properties","score":0.9907,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12435","display_name":"Bladed Disk Vibration Dynamics","score":0.9753,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-shock","display_name":"Thermal shock","score":0.7849284},{"id":"https://openalex.org/keywords/solder-paste","display_name":"Solder paste","score":0.5896155},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.42235503}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.90125024},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7949996},{"id":"https://openalex.org/C176177977","wikidata":"https://www.wikidata.org/wiki/Q960836","display_name":"Thermal shock","level":2,"score":0.7849284},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.752115},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.6673626},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5984403},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.5896155},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.55722445},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.54162836},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.5184588},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.47112226},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.42235503},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.39720386},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.2769607},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.10629335},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.05774963},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2007.10.005","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":13,"referenced_works":["https://openalex.org/W1485283179","https://openalex.org/W1595705577","https://openalex.org/W2000044955","https://openalex.org/W2020537769","https://openalex.org/W2032830807","https://openalex.org/W2037583230","https://openalex.org/W2048190553","https://openalex.org/W2068117431","https://openalex.org/W2070963527","https://openalex.org/W2072174639","https://openalex.org/W2169489122","https://openalex.org/W4244197153","https://openalex.org/W647798093"],"related_works":["https://openalex.org/W2771277520","https://openalex.org/W2374831160","https://openalex.org/W2166014898","https://openalex.org/W2163843603","https://openalex.org/W2143764895","https://openalex.org/W2028318618","https://openalex.org/W2023616436","https://openalex.org/W1986854664","https://openalex.org/W1969518379","https://openalex.org/W1563574292"],"abstract_inverted_index":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2073642904","counts_by_year":[{"year":2019,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2024-12-13T06:41:20.677843","created_date":"2016-06-24"}