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{"id":"https://openalex.org/W1983572344","doi":"https://doi.org/10.1016/j.mejo.2008.02.023","title":"Evaluating the effects of temperature gradients and currents nonuniformity in on-chip interconnects","display_name":"Evaluating the effects of temperature gradients and currents nonuniformity in on-chip interconnects","publication_year":2008,"publication_date":"2008-04-21","ids":{"openalex":"https://openalex.org/W1983572344","doi":"https://doi.org/10.1016/j.mejo.2008.02.023","mag":"1983572344"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mejo.2008.02.023","pdf_url":null,"source":{"id":"https://openalex.org/S4394736632","display_name":"Microelectronics Journal","issn_l":"0026-2692","issn":["0026-2692"],"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5075363404","display_name":"N. Spennagallo","orcid":null},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"funder","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"N. Spennagallo","raw_affiliation_strings":["Dipartimento di Elettronica e Informazione, Politecnico di Milano, P. zza Leonardo da Vinci 32, I-20133 Milano, Italy"],"affiliations":[{"raw_affiliation_string":"Dipartimento di Elettronica e Informazione, Politecnico di Milano, P. zza Leonardo da Vinci 32, I-20133 Milano, Italy","institution_ids":["https://openalex.org/I93860229"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040771349","display_name":"Lorenzo Codecasa","orcid":"https://orcid.org/0000-0002-2851-3698"},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"funder","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"L. Codecasa","raw_affiliation_strings":["Dipartimento di Elettronica e Informazione, Politecnico di Milano, P. zza Leonardo da Vinci 32, I-20133 Milano, Italy"],"affiliations":[{"raw_affiliation_string":"Dipartimento di Elettronica e Informazione, Politecnico di Milano, P. zza Leonardo da Vinci 32, I-20133 Milano, Italy","institution_ids":["https://openalex.org/I93860229"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075562150","display_name":"D. D\u2019Amore","orcid":"https://orcid.org/0000-0002-6348-3447"},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"funder","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"D. D\u2019Amore","raw_affiliation_strings":["Dipartimento di Elettronica e Informazione, Politecnico di Milano, P. zza Leonardo da Vinci 32, I-20133 Milano, Italy"],"affiliations":[{"raw_affiliation_string":"Dipartimento di Elettronica e Informazione, Politecnico di Milano, P. zza Leonardo da Vinci 32, I-20133 Milano, Italy","institution_ids":["https://openalex.org/I93860229"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027561141","display_name":"Paolo Maffezzoni","orcid":"https://orcid.org/0000-0001-9778-0039"},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"funder","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"P. Maffezzoni","raw_affiliation_strings":["Dipartimento di Elettronica e Informazione, Politecnico di Milano, P. zza Leonardo da Vinci 32, I-20133 Milano, Italy"],"affiliations":[{"raw_affiliation_string":"Dipartimento di Elettronica e Informazione, Politecnico di Milano, P. zza Leonardo da Vinci 32, I-20133 Milano, Italy","institution_ids":["https://openalex.org/I93860229"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":6,"citation_normalized_percentile":{"value":0.614494,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":80,"max":81},"biblio":{"volume":"40","issue":"7","first_page":"1154","last_page":"1159"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9999,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.8353685},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.64160216},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5889378},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.42374885},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.42105496},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.41938043},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.41900194},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.41553032},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4013601},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.35940763},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1203143},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.083740085},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mejo.2008.02.023","pdf_url":null,"source":{"id":"https://openalex.org/S4394736632","display_name":"Microelectronics Journal","issn_l":"0026-2692","issn":["0026-2692"],"is_oa":false,"is_in_doaj":false,"is_indexed_in_scopus":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[],"grants":[],"datasets":[],"versions":[],"referenced_works_count":18,"referenced_works":["https://openalex.org/W1486852605","https://openalex.org/W1593627329","https://openalex.org/W1678426069","https://openalex.org/W1986545147","https://openalex.org/W2053638873","https://openalex.org/W2103724541","https://openalex.org/W2108200999","https://openalex.org/W2111596650","https://openalex.org/W2117959878","https://openalex.org/W2120777464","https://openalex.org/W2132816157","https://openalex.org/W2133040214","https://openalex.org/W2133365606","https://openalex.org/W2140227009","https://openalex.org/W2147696805","https://openalex.org/W2299308819","https://openalex.org/W2535919346","https://openalex.org/W573619770"],"related_works":["https://openalex.org/W4252608911","https://openalex.org/W3163908127","https://openalex.org/W3147987719","https://openalex.org/W2907188494","https://openalex.org/W2698654916","https://openalex.org/W2599361292","https://openalex.org/W2389426768","https://openalex.org/W2184913151","https://openalex.org/W2155019192","https://openalex.org/W2018755015"],"abstract_inverted_index":{"The":[0,25,49,73],"paper":[1,74],"provides":[2],"a":[3,10,21,83],"compact":[4,51],"but":[5],"accurate":[6],"electro-thermal":[7,78],"model":[8,52],"of":[9,20,34],"long":[11,84],"wiring":[12,85],"on-chip":[13,86],"interconnect":[14,43,66,87],"embedded":[15],"in":[16,82,88],"the":[17,32,38,42,77,103],"complex":[18],"layout":[19],"ULSI":[22],"digital":[23],"circuit.":[24],"proposed":[26,50],"technique":[27],"takes":[28],"into":[29],"account":[30],"both":[31],"effect":[33],"temperature":[35],"gradients":[36],"over":[37],"chip":[39],"substrate":[40],"and":[41,69,97],"self-heating":[44],"due":[45],"to":[46,56],"current":[47,90],"flow.":[48],"is":[53,92,99],"well":[54],"suited":[55],"be":[57],"interfaced":[58],"with":[59],"commercially":[60],"available":[61],"CAD":[62],"tools":[63],"employed":[64],"for":[65],"parasitic":[67],"extraction":[68],"signal":[70],"integrity":[71],"verification.":[72],"also":[75],"investigates":[76],"effects":[79],"that":[80],"arise":[81],"which":[89],"flow":[91],"dominated":[93],"by":[94],"displacement":[95],"currents":[96],"thus":[98],"not":[100],"uniform":[101],"along":[102],"line.":[104]},"abstract_inverted_index_v3":null,"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W1983572344","counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":4}],"updated_date":"2025-03-29T04:21:54.718417","created_date":"2016-06-24"}