Thermal management of integrated circuit (IC) and system-in-package (SIP) has gained importance as the power density and requirement for IC design have increased and need exists to analyse the heat dissipation performance characteristics of IC under use. In this paper, the authors examine the thermal characteristics of materials of IC. The authors leverage Cloud Computing architecture to remotely compute the dissipation performance parameters. Understanding thermal dissipation performance, which explains the thermal management of IC, is important for chip performance, as well as power and energy consumption in a chip or SIP. Using architectural understanding of Software as a Service (SaaS), the authors develop an efficient, fast, and secure simulation technique by leveraging control volume method (CVM) of linearization of relevant equations. Three chips are kept in tandem to make it a multi-chip module (MCM) to realise it as a smaller and lighter package. The findings of the study are presented for different dimensions of chips inside the package.<\/p>","DOI":"10.4018\/ijcac.2011070102","type":"journal-article","created":{"date-parts":[[2011,10,19]],"date-time":"2011-10-19T16:07:30Z","timestamp":1319040450000},"page":"12-21","source":"Crossref","is-referenced-by-count":0,"title":["Cloud Computing Applied for Numerical Study of Thermal Characteristics of SIP"],"prefix":"10.4018","volume":"1","author":[{"given":"S. K.","family":"Maharana","sequence":"first","affiliation":[{"name":"MVJ College of Engineering, Bangalore, India"}]},{"given":"Praveen B.","family":"Mali","sequence":"additional","affiliation":[{"name":"MVJ College of Engineering, Bangalore, India"}]},{"given":"Ganesh","family":"Prabhakar","sequence":"additional","affiliation":[{"name":"MVJ College of Engineering, Bangalore, India"}]},{"given":"Sunil","family":"J","sequence":"additional","affiliation":[{"name":"MVJ College of Engineering, Bangalore, India"}]},{"given":"Vignesh","family":"Kumar","sequence":"additional","affiliation":[{"name":"MVJ College of Engineering, Bangalore, India"}]}],"member":"2432","reference":[{"issue":"1","key":"ijcac.2011070102-0","first-page":"32","article-title":"The many flavors of ball grid array packages.","volume":"8","author":"B.Guenin","year":"2002","journal-title":"Electronics Cooling"},{"key":"ijcac.2011070102-1","unstructured":"ITRS. (2010). International technology roadmap for semiconductors. Retrieved from http:\/\/public.itrs.net"},{"key":"ijcac.2011070102-2","author":"D.Keffler","year":"1999","journal-title":"Application and solution of heat equation in one and two dimensional systems using numerical methods"},{"key":"ijcac.2011070102-3","unstructured":"Khaund, B. (2009). Cloud Architecture-SaaS. Retrieved from http:\/\/www.codeproject.com\/KB\/webservices\/CloudSaaS.aspx"},{"key":"ijcac.2011070102-4","doi-asserted-by":"publisher","DOI":"10.1109\/95.477461"},{"key":"ijcac.2011070102-5","unstructured":"Zahn, B. (1998, March). Steady state thermal characterization of multiple output devices using linear superposition theory and a non-linear matrix multiplier. In Proceedings of the Fourteenth Annual Semiconductor Thermal Measurement and Management Symposium (pp. 39-46)."}],"container-title":["International Journal of Cloud Applications and Computing"],"original-title":[],"language":"ng","link":[{"URL":"https:\/\/www.igi-global.com\/viewtitle.aspx?TitleId=58058","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,1]],"date-time":"2022-06-01T21:59:57Z","timestamp":1654120797000},"score":1,"resource":{"primary":{"URL":"https:\/\/services.igi-global.com\/resolvedoi\/resolve.aspx?doi=10.4018\/ijcac.2011070102"}},"subtitle":[""],"short-title":[],"issued":{"date-parts":[[2011,7,1]]},"references-count":6,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2011,7]]}},"URL":"https:\/\/doi.org\/10.4018\/ijcac.2011070102","relation":{},"ISSN":["2156-1834","2156-1826"],"issn-type":[{"value":"2156-1834","type":"print"},{"value":"2156-1826","type":"electronic"}],"subject":[],"published":{"date-parts":[[2011,7,1]]}}}